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US5011658A
Expired / Lapsed
US
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Copper doped low melt solder for component assembly and rework
Assignee: International Business Machines Corp
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Filing: 1989-05-31
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Granted: 1991-04-30
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Expires: 2009-05-31
Abstract
Abstract Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.
Inventors
- 👤 Daniel S. Niedrich
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 13:57
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/346; B23K35/24; B23K35/26; B23K35/262; C; C22; C22C; C22C13/00
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
35 words
A low melting temperature solder composition, wherein the solder is nominally comprised of about 54 wt. % tin/26 wt. % lead/20 wt. % indium, and doped with about 0.12 to about 0.20 wt. % copper.
Claim 2
Dependent Claim
35 words
A low melting temperature solder composition, wherein the solder is nominally comprised of about 54 wt. % tin/26 wt. % lead/20 wt. % indium, and doped with about 0.12 to about 0.20 wt. % copper.
Claim 3
Dependent Claim
39 words
A copper containing electronic device which includes a low melting temperature solder composition nominally comprised of about 54 wt. % tin/26 wt. % lead/20 wt. % indium and is doped with about 0.12 to about 0.20 wt. % copper.
Claim 4
Dependent Claim
39 words
A copper containing electronic device which includes a low melting temperature solder composition nominally comprised of about 54 wt. % tin/26 wt. % lead/20 wt. % indium and is doped with about 0.12 to about 0.20 wt. % copper.
Claim 5
Independent Claim
57 words
A method of making a copper containing electronic device which comprises the step of soldering at least once onto a copper containing metal using a low melting temperature solder which is nominally comprised of about 54 wt. % tin/26 wt. % lead/20 wt. % indium, and is doped with about 0.12 to about 0.20 wt. % copper.
Claim 6
Independent Claim
57 words
A method of making a copper containing electronic device which comprises the step of soldering at least once onto a copper containing metal using a low melting temperature solder which is nominally comprised of about 54 wt. % tin/26 wt. % lead/20 wt. % indium, and is doped with about 0.12 to about 0.20 wt. % copper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-29 | 1994-10-29 | 1995-04-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-29 | 1998-10-29 | 1999-04-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-29 | 2002-10-29 | 2003-04-30 | $7700.00 | Window Closed / Lapsed |