Patent US3103587A successfully refreshed from Google Patents.
US3780352A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films
Assignee: Individual
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Filing: 1972-04-10
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Granted: 1973-12-18
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Expires: 1992-04-10
Abstract
Abstract A highly reliable, low cost packaging system for one or more semiconductor chips each having metal contact pads on at least one face. A rigid support is provided for the semiconductor chip and also the large leads which are used to connect the packaged device in an external circuit. A set of thin metallic film strips are bonded to a thin flexible dielectric sheet for support. The set of metal strips interconnects the contact pads on the semiconductor chips and selected leads to electrically interconnect the semiconductor device and the leads. Where a plurality of semiconductor devices are used, a plurality of dielectric sheets can be stacked and electrical connections made between the different layers of metal film strips through openings in the dielectric sheets. Several processes for assembling the packages are also described.
Inventors
- 👤 J Redwanz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:21
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W70/67; H10W70/688; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/132; H10W76/40; H10W90/00; H10W90/401; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
267 words
A semiconductor package for an electrical system comprising in combination: a rigid insulating support having major surfaces; a semiconductor device secured to one major surface of said insulating support and having selectively spaced metal pedestals formed on one major surface thereof opposite from said insulating support, said metal pedestals having predetermined heights elevated above the remainder of the said one major surface of said semiconductor device and being selectively connected to active regions of said semiconductor device; a plurality of relatively tHin, flexible sheets of insulating material positioned one above another in a sandwich configuration overlying and abutting said one major surface of said semiconductor device, each of said flexible insulating sheets having a metallized pattern selectively formed on one major surface thereof with apertures selectively located therein, some of said apertures in one of said flexible insulating sheets selectively overlying said apertures in one or more of said other flexible insulating sheets to provide interconnection paths defined by aligned apertures between said one flexible insulating sheet and one or more of said other flexible insulating sheets including the furthermost of said insulating flexible sheets; and said metal pedestals of said semiconductor device selectively extending into said apertures of the flexible insulating sheet adjacent said one major surface of said semiconductor device and into any aperture of an overlying flexible insulating sheet aligned therewith so as to provide selective electrical interconnections between the active regions of said semiconductor device and the metallized patterns of any of the plurality of flexible insulating sheets of the sandwich configuration including the outer flexible insulating sheet remote from said semiconductor device.
Claim 2
Dependent Claim
267 words
A semiconductor package for an electrical system comprising in combination: a rigid insulating support having major surfaces; a semiconductor device secured to one major surface of said insulating support and having selectively spaced metal pedestals formed on one major surface thereof opposite from said insulating support, said metal pedestals having predetermined heights elevated above the remainder of the said one major surface of said semiconductor device and being selectively connected to active regions of said semiconductor device; a plurality of relatively tHin, flexible sheets of insulating material positioned one above another in a sandwich configuration overlying and abutting said one major surface of said semiconductor device, each of said flexible insulating sheets having a metallized pattern selectively formed on one major surface thereof with apertures selectively located therein, some of said apertures in one of said flexible insulating sheets selectively overlying said apertures in one or more of said other flexible insulating sheets to provide interconnection paths defined by aligned apertures between said one flexible insulating sheet and one or more of said other flexible insulating sheets including the furthermost of said insulating flexible sheets; and said metal pedestals of said semiconductor device selectively extending into said apertures of the flexible insulating sheet adjacent said one major surface of said semiconductor device and into any aperture of an overlying flexible insulating sheet aligned therewith so as to provide selective electrical interconnections between the active regions of said semiconductor device and the metallized patterns of any of the plurality of flexible insulating sheets of the sandwich configuration including the outer flexible insulating sheet remote from said semiconductor device.
Claim 3
Dependent Claim
41 words
A semiconductor package as set forth in claim 1, further including housing means secured to said insulating support and overlying said semiconductor device and said sandwich configuration of flexible insulating sheets disposed on said semiconductor device for hermetically sealing said package.
Claim 4
Dependent Claim
202 words
A semiconductor package as set forth in claim 1, wherein a plurality of semiconductor devices are selectively spaced on and secured to said one major surface of said insulating support, each of said semiconductor devices having selectively spaced metal pedestals formed on the major surface thereof opposite from said insulating support, and said metal pedestals having predetermined heights respectively elevated above the remainder of the said major surface of the semiconductor device corresponding thereto and being selectively connected to active regions of the respective semiconductor device; said sandwich configuration of flexible insulating sheets overlying and abutting the said major surfaces of each of said plurality of semiconductor devices; and said metal pedestals of each of said plurality of semiconductor devices selectively extending into said apertures of the flexible insulating sheet adjacent the said major surface of each of said semiconductor devices and into any aperture of an overlying flexible insulating sheet aligned therewith so as to provide selective electrical interconnections between the active regions of each of said plurality of semiconductor devices and the metallized patterns of any of the plurality of flexible insulating sheets of the sandwich configuration including the outer flexible insulating sheet remote from said plurality of semiconductor devices.
Claim 5
Dependent Claim
39 words
A semiconductor package as set forth in claim 1, wherein each of said metal pedestals has a height at least as great as the thickness of the flexible insulating sheet adjacent said one major surface of said semiconductor device.
Claim 6
Dependent Claim
68 words
A semiconductor package as set forth in claim 1, wherein two or more of said plurality of flexible insulating sheets have selectively positioned co-axial openings formed therein in registering alignment, said co-axial openings being substantially filled with conductive material so as to provide selective electrical interconnection between the metallized pattern on one of said flexible insulating sheets and the metallized pattern on another of said flexible insulating sheets.
Claim 7
Dependent Claim
42 words
A semiconductor package as set forth in claim 1, further including a layer of electrically conductive material covering at least one of said plurality of flexible insulating sheets, said layer of electrically conductive material providing a ground plane for said semiconductor device.
Claim 8
Dependent Claim
60 words
A semiConductor package as set forth in claim 1, wherein said each of said plurality of flexible insulating sheets is relatively thin with respect to said rigid insulating support and is provided with planar surfaces, and the metallized pattern on one planar surface of at least one of said flexible insulating sheets including a plurality of selectively spaced passive elements.
Claim 9
Dependent Claim
44 words
A semiconductor package as set forth in claim 1, wherein the metallized patterns selectively formed on said flexible insulating sheets include at least two electrically conductive regions selectively disposed in spaced relationship and being electrically interconnected to said semiconductor device to form a capacitor.
Claim 10
Dependent Claim
63 words
A semiconductor package as set forth in claim 1, wherein at least one of said metal pedestals extends through aligned apertures of a plurality of said flexible insulating sheets and metallized patterns thereof so as to provide an electrical interconnection between an active region of said semiconductor devices and the metallized patterns of a plurality of flexible insulating sheets of the sandwich configuration.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-12-17 | 1977-06-18 | 1977-12-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-12-17 | 1981-06-18 | 1981-12-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-12-17 | 1985-06-18 | 1985-12-18 | $7700.00 | Window Closed / Lapsed |