US4573105A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit board assembly and method for the manufacture thereof
Assignee: RCA Licensing Corp
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Filing: 1983-02-16
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Granted: 1986-02-25
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Expires: 2003-02-16
Abstract
Abstract Leadless electronic components are secured to the bottom surface of a printed circuit board in a manner so as to prevent or substantially reduce the displacement of the leadless components prior to or during mass soldering. The technique used to improve the bonding of the leadless components is comprised of a series of steps. Initially, holes are formed through the circuit boards at the positions where it is desired to mount leadless components. A hardenable adhesive is then applied at each of the holes where a leadless component is to be mounted. The amount of adhesive which is applied to each hole is at least sufficient to form a bond with the dielectric body of the leadless component and also to extend partially into the hole formed in the printed circuit board. The leadless components are then brought into contact with the adhesive so as to form an adhesive plug which is bonded to the dielectric body of the leadless component and also to extend into the hole formed in the board. The adhesive is then allowed to harden. The resulting hardened adhesive plug then both mechanically and adhesively holds the leadless components in place through mass soldering of the component to the circuit board.
Inventors
- 👤 Vitauts Beldavs
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 01:33
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09072; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49128
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
230 words
In the method for soldering a leadless electronic component having a central portion and terminal end portions to a printed circuit board having solder pads separated by a predetermined width space wherein the leadless electronic component is initially adhesively secured to the printed circuit board with the terminal end portions in alignment with the solder pads and the resulting assembly is thereafter soldered, the improvement which comprises: (a) forming an aperture through the printed circuit board at a location which is intermediate between the solder pads; (b) applying a predetermined amount of a hardenable adhesive at about said location, said predetermined amount being sufficient to form an adhesive body extending from the central portion of a leadless electronic component positioned on said printed circuit board to a point substantially within the aperture formed in the printed circuit board but less than an amount which will allow the adhesive to contact the terminal end portions and solder pads; (c) positioning said leadless electronic component on the printed circuit board whereby only the central portion of the leadless electronic component is contacted by the adhesive, and the adhesive extends to a point substantially within the aperture; and (d) allowing the adhesive to harden whereby a hardened adhesive body is obtained which secures the leadless electronic component in position prior to and during soldering of the terminal end portions to the solder pads.
Claim 2
Dependent Claim
230 words
In the method for soldering a leadless electronic component having a central portion and terminal end portions to a printed circuit board having solder pads separated by a predetermined width space wherein the leadless electronic component is initially adhesively secured to the printed circuit board with the terminal end portions in alignment with the solder pads and the resulting assembly is thereafter soldered, the improvement which comprises: (a) forming an aperture through the printed circuit board at a location which is intermediate between the solder pads; (b) applying a predetermined amount of a hardenable adhesive at about said location, said predetermined amount being sufficient to form an adhesive body extending from the central portion of a leadless electronic component positioned on said printed circuit board to a point substantially within the aperture formed in the printed circuit board but less than an amount which will allow the adhesive to contact the terminal end portions and solder pads; (c) positioning said leadless electronic component on the printed circuit board whereby only the central portion of the leadless electronic component is contacted by the adhesive, and the adhesive extends to a point substantially within the aperture; and (d) allowing the adhesive to harden whereby a hardened adhesive body is obtained which secures the leadless electronic component in position prior to and during soldering of the terminal end portions to the solder pads.
Claim 3
Dependent Claim
46 words
The method according to claim 1 wherein the aperture formed in said printed circuit board is formed in a truncated conical configuration with said aperture having an increasing diameter extending from the space between the solder pads to the opposite surface of said printed circuit board.
Claim 4
Dependent Claim
54 words
The method according to claim 1 wherein the leadless electronic component is initially positioned on the solder pads of the printed circuit board and thereafter the predetermined amount of adhesive is applied through the aperture from the side of the board opposite to that on which the leadless electronic component is held in place.
References Cited (Backward Citations)
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Cited
US3919602A
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US4143456A
Cited
US4164778A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-02-24 | 1989-08-26 | 1990-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-02-24 | 1993-08-26 | 1994-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-02-24 | 1997-08-26 | 1998-02-25 | $7700.00 | Window Closed / Lapsed |