Patent FR390165A successfully refreshed from Google Patents.
US4357162A
Expired / Lapsed
US
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Solder composition
Assignee: Motorola Solutions Inc
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Filing: 1980-12-08
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Granted: 1982-11-02
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Expires: 2000-12-08
Abstract
Abstract A solder composition for bonding a semiconductor die to a plated or unplated metal package member. In one embodiment the solder composition comprises, in weight percent, 5-8 copper, 20-40 silver, and the balance tin. Such a composition is particularly efficacious for bonding to copper and copper alloy package members. A further embodiment particularly efficacious for bonding to nickel and nickel alloy members further comprises the addition of 0.5-3.0 weight percent selenium.
Inventors
- 👤 Der-Yang Guan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:40
CPC Classifications
C; C22; C22C; C22C13/00; B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262; H; H10; H10W; H10W70/00; H10W70/20; H10W70/24; H10W72/00; H10W72/071; H10W72/073; H10W72/30; H10W72/351; H10W72/352; H10W90/00; H10W90/701; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
30 words
A solder composition for bonding a semiconductor die to a plated or unplated metal package member comprising, in weight percent, about 5-8 copper, 20-40 silver, 0.5-3.0 selenium, and balance tin.
Claim 2
Dependent Claim
30 words
A solder composition for bonding a semiconductor die to a plated or unplated metal package member comprising, in weight percent, about 5-8 copper, 20-40 silver, 0.5-3.0 selenium, and balance tin.
Claim 3
Dependent Claim
14 words
The solder composition of claim 1 comprising about 0.5 to 1.5 weight percent selenium.
Claim 4
Dependent Claim
21 words
The composition of claim 1 wherein said silver and said copper are present in a ratio of about 3.9:1 to 4.4:1.
Claim 5
Dependent Claim
25 words
The composition of claim 1 comprising in weight percent about 6.8 to 8.0 copper, 25.5 to 34.5 silver, 0.5 to 3.0 selenium, and balance tin.
Claim 6
Dependent Claim
20 words
The solder composition of claim 2 comprising, in weight percent, about 6.8 copper, 25.5 silver, 0.5 selenium and balance tin.
Claim 7
Dependent Claim
20 words
The solder composition of claim 2 comprising, in weight percent, about 8.0 copper, 34.5 silver, 0.5 selenium and balance tin.
Claim 8
Dependent Claim
19 words
The composition of claim 3 wherein said silver and said copper are present in a ratio of about 4.3:1.
References Cited (Backward Citations)
US2124589A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-11-01 | 1986-05-03 | 1986-11-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-11-01 | 1990-05-03 | 1990-11-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-11-01 | 1994-05-03 | 1994-11-02 | $7700.00 | Window Closed / Lapsed |