US5083368A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming modular power device assembly
Assignee: Motorola Solutions Inc
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Filing: 1990-09-27
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Granted: 1992-01-28
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Expires: 2010-09-27
Abstract
Abstract Very compact, low cost power semiconductor device modules suitable for use in variable speed motor controllers multiple solenoid drivers, and the like are provided by attaching pre-packaged (e.g., type TO-220) semiconductor devices by their heat dissipation surfaces to opposed planar faces of a metal heat conduction plate using an electrically insulating and thermally conductive epoxy. By proper choice of the heat conduction plate thickness and the device-to-device spacing thereon, the leads of the pre-packaged devices can be arranged to have, on the modules, the same lead-to-lead and row-to-row spacing as for common JEDEC DILIC packages so that the modules fit on a conventional package footprint when mounted on a circuit board.
Inventors
- 👤 Randall K. Frank
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:20
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/60; H10W40/641; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
115 words
A method for forming a power device module, comprising: providing multiple pre-packaged power devices each having a planar heat removal face and external connection leads extending from an other face; providing a heat conductive plate having opposed first and second planar faces; bonding the planar heat removal faces of a first plurality of the multiple pre-packaged power devices to the first face of the heat conductive plate and the planar heat removal faces of a second plurality of the multiple pre-packaged power devices to the second face of the heat conductive plate so that the external connection leads of the multiple pre-packaged semiconductor devices extend away from the heat conductive plate in a common direction.
Claim 2
Independent Claim
115 words
A method for forming a power device module, comprising: providing multiple pre-packaged power devices each having a planar heat removal face and external connection leads extending from an other face; providing a heat conductive plate having opposed first and second planar faces; bonding the planar heat removal faces of a first plurality of the multiple pre-packaged power devices to the first face of the heat conductive plate and the planar heat removal faces of a second plurality of the multiple pre-packaged power devices to the second face of the heat conductive plate so that the external connection leads of the multiple pre-packaged semiconductor devices extend away from the heat conductive plate in a common direction.
Claim 3
Dependent Claim
46 words
The method of claim 1 wherein the bonding step comprises, bonding the heat removal faces to the opposed faces of the heat conductive plate with a thermally conductive bonding media containing means for controlling the separation of the heat removal faces and the heat conductive faces.
Claim 4
Dependent Claim
71 words
The method of claim 1 wherein the second providing step and the bonding step comprise, adjusting the thickness of the heat conductive plate so that, when the multiple pre-packaged power devices are bonded to the heat conductive plate, the external electrical leads of the first portion form a row and the external electrical leads of the second portion form a parallel row, wherein the row-to-row spacing equals a pre-determined JEDEC spacing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-01-27 | 1995-07-29 | 1996-01-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-01-27 | 1999-07-29 | 2000-01-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-01-27 | 2003-07-29 | 2004-01-28 | $7700.00 | Window Closed / Lapsed |