Patent US5103292A successfully refreshed from Google Patents.
US5103292A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metal pin grid array package
Assignee: Advanced Technology Interconnect Inc
•
Filing: 1989-11-29
•
Granted: 1992-04-07
•
Expires: 2009-11-29
Abstract
Abstract A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.
Inventors
- 👤 Deepak Mahulikar
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:24
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/6875; H10W76/15; H10W76/153; H10W76/157; H10W76/60; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
97 words
A metal pin grid array package, comprising: a cover component; a metallic base component having a first array of holes; a circuit disposed between said cover component and said base component; a plurality of terminal pins electrically interconnected to said circuit and extending through said first array of holes; a dielectric sealing means for bonding said cover component to both said circuit and to said base component and said base component to said circuit; and said dielectric sealing means extending into said first array of holes electrically isolating said plurality of terminal pins from said base component.
Claim 2
Dependent Claim
97 words
A metal pin grid array package, comprising: a cover component; a metallic base component having a first array of holes; a circuit disposed between said cover component and said base component; a plurality of terminal pins electrically interconnected to said circuit and extending through said first array of holes; a dielectric sealing means for bonding said cover component to both said circuit and to said base component and said base component to said circuit; and said dielectric sealing means extending into said first array of holes electrically isolating said plurality of terminal pins from said base component.
Claim 3
Dependent Claim
21 words
The package of claim 1 wherein said base component is selected from the group consisting of copper, aluminum and alloys thereof.
Claim 4
Dependent Claim
33 words
The package of claim 2 wherein the diameter of said holes comprising said first array of holes is from about 0.005 to about 0.020 inches larger than the diameter of said terminal pins.
Claim 5
Dependent Claim
32 words
The package of claim 3 wherein diameter of said holes comprising said first array of holes is from about 0.010 to about 0.015 inches larger than the diameter of said terminal pins.
Claim 6
Dependent Claim
29 words
The package of claim 3 wherein the dielectric sealing means is a polymer adhesive providing an electrical resistance effective to electrically isolate said terminal pins from said base component.
Claim 7
Dependent Claim
19 words
The package of claim 5 wherein said polymer adhesive provides a resistivity in excess of about 10 10 ohms.
Claim 8
Dependent Claim
16 words
The package of claim 6 wherein said polymer adhesive is selected to be a thermosetting epoxy.
Claim 9
Dependent Claim
24 words
The package of claim 6 wherein said base component is formed from an aluminum alloy with those surfaces exposed to the external environment anodized.
Claim 10
Dependent Claim
13 words
The package of claim 8 wherein the walls of said holes are anodized.
Claim 11
Dependent Claim
24 words
The package of claim 9 wherein said cover component is formed from an aluminum alloy with those surfaces exposed to the external environment anodized.
Claim 12
Dependent Claim
19 words
The package of claim 6 wherein said base component is selected to be copper or a copper base alloy.
Claim 13
Dependent Claim
35 words
The package of 11 wherein said base component is a copper alloy capable of forming an in situ refractory oxide layer, said refractory oxide layer formed on those surfaces in contact with the polymer adhesive.
Claim 14
Dependent Claim
35 words
The package of 11 wherein said base component is a copper alloy capable of forming an in situ refractory oxide layer, said refractory oxide layer formed on those surfaces in contact with the polymer adhesive.
Claim 15
Dependent Claim
49 words
The package of claim 11 wherein said copper or copper alloy base component is coated with a second metal or metal alloy on at least those surfaces in contact with the dielectric sealing means, said coating layer selected from the group consisting of nickel, chromium, iron and their alloys.
Claim 16
Dependent Claim
18 words
The package of claim 11 wherein said cover component is selected to be copper or a copper alloy.
Claim 17
Dependent Claim
37 words
The package of claim 14 wherein said cover component is selected to be a copper alloy having relatively high tensile strength and said base component is selected to be a copper alloy having relatively high thermal conductivity.
Claim 18
Dependent Claim
40 words
The package of claim 14 wherein the portion of said cover component in contact with said polymer adhesive is coated with a second metal or a metal alloy selected from the group consisting of nickel, chromium, iron and their alloys.
Claim 19
Dependent Claim
98 words
A metal pin grid array package, comprising: a cover component having a first array of holes; a metallic base component; a circuit disposed between said cover component and said base component; a plurality of terminal pins electrically interconnected to said circuit and extending through said first array of holes; a dielectric sealing means for bonding said cover component to both said circuit and to said base component and said base component to said circuit; and said dielectric sealing means further extending into said first array of holes electrically isolating said plurality of terminal pins from said cover component.
Claim 20
Dependent Claim
98 words
A metal pin grid array package, comprising: a cover component having a first array of holes; a metallic base component; a circuit disposed between said cover component and said base component; a plurality of terminal pins electrically interconnected to said circuit and extending through said first array of holes; a dielectric sealing means for bonding said cover component to both said circuit and to said base component and said base component to said circuit; and said dielectric sealing means further extending into said first array of holes electrically isolating said plurality of terminal pins from said cover component.
Claim 21
Dependent Claim
31 words
The package of claim 17 wherein the diameter of said first array of holes is from about 0.005 inches to about 0.020 inches larger than the diameter of said terminal pins.
Claim 22
Dependent Claim
27 words
The package of claim 17 wherein said dielectric sealing means is selected to be a thermosetting epoxy providing a resistivity in excess of about 10 10 ohms.
Claim 23
Dependent Claim
28 words
The package of claim 18 wherein said cover component is an aluminum alloy with those surfaces exposed to the external environment and the walls of the holes anodized.
Claim 24
Dependent Claim
13 words
The package of claim 20 wherein said base component is an aluminum alloy.
Claim 25
Dependent Claim
19 words
The package of claim 20 wherein those surfaces of said base component exposed to the external environment are anodized.
References Cited (Backward Citations)
US3676292A
Cited
US4322778A
Cited
US4338621A
Cited
US4461924A
Cited
US4561006A
Cited
US4480262A
Cited
US4707382A
Cited
US4736236A
Cited
US4607276A
Cited
US4630096A
Cited
JPS618959A
Cited
US4823234A
Cited
US4821151A
Cited
US4721993A
Cited
US4935581A
Cited
JPS62274753A
Cited
US4688152A
Cited
JPS6365657A
Cited
US4716082A
Cited
JPS63126256A
Cited
US4816426A
Cited
US4806409A
Cited
US4901136A
Cited
US4827376A
Cited
US4849857A
Cited
EP0338213A2
Cited
EP0337448A2
Cited
US4887148A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-04-07 | 1995-10-07 | 1996-04-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-04-07 | 1999-10-07 | 2000-04-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-04-07 | 2003-10-07 | 2004-04-07 | $7700.00 | Window Closed / Lapsed |