Compact silicon module for high density integrated circuits

Claim 1

An electronic system module including a plurality of semiconductor memory devices mounted on stacked interconnection boards having interconnection circuitry on at least one surface of the interconnection board, said interconnection circuitry extending to at least one edge of the interconnection board, comprising: a plurality of said interconnection boards vertically stacked; an edge interconnection board having interconnection circuitry thereon, said stacked interconnection boards mounted on the edge interconnected board at said at least one edge of the interconnection board; a input/output circuitry on said edge interconnection board and said edge interconnection board and the interconnection circuitry thereon connected to said stacked interconnection boards and the interconnection circuitry thereon to interconnect the memory devices, and to provide in conjunction with said input/output circuitry, an input/output to and from said electronic system module, said vertically stacked boards being stacked with no space between the memory devices on one interconnection board and the adjacent interconnection board.