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US4997674A Expired / Lapsed US ⏱️ 0.0 years remaining

Conductive metallization of substrates via developing agents

Assignee: Akzo America Inc
•
Filing: 1988-06-08
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Granted: 1991-03-05
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Expires: 2008-06-08
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Abstract

Abstract A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.

Inventors

  • 👤 William J. E. Parr
  • 👤 Ronald E. Hutton
  • 👤 Paul Y. Y. Moy
  • 👤 Dieter Frank
  • 👤 David A. Strawser

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 08:51
CPC Classifications
C; C23; C23C; C23C24/00; C23C24/08; C23C24/082; C23C24/085; C23C24/087; C23C4/00; C23C4/18; H; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H05; H05K; H05K3/00; H05K3/02; H05K3/022; H05K3/10; H05K3/102; H05K3/14; H05K3/20; H05K3/207; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2203/00; H05K2203/02; H05K2203/0278; H05K2203/12; H05K2203/122; H05K3/22; H05K3/24; H05K3/244

Claims Analysis

Total Claims: 38
Claim 1
Independent Claim 197 words
A method of forming a conductive metal layer on a substrate, comprising: a. a depositing step of depositing a layer of copper or nickel metal particles on a temporarily deformable substrate; b. a contacting step of contacting, in the absence of a binder, the metal particles with a developing agent comprising (i) a long-chain aliphatic tertiary amine containing at least one coco, tallow, or hydrogenated tallow group; (ii) a tertiary phosphine or a tertiary phosphite; or (iii) a bifunctional compound being selected from the group consisting of diamines, alkanolamines, secondary amino alcohols, tertiary amino alcohols, secondary sulfides, hydrazides, hydrazones, oximes and tertiary amides and having both (1) a first atom which is a trivalent nitrogen atom or a bivalent sulfur atom and (2) at least one second atom which is nitrogen or oxygen; the first and second atoms being separated by at least two other atoms; the bifunctional compound being capable of forming a coordination complex with copper or nickel; and c. a heating step of subjecting the metal particles and the developing agent to heat, in the substantial absence of oxygen, at a temperature and for duration sufficient to improve the conductivity of the metal layer.
Claim 2
Independent Claim 197 words
A method of forming a conductive metal layer on a substrate, comprising: a. a depositing step of depositing a layer of copper or nickel metal particles on a temporarily deformable substrate; b. a contacting step of contacting, in the absence of a binder, the metal particles with a developing agent comprising (i) a long-chain aliphatic tertiary amine containing at least one coco, tallow, or hydrogenated tallow group; (ii) a tertiary phosphine or a tertiary phosphite; or (iii) a bifunctional compound being selected from the group consisting of diamines, alkanolamines, secondary amino alcohols, tertiary amino alcohols, secondary sulfides, hydrazides, hydrazones, oximes and tertiary amides and having both (1) a first atom which is a trivalent nitrogen atom or a bivalent sulfur atom and (2) at least one second atom which is nitrogen or oxygen; the first and second atoms being separated by at least two other atoms; the bifunctional compound being capable of forming a coordination complex with copper or nickel; and c. a heating step of subjecting the metal particles and the developing agent to heat, in the substantial absence of oxygen, at a temperature and for duration sufficient to improve the conductivity of the metal layer.
Claim 3
Dependent Claim 17 words
The method of claim 1 wherein said depositing step comprises spraying the metal particles onto the substrate.
Claim 4
Dependent Claim 18 words
The method of claim 2 wherein the spraying is done with the aid of a liquid suspension agent.
Claim 5
Dependent Claim 15 words
The method of claim 3 wherein the liquid suspension agent is an inert organic solvent.
Claim 6
Dependent Claim 19 words
The method of claim 3 wherein at least a portion of the liquid suspension agent is the developing agent.
Claim 7
Dependent Claim 21 words
The method of claim 1 wherein the copper or nickel contains less than about 40 weight of non-conductive layer forming metals.
Claim 8
Dependent Claim 22 words
The method of claim 1 wherein the copper or nickel contains less than about 20 weight % of non-conductive layer forming metals.
Claim 9
Dependent Claim 21 words
The method of claim 1 wherein the metal particles have a number average particle size of less than about 30 μm.
Claim 10
Dependent Claim 29 words
The method of claim 1 wherein the metals are present in the form of an alloy containing less than about 25 weight % of other non-conductive layer forming metals.
Claim 11
Dependent Claim 15 words
The method of claim 1 wherein the metal particles are in the form of flakes.
Claim 12
Dependent Claim 14 words
The method of claim 1 wherein said heating step takes place at 150-400° C.
Claim 13
Dependent Claim 14 words
The method of claim 11 wherein said heating step takes place at 180-220° C.
Claim 14
Dependent Claim 22 words
The method of claim 1 wherein said heating step takes place at temperature below the melting point of any substantially present metal.
Claim 15
Dependent Claim 21 words
The method of claim 1 wherein said heating step is accompanied by the application of pressure to the deposited metal particles.
Claim 16
Dependent Claim 11 words
The method of claim 14 wherein the pressure is 5-100 MPa.
Claim 17
Dependent Claim 20 words
The method of claim 1 wherein said heating step takes place at or above the softening point of the substrate.
Claim 18
Dependent Claim 12 words
The method of claim 1 wherein the substrate is a synthetic resin.
Claim 19
Dependent Claim 12 words
The method of claim 17 wherein the substrate is a thermoplastic resin.
Claim 20
Dependent Claim 14 words
The method of claim 17 wherein the substrate is an incompletely cured thermoset resin.
Claim 21
Dependent Claim 19 words
The method of claim 17 wherein the synthetic resin includes a flame retardant composition containing antimony, chlorine, or bromine.
Claim 22
Dependent Claim 22 words
The method of claim 1 wherein said contacting step comprises spraying the developing agent in liquid form onto the deposited metal particles.
Claim 23
Dependent Claim 17 words
The method of claim 1 wherein said contacting step comprises incorporating the developing agent into the substrate.
Claim 24
Dependent Claim 21 words
The method of claim 1 wherein said contacting step comprises exposing the metal particles to a vapor of the developing agent.
Claim 25
Dependent Claim 26 words
The method of claim 1 wherein said depositing step comprises applying the metal particles to a transfer surface and pressing the transfer surface against the substrate.
Claim 26
Dependent Claim 25 words
The method of claim 24 wherein the transfer surface has relief areas which will not contact the substrate, thereby transferring a pattern of metal particles.
Claim 27
Dependent Claim 20 words
The method of claim 1 wherein said contacting step and said heating step take place prior to said depositing step.
Claim 28
Dependent Claim 41 words
The method of claim 26 wherein said depositing step is followed by a subsequent pressing step of subjecting the particles on the substrate to a pressure and a temperature such that the adhesion of the particles to the substrate is increased.
Claim 29
Dependent Claim 21 words
The method of claim 27 wherein the temperature of said pressing step is lower than the temperature of said heating step.
Claim 30
Dependent Claim 31 words
The method of claim 1 wherein the substrate is coated with a solution of a polymer and said depositing step takes place while the polymer is still in a tacky state.
Claim 31
Dependent Claim 32 words
The method of claim 17 wherein the surface of the substrate is rendered tacky by the application of a solvent and said depositing step takes place while the polymer is still tacky.
Claim 32
Dependent Claim 19 words
The method of claim 1 wherein a metal layer has been deposited on two opposite surfaces of the substrate.
Claim 33
Dependent Claim 13 words
The method of claim 1 wherein tertiary amine also contains a hydroxyalkyl group.
Claim 34
Dependent Claim 15 words
The method of claim 32 wherein the tertiary amine is N,N-bis(2-hydroxyethyl)cocoamine or N,N-bis(2-hydroxyethyl)- tallow amine.
Claim 35
Independent Claim 188 words
A method of forming a conductive metal layer on a substrate, comprising: a. a depositing step of depositing a layer of copper or nickel metal particles on a temporarily deformable substrate; b. a contacting step of contacting, in the absence of a binder, the metal particles with a developing agent comprising (i) a long-chain aliphatic tertiary amine; (ii) a tertiary phosphine or a tertiary phosphite; or (iii) a bifunctional compound being selected from the group consisting of diamines, alkanolamines, secondary amino alcohols, tertiary amino alcohols, secondary sulfides, hydrazides, hydrazones, oximes and di(hydroxyalkyl) tertiary amides and having both (1) a first atom which is a trivalent nitrogen atom or a bivalent sulfur atom and (2) at least one second atom which is nitrogen or oxygen; the first and second atoms being separated by at least two other atoms; the bifunctional compound being capable of forming a coordination complex with copper or nickel; and c. a heating step of subjecting the metal particles and the developing agent to heat, in the substantial absence of oxygen, at a temperature and for a duration sufficient to improve the conductivity of the metal
Claim 36
Independent Claim 188 words
A method of forming a conductive metal layer on a substrate, comprising: a. a depositing step of depositing a layer of copper or nickel metal particles on a temporarily deformable substrate; b. a contacting step of contacting, in the absence of a binder, the metal particles with a developing agent comprising (i) a long-chain aliphatic tertiary amine; (ii) a tertiary phosphine or a tertiary phosphite; or (iii) a bifunctional compound being selected from the group consisting of diamines, alkanolamines, secondary amino alcohols, tertiary amino alcohols, secondary sulfides, hydrazides, hydrazones, oximes and di(hydroxyalkyl) tertiary amides and having both (1) a first atom which is a trivalent nitrogen atom or a bivalent sulfur atom and (2) at least one second atom which is nitrogen or oxygen; the first and second atoms being separated by at least two other atoms; the bifunctional compound being capable of forming a coordination complex with copper or nickel; and c. a heating step of subjecting the metal particles and the developing agent to heat, in the substantial absence of oxygen, at a temperature and for a duration sufficient to improve the conductivity of the metal
Claim 37
Dependent Claim 23 words
The method of claim 34 wherein said di(hydroxyalkyl) tertiary amide is a di(2-hydroxyethyl)alkyl amide having 5 to 20 carbons in the alkyl moiety.
Claim 38
Dependent Claim 11 words
The method of claim 35 wherein said di(2-hydroxyethyl)alkyl amide is di(2-hydroxyethyl)dodecanamide.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1994-03-04 1994-09-03 1995-03-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1998-03-04 1998-09-03 1999-03-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2002-03-04 2002-09-03 2003-03-05 $7700.00 Window Closed / Lapsed

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