Process for protecting an optical substrate by plasma deposition
Abstract
Abstract PCT No. PCT/FR88/00196 Sec. 371 Date Nov. 21, 1988 Sec. 102(e) Date Nov. 21, 1988 PCT Filed Apr. 21, 1988 PCT Pub. No. WO88/08439 PCT Pub. Date Nov. 3, 1988.Process for protecting a transparent optical substrate which is polymeric and has a vitreous transformation temperature and is selected from the group consisting of polycarbonate, polymethylmethacrylate, polystyrene acrylonitrile, crystalline polystyrene, polyimide, polyester, polyamide, polyvinyl chloride and glass, by deposition of an inorganic continous and transparent film consisting essentially of silicon, carbon, nitrogen, oxygen and hydrogen of the formula Si Cx Ny Oz Ht, in which x is between 0 and 5 y is between 0.3 and 0.8 z is between 1.3 and 2.5 t is between 0.5 and 1.2. A surface of the substrate is exposed to a plasma at a temperature below the temperature of vitreous transition of the substrate in the presence of precursors of Si, C, N, O and H is gaseous form, the precursor gas of the silicon being selected from the group consisting of SiH4, Si2H6 and Si3H8, and the precursor gases of oxygen, hydrogen and carbon being selected from the group consisting of O2, N2O, N2, NH3, CH4, CO2 and C2H6.
Inventors
- 👤 Claude Bonet
- 👤 Francois Coeuret
- 👤 Sylvie Nowak
- 👤 Jean-Marie Gauthier
Bibliographic Details
Claims Analysis
Total Claims: 6References Cited (Backward Citations)
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