US5126920A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multiple integrated circuit interconnection arrangement
Assignee: Samsung Electronics Co Ltd
•
Filing: 1991-09-23
•
Granted: 1992-06-30
•
Expires: 2011-09-23
Abstract
Abstract A flexible chip interconnection includes a flexible film having interconnection lines formed on opposite sides thereof, with selected of the interconnection lines from one side connected by through-film conductors to interconnection lines on the other side. Insulating layers cover both sets of interconnection lines. Multi-chip circuits can be formed on the film with the interconnection lines directly connecting the chips.
Inventors
- 👤 Vahram S. Cardashian
- 👤 Jerald M. Loy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:44
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H05K1/0287; H05K1/0289; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H05K1/18; H05K1/189
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
289 words
A self-contained integrated circuit interconnect package adapted to be incorporated into an electrical or electromechanical device, wherein the device includes a printed wiring board with circuit connecting means for connecting to said package, comprising: a flexible, thin electrical insulating film, having first and second openings therethrough, and having first and second oppositely disposed surfaces; a first set of electrical interconnection lines, located on said first surface and including first and second integrated circuit connection sites; a second set of electrical interconnection lines located on said second surface; first and second electrical insulating layers covering said first and second surfaces, respectively, except at selected contact locations; first and second integrated circuits, wherein said first integrated circuit is connected to said first integrated circuit connection cite by wire bonds, and said second integrated circuit is connected to said second integrated circuit site by wire bonds; a set of interconnections for external circuits on said second surface, wherein some of said interconnections for external circuits are electrically connected to at least one of said first set of electrical interconnection lines or to at least one of said second set of electrical interconnection lines; first and second electrical connection through-films, located respectively in said first and second openings, wherein said through-films connect at least one of said first set of electrical interconnections which is connected to said first site to at least one of said second set of electrical interconnections which is connected to said second site, by way of at least one said second set of electrical interconnection lines, to thereby provide an electrical signal path between said intergrated circuit connection sites; and wherein some of said interconnections for external circuits are adapted to be directly connected to the circuit connecting means.
Claim 2
Dependent Claim
289 words
A self-contained integrated circuit interconnect package adapted to be incorporated into an electrical or electromechanical device, wherein the device includes a printed wiring board with circuit connecting means for connecting to said package, comprising: a flexible, thin electrical insulating film, having first and second openings therethrough, and having first and second oppositely disposed surfaces; a first set of electrical interconnection lines, located on said first surface and including first and second integrated circuit connection sites; a second set of electrical interconnection lines located on said second surface; first and second electrical insulating layers covering said first and second surfaces, respectively, except at selected contact locations; first and second integrated circuits, wherein said first integrated circuit is connected to said first integrated circuit connection cite by wire bonds, and said second integrated circuit is connected to said second integrated circuit site by wire bonds; a set of interconnections for external circuits on said second surface, wherein some of said interconnections for external circuits are electrically connected to at least one of said first set of electrical interconnection lines or to at least one of said second set of electrical interconnection lines; first and second electrical connection through-films, located respectively in said first and second openings, wherein said through-films connect at least one of said first set of electrical interconnections which is connected to said first site to at least one of said second set of electrical interconnections which is connected to said second site, by way of at least one said second set of electrical interconnection lines, to thereby provide an electrical signal path between said intergrated circuit connection sites; and wherein some of said interconnections for external circuits are adapted to be directly connected to the circuit connecting means.
Claim 3
Dependent Claim
14 words
The package of claim 1 wherein said wire bonds are formed by thermo-compression bonding.
Claim 4
Dependent Claim
14 words
The package of claim 1 wherein said wire bonds are formed by ultrasonic bonding.
Claim 5
Dependent Claim
35 words
The package of claim 1 wherein the majority of said interconnection lines are no more than 2 mils wide, and some of said interconnection lines are spaced as close as 2 mils, edge to edge.
References Cited (Backward Citations)
US3780352A
Cited
US3832769A
Cited
CA981797A
Cited
US3967162A
Cited
US4064552A
Cited
CA1090003A
Cited
GB2004127A
Cited
US4231154A
Cited
US4303291A
Cited
EP0065425A2
Cited
US4484215A
Cited
US4472876A
Cited
CA1196425A
Cited
US4438847A
Cited
US4480288A
Cited
US4587596A
Cited
EP0178227A2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-30 | 1995-12-30 | 1996-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-30 | 1999-12-30 | 2000-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-30 | 2003-12-30 | 2004-06-30 | $7700.00 | Window Closed / Lapsed |