Semiconductor integrated circuit device

Claim 2

A semiconductor integrated circuit device comprising: a first layer, comprising polycrystalline silicon and having impurity contained therein, on a semiconductor substrate; a second layer on said first layer; and a third layer consisting essentially of copper on said second layer, whereby said second layer is between the first and third layers, wherein said second layer is made of a material that prevents said impurity from diffusing from said first layer to said third layer so as to prevent said impurity from diffusing into said third layer, whereby increase in resistivity of the third layer consisting essentially of copper, due to diffusion of the impurity into the third layer, is prevented.

Claim 3

A semiconductor integrated circuit device according to claim 1, wherein the thickness of the second layer is at least 100Å.

Claim 4

A semiconductor integrated circuit device according to claim 1, wherein said impurity is selected from the group consisting of phosphorus and arsenic.

Claim 5

A semiconductor integrated circuit device according to claim 3, wherein said second layer is a titanium nitride film.

Claim 6

A semiconductor integrated circuit device according to claim 1, wherein said insulating layer is selected from the group consisting of a phosphosilicate glass film, a borosilicate glass film and a borophosphosilicate glass film.

Claim 7

A semiconductor integrated circuit device according to claim 5, wherein said impurity is selected from the group consisting of phosphorus and boron.

Claim 8

A semiconductor integrated circuit device according to claim 6, wherein said second layer is selected from the group consisting of a silicon oxide film, a silicon nitride film and an alumina film.

Claim 9

A semiconductor integrated circuit device according to claim 1, further comprising a fourth layer, on said third layer; and a fifth layer, having impurity contained therein, on the fourth layer such that the fourth layer is between the fifth layer and third layer, the fourth layer being made of a material that prevents diffusion of the impurity in the fifth layer from the fifth layer into the third layer.

Claim 10

A semiconductor integrated circuit device according to claim 8, wherein the second and fourth layers sandwich the third layer.

Claim 11

A semiconductor integrated circuit device according to claim 1, wherein said second layer does not contain said impurity.

Claim 12

A semiconductor integrated circuit device according to claim 1, wherein said impurity is at least one selected from the group consisting of As, P and B.

Claim 13

A semiconductor integrated circuit device comprising: a first wiring layer consisting essentially of copper over a semiconductor substrate; an insulating layer with impurities formed on said first wiring layer, the insulating layer having through holes; a second wiring layer consisting essentially of copper on said insulating layer and connected to said first wiring at said through holes; a third layer between said first wiring and said insulating layer; and a fourth layer between said insulating layer and said second wiring layer, wherein said third and fourth layers are each made of material that prevents said impurities from diffusing from said insulating layer to said first and second wiring layers.

Claim 14

A semiconductor integrated circuit device comprising: a first wiring layer consisting essentially of copper over a semiconductor substrate; an insulating layer with impurities formed on said first wiring layer, the insulating layer having through holes; a second wiring layer consisting essentially of copper on said insulating layer and connected to said first wiring at said through holes; a third layer between said first wiring and said insulating layer; and a fourth layer between said insulating layer and said second wiring layer, wherein said third and fourth layers are each made of material that prevents said impurities from diffusing from said insulating layer to said first and second wiring layers.

Claim 15

A semiconductor integrated circuit device according to claim 12, wherein the thickness of said third and fourth layers is at least 100Å.

Claim 16

A semiconductor integrated circuit device according to claim 12, wherein said third and fourth layers are titanium nitride layers.

Claim 17

A semiconductor integrated circuit device according to claim 12, wherein said insulating layer is selected from the group of a phosphosilicate glass film, a borosilicate glass film and borophosphosilicate glass film.

Claim 18

A semiconductor integrated circuit device according to claim 15, wherein said impurities are selected from the group consisting of phosphorus and boron.

Claim 19

A semiconductor integrated circuit device according to claim 12, wherein said insulating layer is selected from the group consisting of a silicon oxide film, a silicon nitride film and an alumina film.