Patent US5144536A successfully refreshed from Google Patents.
US5144536A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic circuit substrate
Assignee: Ibiden Co Ltd
•
Filing: 1990-07-24
•
Granted: 1992-09-01
•
Expires: 2010-07-24
Abstract
Abstract An electronic circuit substrate excellent in reliability, which comprises a porous ceramic sintered body with film devices such as a conductive circuit, a resistor and a capacitor directly formed on a surface thereof. A resin is filled in the pores of the porous ceramic sintered body, and the bottom surface of the film devices are fit into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state. A method of producing the aforesaid electronic circuit substrate comprises the steps of forming film devices directly on a surface of a porous ceramic sintered body. Then, filling the pores of the porous ceramic sintered body with a resin so as to fit the under surface of the film devices into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedge state.
Inventors
- 👤 Kiyotaka Tsukada
- 👤 Yukihiro Noda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:42
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/02; H05K1/03; H05K1/0306; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H10W99/00; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49163
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
90 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; and wherein said porous ceramic sintered body has an average pore diameter of 0.2 to 15 μm and a porosity of not less than 10 vol %.
Claim 2
Dependent Claim
90 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; and wherein said porous ceramic sintered body has an average pore diameter of 0.2 to 15 μm and a porosity of not less than 10 vol %.
Claim 3
Dependent Claim
24 words
An electronic circuit substrate according to claim 1, wherein a plurality of said electronic circuit substrates are prepared and laminated together through insulating layers.
Claim 4
Dependent Claim
21 words
An electronic circuit substrate according to claim 1, wherein a radiator adheres to a surface of said porous ceramic sintered body.
Claim 5
Dependent Claim
113 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; wherein a plurality of said electronic circuit substrates are prepared and laminated together through at least one insulating layer; and wherein an other insulating layer is formed on a surface of one of said plurality of electronic circuit substrates and a conductive layer is formed on said other insulating layer.
Claim 6
Dependent Claim
113 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; wherein a plurality of said electronic circuit substrates are prepared and laminated together through at least one insulating layer; and wherein an other insulating layer is formed on a surface of one of said plurality of electronic circuit substrates and a conductive layer is formed on said other insulating layer.
Claim 7
Dependent Claim
106 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; wherein a plurality of said electronic circuit substrates are prepared and laminated together through at least one insulating layer; and wherein said at least one insulating layer is composed of a resin or a composite material of a resin and an inorganic material.
Claim 8
Dependent Claim
106 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; wherein a plurality of said electronic circuit substrates are prepared and laminated together through at least one insulating layer; and wherein said at least one insulating layer is composed of a resin or a composite material of a resin and an inorganic material.
Claim 9
Dependent Claim
100 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; and wherein a plurality of said electronic circuit substrates are prepared and bonded with each other into a laminate through a porous intermediate layer and the pores of said porous intermediate layer are filled with a resin.
Claim 10
Dependent Claim
100 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; and wherein a plurality of said electronic circuit substrates are prepared and bonded with each other into a laminate through a porous intermediate layer and the pores of said porous intermediate layer are filled with a resin.
Claim 11
Dependent Claim
21 words
An electronic circuit substrate according to claim 6, wherein a radiator adheres to a surface of said porous ceramic sintered body.
Claim 12
Dependent Claim
96 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; wherein a plurality of said electronic circuit substrates are prepared and laminated together through at least one insulating layer; and wherein a radiator adheres to a surface of said porous ceramic sintered body.
Claim 13
Dependent Claim
96 words
An electronic circuit substrate comprising: a porous ceramic sintered body with film devices directly formed on a surface thereof; a resin filled in the pores of said porous ceramic sintered body; wherein a bottom surface of said film devices are fit into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedged state; wherein a plurality of said electronic circuit substrates are prepared and laminated together through at least one insulating layer; and wherein a radiator adheres to a surface of said porous ceramic sintered body.
Claim 14
Independent Claim
97 words
A method of producing an electronic circuit substrate comprising the steps of: forming film devices directly on a surface of a porous ceramic sintered body, wherein said porous ceramic sintered body has an average pore diameter of 0.2 to 15 μm and a porosity of not less than 10 vol %; and, filling the pores of said porous ceramic sintered body with a resin so as to fit an under surface of said film devices into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedge state.
Claim 15
Independent Claim
97 words
A method of producing an electronic circuit substrate comprising the steps of: forming film devices directly on a surface of a porous ceramic sintered body, wherein said porous ceramic sintered body has an average pore diameter of 0.2 to 15 μm and a porosity of not less than 10 vol %; and, filling the pores of said porous ceramic sintered body with a resin so as to fit an under surface of said film devices into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedge state.
Claim 16
Dependent Claim
65 words
A method of producing an electronic circuit substrate according to claim 9 wherein said film devices are formed on a surface of said porous ceramic sintered body by first applying a paste for constituting the film devices to a surface of a green shaped body of a ceramic material and then firing said green ceramic shaped body at a temperature for forming a sintered body.
Claim 17
Dependent Claim
54 words
A method of producing an electronic circuit substrate according to claim 9, wherein said film devices are formed on a surface of said porous ceramic sintered body by first applying a paste for constituting the film devices to a surface of a porous ceramic sintered body and then heating said porous ceramic sintered body.
Claim 18
Dependent Claim
55 words
A method of producing an electronic circuit substrate according to claim 9, wherein said film devices are formed on a surface of said porous ceramic sintered body by masking a surface of said porous ceramic sintered body except portions which constitute a circuit, forming the film devices by deposition or sputtering, and removing the mask.
Claim 19
Dependent Claim
43 words
A method of producing an electronic circuit substrate according to claim 9, wherein the pores of said porous ceramic sintered body are filled with a resin by dipping a porous ceramic sintered body having said film devices provided thereon into a hot-molten resin.
Claim 20
Dependent Claim
44 words
A method of producing an electronic circuit substrate according to claim 9, wherein the pores of said porous ceramic sintered body are filled with a resin by impregnating a porous ceramic sintered body with a monomer state resin and polymerizing said monomer state resin.
Claim 21
Dependent Claim
51 words
A method of producing an electronic circuit substrate according to claim 9, further comprising the steps of: preparing a plurality of said electronic circuit substrates; and, bonding the plurality of said electronic circuit substrates with each other into a laminate through an insulating layer, thereby producing a multi-layer electronic circuit substrate.
Claim 22
Dependent Claim
25 words
A method of producing an electronic circuit substrate according to claim 15, wherein a radiator adheres to a surface of said porous ceramic sintered body.
Claim 23
Dependent Claim
25 words
A method of producing an electronic circuit substrate according to claim 9, wherein a radiator adheres to a surface of said porous ceramic sintered body.
Claim 24
Independent Claim
131 words
A method of producing an electronic circuit substrate comprising the steps of: forming film devices directly on a surface of a porous ceramic sintered body; filling the pores of said porous ceramic sintered body with a resin so as to fit an under surface of said film devices into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedge state; preparing a plurality of said electronic circuit substrates; and, bonding the plurality of said electronic circuit substrates with each other into a laminate through an insulating layer, thereby producing a multi-layer electronic circuit substrate; wherein an other insulating layer is formed on a surface of an outermost electronic circuit substrate and a conductive layer is formed on said other insulating layer.
Claim 25
Independent Claim
131 words
A method of producing an electronic circuit substrate comprising the steps of: forming film devices directly on a surface of a porous ceramic sintered body; filling the pores of said porous ceramic sintered body with a resin so as to fit an under surface of said film devices into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedge state; preparing a plurality of said electronic circuit substrates; and, bonding the plurality of said electronic circuit substrates with each other into a laminate through an insulating layer, thereby producing a multi-layer electronic circuit substrate; wherein an other insulating layer is formed on a surface of an outermost electronic circuit substrate and a conductive layer is formed on said other insulating layer.
Claim 26
Independent Claim
115 words
A method of producing an electronic circuit substrate comprising the steps of: forming film devices directly on a surface of a porous ceramic sintered body; and, filling the pores of said porous ceramic sintered body with a resin so as to fit an under surface of said film devices into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedge state; wherein said film devices are first formed directly on a surface of said porous ceramic sintered body, a plurality of said porous ceramic sintered bodies are laminated, and the pores of the plurality of said porous ceramic sintered bodies are filled with a resin.
Claim 27
Independent Claim
115 words
A method of producing an electronic circuit substrate comprising the steps of: forming film devices directly on a surface of a porous ceramic sintered body; and, filling the pores of said porous ceramic sintered body with a resin so as to fit an under surface of said film devices into the pores and recesses on the surface of said porous ceramic sintered body in close contact therewith in a wedge state; wherein said film devices are first formed directly on a surface of said porous ceramic sintered body, a plurality of said porous ceramic sintered bodies are laminated, and the pores of the plurality of said porous ceramic sintered bodies are filled with a resin.
Claim 28
Dependent Claim
33 words
A method of producing an electronic circuit substrate according to claim 19, wherein a plurality of said porous ceramic sintered bodies are bonded with each other into a laminate through an insulating layer.
Claim 29
Dependent Claim
47 words
A method of producing an electronic circuit substrate according to claim 19, wherein a plurality of said porous ceramic sintered bodies are bonded with each other into a laminate through a porous intermediate layer and the pores of said porous intermediate layer are filled with a resin.
Claim 30
Dependent Claim
25 words
A method of producing an electronic circuit substrate according to claim 21, wherein a radiator adheres to a surface of said porous ceramic sintered body.
References Cited (Backward Citations)
DE2007818A1
Cited
US3652332A
Cited
US4412377A
Cited
EP0196865A2
Cited
US4882455A
Cited
US4614837A
Cited
US4721831A
Cited
US4799983A
Cited
EP0332561A2
Cited
US4940623A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-01 | 1996-03-02 | 1996-09-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-01 | 2000-03-02 | 2000-09-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-01 | 2004-03-02 | 2004-09-01 | $7700.00 | Window Closed / Lapsed |