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US4218271A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing semiconductor devices utilizing a sure-step molecular beam deposition

Assignee: US Philips Corp
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Filing: 1978-04-12
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Granted: 1980-08-19
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Expires: 1998-04-12
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Abstract

Abstract Method of making a semiconductor device which includes a III-V compound stratum. A film consisting of one of the elements Sn, Ge, Si, Be, Mn or Mg is deposited by an M.B.E. process on an exposed surface of the III-V compound stratum. A III-V compound layer doped with the element constituting the film is deposited over the film, when making, for example an F.E.T. An ohmic contact layer is deposited over the film to make an ohmic contact.

Inventors

  • 👤 Colin E. C. Wood

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 04:16
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/30; H01S5/32; H10; H10D; H10D62/00; H10D62/10; H10D62/17; H10D62/351; H10D62/357; H10D64/00; H10D64/01; H10D64/011; H10D64/0116; H10P; H10P14/00; H10P14/20; H10P14/29; H10P14/2901; H10P14/2907; H10P14/2911; H10P14/32; H10P14/3202; H10P14/3241; H10P14/34; H10P14/3402; H10P14/3414; H10P14/3421; H10P14/3438; H10P14/3441; H10P14/3442

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 61 words
A method of manufacturing a semiconductor device comprising the steps of depositing a first layer of one of the elements Sn, Ge, Si, Be, Mn, or Mg on a III-V compound stratum by molecular beam deposition, and depositing a second layer of a III-V compound material containing said one element as a component on said first layer by molecular beam deposition.
Claim 2
Independent Claim 61 words
A method of manufacturing a semiconductor device comprising the steps of depositing a first layer of one of the elements Sn, Ge, Si, Be, Mn, or Mg on a III-V compound stratum by molecular beam deposition, and depositing a second layer of a III-V compound material containing said one element as a component on said first layer by molecular beam deposition.
Claim 3
Dependent Claim 75 words
A method according to claim 1, wherein said first step deposits a coating of from 10 12 to 10 15 atoms/sq. cm. of said one element on an exposed surface of a semi-insulating III-V compound substrate, and said second step deposits a 0.05 to 1.5 μm thick film of a doped III-V compound on said coating, said doped III-V compound including a dopant of 1×10 16 to 3×10 17 atoms/cm 3 of said one element.
Claim 4
Dependent Claim 12 words
A method according to claim 2, wherein said one element is Sn.
Claim 5
Dependent Claim 15 words
A method according to claim 2, wherein said semiconductor device is a field effect transistor.
Claim 6
Dependent Claim 14 words
A method according to claim 2, wherein said semiconductor device is a laser diode.

References Cited (Backward Citations)

US3386867A Cited
US3863334A Cited
US3751310A Cited
US3839084A Cited
US3987480A Cited
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US3941624A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1983-08-19 1984-02-18 1984-08-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1987-08-19 1988-02-18 1988-08-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1991-08-19 1992-02-18 1992-08-19 $7700.00 Window Closed / Lapsed

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