US4908936A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacturing method for a tuner
Assignee: Sharp Corp
•
Filing: 1988-03-04
•
Granted: 1990-03-20
•
Expires: 2008-03-04
Abstract
Abstract Disclosed is a manufacturing method for a tuner comprising the steps of temporarily fixing both chips and discrete parts by using an adhesive and soldering said chips and discrete parts on said substrate when solder-dipping said substrate and a chassis.
Inventors
- 👤 Syuuji Matsuura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 21:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3415; H05K7/00; H05K7/02; H05K7/04; H05K2203/00; H05K2203/15; H05K2203/1572; H05K3/0011; H05K3/0044; H05K3/0052; H05K3/303; H05K3/305; H05K3/306; H05K3/3447; H05K3/3465; H05K3/3468; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/49144; Y10T29/49147; Y10T29/49149; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
69 words
A manufacturing method for a tuner comprising the steps of: applying an adhesive at desired positions on a substrate; mounting and temporarily fixing chips and discrete parts on the substrate at the positions where the adhesive is applied; incorporating the substrate containing the chips and discrete parts, temporarily affixed thereto, into a chassis of a tuner; and soldering said substrate with the chassis, the chips and the discrete parts.
Claim 2
Dependent Claim
69 words
A manufacturing method for a tuner comprising the steps of: applying an adhesive at desired positions on a substrate; mounting and temporarily fixing chips and discrete parts on the substrate at the positions where the adhesive is applied; incorporating the substrate containing the chips and discrete parts, temporarily affixed thereto, into a chassis of a tuner; and soldering said substrate with the chassis, the chips and the discrete parts.
Claim 3
Dependent Claim
27 words
The manufacturing method according to claim 1, wherein said discrete parts include lead wire terminals and said lead wire terminals are inserted into holes in the substrate.
Claim 4
Dependent Claim
38 words
The manufacturing method according to claim 1, and further including the steps of printing copper foil on the substrate and removing by etching the copper foil from predetermined portions of the substrate to form a wiring circuit pattern.
Claim 5
Dependent Claim
16 words
The manufacturing method according to claim 1, wherein the chips do not include lead wiring terminals.
Claim 6
Dependent Claim
14 words
The manufacturing method according to claim 1, wherein the adhesive is a thermosetting adhesive.
Claim 7
Dependent Claim
14 words
The manufacturing method according to claim 1, wherein the adhesive is an epoxy resin.
Claim 8
Dependent Claim
119 words
A manufacturing method for a tuner comprising the steps of: applying a first adhesive at desired positions on a first side of a first substrate on which a circuit wiring pattern is printed; mounting and temporarily fixing chips on the first substrate at the positions where said first adhesive is applied; applying a second adhesive at desired positions on a second side of said first substrate; mounting and temporarily fixing discrete parts on the substrate at the positions where said second adhesive is applied; incorporating the first substrate on which the chips and the discrete parts are temporarily fixed into a chassis of a tuner; and soldering said first substrate with the chassis, the chips and the discrete parts.
Claim 9
Dependent Claim
119 words
A manufacturing method for a tuner comprising the steps of: applying a first adhesive at desired positions on a first side of a first substrate on which a circuit wiring pattern is printed; mounting and temporarily fixing chips on the first substrate at the positions where said first adhesive is applied; applying a second adhesive at desired positions on a second side of said first substrate; mounting and temporarily fixing discrete parts on the substrate at the positions where said second adhesive is applied; incorporating the first substrate on which the chips and the discrete parts are temporarily fixed into a chassis of a tuner; and soldering said first substrate with the chassis, the chips and the discrete parts.
Claim 10
Dependent Claim
15 words
The manufacturing method according to claim 7, wherein the discrete parts include lead wire terminals.
Claim 11
Dependent Claim
27 words
The manufacturing method according to claim 7, wherein said discrete parts include lead wire terminals and said lead wire terminals are inserted into holes in the substrate.
Claim 12
Dependent Claim
16 words
The manufacturing method according to claim 7, wherein the chips do not include lead wiring terminals.
Claim 13
Dependent Claim
15 words
The manufacturing method according to claim 7, wherein the discrete parts include lead wire terminals.
Claim 14
Dependent Claim
43 words
The manufacturing method according to claim 7, wherein the circuit wiring pattern is formed by the steps of printing copper foil on the substrate and removing by etching the copper foil from predetermined portions of the substrate to form the wiring circuit pattern.
Claim 15
Dependent Claim
14 words
The manufacturing method according to claim 7, wherein the adhesive is a thermosetting adhesive.
Claim 16
Dependent Claim
14 words
The manufacturing method according to claim 7, wherein the adhesive is an epoxy resin.
Claim 17
Dependent Claim
148 words
A manufacturing method for a tuner comprising the steps of: supplying a second substrate integrally including a plurality of first substrates having a circuit wiring pattern printed on a first side of said first substrates; applying a first adhesive at desired positions on the first side of said first substrates; mounting and temporarily fixing chips on the first substrates at the desired positions where said first adhesive is applied; applying a second adhesive at desired positions on a second side of said first substrates; mounting and temporarily fixing discrete parts on the first substrates at the positions where said second adhesive is applied; dividing said second substrate into the plurality of first substrates; incorporating the first substrates on which the chips and the discrete parts are temporarily mounted into the chassis of a tuner; and soldering said first substrates with the chassis, the chips and the discrete parts.
Claim 18
Dependent Claim
148 words
A manufacturing method for a tuner comprising the steps of: supplying a second substrate integrally including a plurality of first substrates having a circuit wiring pattern printed on a first side of said first substrates; applying a first adhesive at desired positions on the first side of said first substrates; mounting and temporarily fixing chips on the first substrates at the desired positions where said first adhesive is applied; applying a second adhesive at desired positions on a second side of said first substrates; mounting and temporarily fixing discrete parts on the first substrates at the positions where said second adhesive is applied; dividing said second substrate into the plurality of first substrates; incorporating the first substrates on which the chips and the discrete parts are temporarily mounted into the chassis of a tuner; and soldering said first substrates with the chassis, the chips and the discrete parts.
Claim 19
Dependent Claim
27 words
The manufacturing method according to claim 15, wherein said discrete parts include lead wire terminals and said lead wire terminals are inserted into holes in the substrate.
Claim 20
Dependent Claim
43 words
The manufacturing method according to claim 15, wherein the circuit wiring pattern is formed by the steps of printing copper foil on the substrate and removing by etching the copper foil from predetermined portions of the substrate to form the wiring circuit pattern.
Claim 21
Dependent Claim
16 words
The manufacturing method according to claim 15, wherein the chips do not include lead wiring terminals.
Claim 22
Dependent Claim
15 words
The manufacturing method according to claim 15, wherein the discrete parts include lead wire terminals.
Claim 23
Dependent Claim
14 words
The manufacturing method according to claim 15, wherein the adhesive is a thermosetting adhesive.
Claim 24
Dependent Claim
14 words
The manufacturing method according to claim 15, wherein the adhesive is an epoxy resin.
References Cited (Backward Citations)
US4360144A
Cited
US4761881A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-19 | 1993-09-18 | 1994-03-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-19 | 1997-09-18 | 1998-03-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-19 | 2001-09-18 | 2002-03-20 | $7700.00 | Window Closed / Lapsed |