Compatible packaging of miniaturized circuit modules

Claim 1

A HIGH DENSITY PRINTED CIRCUIT PACKAGE SUITABLE FOR MOUNTING IN DESIRED RANDOM RELATIONSHIP BOTH DISCRETE COMPONENTS AND SOLID STATE CIRCUIT MODULES, SAID PACKAGE COMPRISING A MULTI-LAYERED LARGE PRINTED CIRCUIT CARD, A PLURALITY OF SMALL PRINTED CIRCUIT CARDS, SAID LARGE CARD AND SMALL CARDS HAVING EXTERNAL PRINTED WIRING ON BOTH THEIR SIDES AND ALSO HAVING RESPECTIVE RECTANGULAR GRIDS OF IDENTICALLY SPACED PLATED-THRU HOLES EXTENDING THERETHROUGH FROM ONE SUCH SIDE TO THE OTHER, A PLURALITY OF MINIATURIZED SOLID STATE CIRCUIT MODULES EACH INCLUDING A PLANAR SUBSTRATE AND A GRID PATTERN OF TERMINAL PINS PROJECTING FROM ONE SURFACE THEREOF AND INTO SAID PLATED-THRU HOLES ON RESPECTIVE SMALL CARDS TO MOUNT SUCH MODULES TO THE SMALL CARDS, DISCRETE COMPONENTS HAVING LEADS FASTENED IN OTHERS OF SAID PLATED-THRU HOLES TO MOUNT SUCH COMPONENTS TO AT LEAST ONE OF SAID SMALL CARDS, GENERALLY INVERTED U-SHAPED SPRING CONTACTS FASTENED TO BOTH SIDES OF EACH SMALL CARD, ROWS OF CONDUCTIVE PINS SECURED IN SELECTED ROWS OF PLATED-THRU HOLES IN SAID LARGE CARD AND PROJECTING BEYOND BOTH SIDES OF THE LARGE CARD, A CONNECTOR SOCKET COMPRISING AN APERTURED INSULATIVE HOUSING FOR RECEIVING PAIRS OF OPPOSITELY DISPOSED SPRING CONTACTS AND A DOUBLE ROW OF THOSE PORTIONS OF THE PINS PROJECTING FROM ONE SIDE OF SAID LARGE CARD TO RETAIN THE SMALL CARD IN PREDETERMINED REMOVABLE RIGHT ANGLE RELATION TO THE LARGE CARD AND PERMIT TRANSFERRAL OF ELECTRICAL SIGNALS FROM THE SMALL CARD VIA THE VARIOUS SPRING CONTACTS TO THE CORRESPONDING PINS ON THE LARGE CARD, AND THE OTHER PORTIONS OF THE PINS PROJECTING FROM THE OTHER SIDE OF THE LARGE CARD BEING AVAILABLE AS PROBE POINTS, AND SELECTED ONES OF THESE OTHER PORTIONS BEING INTERCONNECTED BY DISCRETE WIRES.