US3607252A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder alloy composition
Assignee: Unisys Corp
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Filing: 1969-06-02
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Granted: 1971-09-21
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Expires: 1989-06-02
Abstract
Abstract A composition of matter used in the assembly of products requiring both electrical and mechanical connections. The composition is of a solder alloy of tin, antimony, copper and lead having improved creep strength for mechanical connections with a sufficiently low melt temperature to permit the dipsoldering of electrical connections on electronic assemblies.
Inventors
- 👤 Robert E North
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:27
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-20 | 1975-03-22 | 1975-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-20 | 1979-03-22 | 1979-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-20 | 1983-03-22 | 1983-09-21 | $7700.00 | Window Closed / Lapsed |