Patent US5155904A successfully refreshed from Google Patents.
US5155904A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reflow and wave soldering techniques for bottom side components
Assignee: Hewlett Packard Development Co LP
•
Filing: 1991-04-03
•
Granted: 1992-10-20
•
Expires: 2011-04-03
Abstract
Abstract A soldering method is provided which includes applying a solder paste onto a pad for a surface-mount component on a bottom side of a printed circuit board, applying an adhesive to a surface-mount component receiving site on the bottom side of the board, placing a surface-mount component on the bottom side so as to contact the solder paste and adhesive, and reflowing the solder while curing the applied adhesive to affix the surface-mount component to the bottom side of the board. This method also includes disposing a through-hole component on the top side of the board and mass soldering the bottom side of the printed circuit board to join the through-hole component to the board.
Inventors
- 👤 Mohyeddin S. Majd
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:21
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3415; H05K2203/00; H05K2203/14; H05K2203/1476; H05K2203/15; H05K2203/1572; H05K3/303; H05K3/305; H05K3/3447; H05K3/3465; H05K3/3468; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/49144
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
158 words
A method of soldering a surface-mount component to a printed circuit board having a first and a second side, comprising the substantially sequential steps of: (a) screening a solder paste on a pad for a surface-mount component on said first side of said board; (b) applying an adhesive to a surface-mount component receiving site on the first side of the board; (c) placing a surface-mount component on said first side so as to contact said solder paste and said adhesive; (d) reflowing the solder and curing the applied adhesive, whereby said surface-mount component becomes electrically connected and mechanically affixed to said printed circuit board; (e) inverting the board; (f) disposing a through-hole component on said second side through a hole in said printed circuit board; and (g) mass soldering said first side of said circuit board by contacting said first side with a molten solder pool to join at least said through-hole component to said printed circuit board.
Claim 2
Independent Claim
158 words
A method of soldering a surface-mount component to a printed circuit board having a first and a second side, comprising the substantially sequential steps of: (a) screening a solder paste on a pad for a surface-mount component on said first side of said board; (b) applying an adhesive to a surface-mount component receiving site on the first side of the board; (c) placing a surface-mount component on said first side so as to contact said solder paste and said adhesive; (d) reflowing the solder and curing the applied adhesive, whereby said surface-mount component becomes electrically connected and mechanically affixed to said printed circuit board; (e) inverting the board; (f) disposing a through-hole component on said second side through a hole in said printed circuit board; and (g) mass soldering said first side of said circuit board by contacting said first side with a molten solder pool to join at least said through-hole component to said printed circuit board.
Claim 3
Dependent Claim
25 words
The method of claim 1, wherein said screening step (a) comprises silk screening a Sn-Pb solder paste onto a plurality of surface-mount component solder pads.
Claim 4
Dependent Claim
15 words
The method of claim 2, wherein said plurality of solder pads are pre-tinned with solder.
Claim 5
Dependent Claim
25 words
The method of claim 3, wherein said pre-tinned solder pads are located on both said first and said second sides of said printed circuit board.
Claim 6
Dependent Claim
15 words
The method of claim 1, wherein said applying step (b) includes automatically dispensing said adhesive.
Claim 7
Dependent Claim
16 words
The method of claim 5, wherein said automatic dispensing step includes applying a heat-curable epoxy-based adhesive.
Claim 8
Dependent Claim
15 words
The method of claim 5, wherein said automatic dispensing step includes applying a UV-curable adhesive.
Claim 9
Dependent Claim
22 words
The method of claim 1, wherein said placing step (c) comprises machine placing a plurality of surface-mount components on said first side.
Claim 10
Dependent Claim
21 words
The method of claim 1, wherein said reflowing and curing step (d) comprises substantially consecutive reflow soldering and adhesive curing operations.
Claim 11
Dependent Claim
71 words
The method of claim 1, further comprising after said inverting step (e): screening a solder paste on a pad for a second surface-mount component on said second side of said board; placing a second surface-mount component on said second side so as to contact said solder paste; and reflowing the solder on said second side, whereby said second surface-mount component on said second side becomes soldered to said printed circuit board.
Claim 12
Independent Claim
132 words
A method of soldering a printed circuit board having a top and bottom side, wherein a surface-mount component is adhered to the bottom side of said circuit board by an adhesive and a solder and said bottom side is wave soldered to join a through-hole component to said top side of said printed circuit board, wherein said method further comprises: applying a solder paste to a pad for a surface-mount component and a heat-curable adhesive to a surface-mount component receiving site on said bottom side of said circuit board so as to contact said surface-mount component when said surface-mount component is placed; and heating said printed circuit board to substantially simultaneously: cure said adhesive, and reflow said solder, whereby said surface-mount component becomes electrically and mechanically attached to said printed circuit board.
Claim 13
Independent Claim
132 words
A method of soldering a printed circuit board having a top and bottom side, wherein a surface-mount component is adhered to the bottom side of said circuit board by an adhesive and a solder and said bottom side is wave soldered to join a through-hole component to said top side of said printed circuit board, wherein said method further comprises: applying a solder paste to a pad for a surface-mount component and a heat-curable adhesive to a surface-mount component receiving site on said bottom side of said circuit board so as to contact said surface-mount component when said surface-mount component is placed; and heating said printed circuit board to substantially simultaneously: cure said adhesive, and reflow said solder, whereby said surface-mount component becomes electrically and mechanically attached to said printed circuit board.
Claim 14
Dependent Claim
44 words
A method of claim 11, wherein said applying step includes dispensing a Sn-Pb solder paste to a plurality of pre-tinned solder pads for said surface-mount component and an epoxy-based adhesive to said surface-mount component receiving site on said bottom side of said circuit board.
Claim 15
Dependent Claim
46 words
The method of claim 11, further comprising dispensing a solder paste to a pad for a second surface-mount component on said top side of said circuit board and reflowing said solder on said top side, whereby said second surface-mount component becomes soldered to said circuit board.
Claim 16
Dependent Claim
25 words
The method of claim 11, wherein a plurality of surface-mount components are reflow soldered to both the top and bottom sides of said circuit board.
Claim 17
Independent Claim
95 words
A method of soldering a leaded-through-hole component and a surface-mount component to oppositely facing top and bottom sides of a printed circuit board respectively, comprising: applying a solder paste, an adhesive, and a surface-mount component to a surface-mount receiving site on said bottom side of said printed circuit board; curing said adhesive and reflowing said solder to effect adherence of said surface-mount component to said bottom side; inverting said board; inserting said leaded-through-hole component through a plurality of holes in said printed circuit board; and wave soldering said leaded-through-hole component to said printed circuit board.
Claim 18
Independent Claim
95 words
A method of soldering a leaded-through-hole component and a surface-mount component to oppositely facing top and bottom sides of a printed circuit board respectively, comprising: applying a solder paste, an adhesive, and a surface-mount component to a surface-mount receiving site on said bottom side of said printed circuit board; curing said adhesive and reflowing said solder to effect adherence of said surface-mount component to said bottom side; inverting said board; inserting said leaded-through-hole component through a plurality of holes in said printed circuit board; and wave soldering said leaded-through-hole component to said printed circuit board.
Claim 19
Dependent Claim
32 words
The method of claim 15, wherein said solder paste and said adhesive are applied substantially consecutively to a pre-tinned solder pad for a surface-mount component and to said surface-mount receiving site respectively.
Claim 20
Dependent Claim
15 words
The method of claim 15, wherein said curing and reflowing steps are provided substantially simultaneously.
Claim 21
Dependent Claim
79 words
The method of claim 15, further comprising following said inverting step, screening a solder paste on a pad for a surface-mount component on said top side of said board, applying a second surface-mount component to a surface-mount receiving site so as to contact said solder paste on said top side of said printed circuit board, and reflowing said solder on said top side to effect adherence of said second surface-mount component on said top side to said circuit board.
Claim 22
Dependent Claim
17 words
The method of claim 18, wherein said solder application steps comprise silk screening a Sn-Pb solder paste.
Claim 23
Dependent Claim
30 words
The method of claim 15, wherein said adhesive curing and solder reflowing steps comprise oven baking said circuit board for about 40-50 seconds at a temperature of about 175°-220° C.
References Cited (Backward Citations)
US4215025A
Cited
US4208005A
Cited
US4506443A
Cited
US4515304A
Cited
US4573105A
Cited
US4814944A
Cited
US4761881A
Cited
US4851966A
Cited
US4908936A
Cited
EP0376055A2
Cited
JPH02201997A
Cited
US4982376A
Cited
JPH0312993A
Cited
US4998342A
Cited
US5070604A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-20 | 1996-04-20 | 1996-10-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-20 | 2000-04-20 | 2000-10-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-20 | 2004-04-20 | 2004-10-20 | $7700.00 | Window Closed / Lapsed |