EP0338213A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor device with a metal package
Assignee: Toshiba Corp
•
Filing: 1989-02-22
•
Granted: —
•
Expires: 2009-02-22
Abstract
Abstract A semiconductor chip (3) is mounted on the upper surface of a metal package base (1), the space region above the semiconductor chip is covered and air-tightly sealed by a metal cover plate. An electrically insulating layer (13,15) is provided on the bottom surface of the package base and/or entire outer surface of the metal cover.
Inventors
- 👤 Masamichi Shindo
- 👤 Toshiharu Sakurai
- 👤 Hideo 530 Toshiba Shinkoyasu Ryo Taguchi
- 👤 Nobu C531 Toshiba Isogo Dairoku Ryo Izawa
- 👤 Jun-Ichi Ohno
- 👤 Hiroyuki Takase
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 05:05
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H10W76/12; H10W76/60; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
57 words
A semiconductor device in which a metal package base is covered with a metal cover plate characterized in that it comprises: a metal package base; a semiconductor chip mounted on the upper surface of said package base; a metal cover plate covering and air-tightly sealing and an insulator attached to the bottom surface of said package base.
Claim 2
Dependent Claim
57 words
A semiconductor device in which a metal package base is covered with a metal cover plate characterized in that it comprises: a metal package base; a semiconductor chip mounted on the upper surface of said package base; a metal cover plate covering and air-tightly sealing and an insulator attached to the bottom surface of said package base.
Claim 3
Dependent Claim
67 words
A semiconductor device in which a metal package base is covered with a metal cover plate characterized in that it comprises: a metal package base; semiconductor chip mounted on the upper surface of said package base; a metal cover plate covering and air-tightly sealing; and an electrically insulating compound coating the bottom surface of said package base and the entire outer surface of said metal cover plate.
Claim 4
Dependent Claim
67 words
A semiconductor device in which a metal package base is covered with a metal cover plate characterized in that it comprises: a metal package base; semiconductor chip mounted on the upper surface of said package base; a metal cover plate covering and air-tightly sealing; and an electrically insulating compound coating the bottom surface of said package base and the entire outer surface of said metal cover plate.
Claim 5
Dependent Claim
52 words
A semiconductor device in which a metal package base is covered with a metal cover plate characterized in that it comprises: a metal package base; a semiconductor chip mounted over an interposed electrically insulating adhesive on the upper surface of said package base; and a metal cover plate covering and air-tightly sealing.
Claim 6
Dependent Claim
52 words
A semiconductor device in which a metal package base is covered with a metal cover plate characterized in that it comprises: a metal package base; a semiconductor chip mounted over an interposed electrically insulating adhesive on the upper surface of said package base; and a metal cover plate covering and air-tightly sealing.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.