Patent US5083368A successfully refreshed from Google Patents.
US5083368A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming modular power device assembly
Assignee: Motorola Solutions Inc
•
Filing: 1990-09-27
•
Granted: 1992-01-28
•
Expires: 2010-09-27
Abstract
Abstract Very compact, low cost power semiconductor device modules suitable for use in variable speed motor controllers multiple solenoid drivers, and the like are provided by attaching pre-packaged (e.g., type TO-220) semiconductor devices by their heat dissipation surfaces to opposed planar faces of a metal heat conduction plate using an electrically insulating and thermally conductive epoxy. By proper choice of the heat conduction plate thickness and the device-to-device spacing thereon, the leads of the pre-packaged devices can be arranged to have, on the modules, the same lead-to-lead and row-to-row spacing as for common JEDEC DILIC packages so that the modules fit on a conventional package footprint when mounted on a circuit board.
Inventors
- 👤 Randall K. Frank
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:54
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/60; H10W40/641; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
115 words
A method for forming a power device module, comprising: providing multiple pre-packaged power devices each having a planar heat removal face and external connection leads extending from an other face; providing a heat conductive plate having opposed first and second planar faces; bonding the planar heat removal faces of a first plurality of the multiple pre-packaged power devices to the first face of the heat conductive plate and the planar heat removal faces of a second plurality of the multiple pre-packaged power devices to the second face of the heat conductive plate so that the external connection leads of the multiple pre-packaged semiconductor devices extend away from the heat conductive plate in a common direction.
Claim 2
Independent Claim
115 words
A method for forming a power device module, comprising: providing multiple pre-packaged power devices each having a planar heat removal face and external connection leads extending from an other face; providing a heat conductive plate having opposed first and second planar faces; bonding the planar heat removal faces of a first plurality of the multiple pre-packaged power devices to the first face of the heat conductive plate and the planar heat removal faces of a second plurality of the multiple pre-packaged power devices to the second face of the heat conductive plate so that the external connection leads of the multiple pre-packaged semiconductor devices extend away from the heat conductive plate in a common direction.
Claim 3
Dependent Claim
46 words
The method of claim 1 wherein the bonding step comprises, bonding the heat removal faces to the opposed faces of the heat conductive plate with a thermally conductive bonding media containing means for controlling the separation of the heat removal faces and the heat conductive faces.
Claim 4
Dependent Claim
71 words
The method of claim 1 wherein the second providing step and the bonding step comprise, adjusting the thickness of the heat conductive plate so that, when the multiple pre-packaged power devices are bonded to the heat conductive plate, the external electrical leads of the first portion form a row and the external electrical leads of the second portion form a parallel row, wherein the row-to-row spacing equals a pre-determined JEDEC spacing.
References Cited (Backward Citations)
US3574815A
Cited
US3606673A
Cited
US4012765A
Cited
US4298883A
Cited
US4204248A
Cited
US4288839A
Cited
US4589010A
Cited
US4451973A
Cited
US4510519A
Cited
US4648008A
Cited
US4602315A
Cited
US4756081A
Cited
US4935086A
Cited
JPS6398135A
Cited
US4867235A
Cited
JPS63228650A
Cited
US4933746A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-01-27 | 1995-07-29 | 1996-01-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-01-27 | 1999-07-29 | 2000-01-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-01-27 | 2003-07-29 | 2004-01-28 | $7700.00 | Window Closed / Lapsed |