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US4956692A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device having an isolation oxide film

Assignee: Mitsubishi Electric Corp
•
Filing: 1988-11-03
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Granted: 1990-09-11
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Expires: 2008-11-03
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Abstract

Abstract Two trenches are formed at a predetermined distance on a main surface of a semiconductor substrate. An oxide film and a nitride film are successively formed on the main surface of the semiconductor including the inner surfaces of the trenches. After a resist is formed over the whole surface including the inner surfaces of the trenches, the resist is patterned to expose a portion of the nitride film on a side surface of each trench. The exposed portions of the nitride film are removed by using the patterned resist as a mask and thermal oxidation is applied. Then, an isolation oxide film is formed on a region between the trenches and an end of a bird's beak is located on a side surface of each trench and is connected to the oxide film formed in each trench.

Inventors

  • 👤 Hiroji Ozaki
  • 👤 Masahiro Yoneda
  • 👤 Ikuo Ogoh
  • 👤 Yoshinori Okumura
  • 👤 Wataru Wakamiya
  • 👤 Masao Nagatomo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 13:56
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/01; H10D1/045; H10D1/047; H10B; H10B12/00; H10B12/30; H10B12/37; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/012; H10W10/0121; H10W10/10; H10W10/13

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 130 words
A semiconductor device having an isolation oxide film, comprising: a semiconductor substrate (1) having a main surface and a trench (5) formed on said main surface, a plurality of functional elements (12) formed on said semiconductor substrate (1), and an isolating film (8) for isolating said functional elements (12), formed on the main surface of said semiconductor substrate (1) near said trench (5), an end of a bird's beak of said isolation oxide film (8) being located on a side surface of said trench (5), said side surface of said trench (5) forming a rounded edge with said main surface of said semiconductor substrate and so that said side surface of said trench (5) and said main surface of said semiconductor substrate form an angle greater than an acute angle.
Claim 2
Dependent Claim 130 words
A semiconductor device having an isolation oxide film, comprising: a semiconductor substrate (1) having a main surface and a trench (5) formed on said main surface, a plurality of functional elements (12) formed on said semiconductor substrate (1), and an isolating film (8) for isolating said functional elements (12), formed on the main surface of said semiconductor substrate (1) near said trench (5), an end of a bird's beak of said isolation oxide film (8) being located on a side surface of said trench (5), said side surface of said trench (5) forming a rounded edge with said main surface of said semiconductor substrate and so that said side surface of said trench (5) and said main surface of said semiconductor substrate form an angle greater than an acute angle.
Claim 3
Dependent Claim 89 words
A semiconductor device in accordance with claim 1, further comprising a pair of said trenches wherein said trenches (5) are formed spaced apart at two portions on the main surface of said semiconductor substrate (1), said isolation films (8) of said trenches (5) connected to form a single contiguous isolation film (8) therebetween, the ends of respective bird's beaks (9) of said contiguous isolation film (8) being formed on the main surface of said semiconductor substrate (1) between said trenches (5) and located on inner portions of both trenches.
Claim 4
Dependent Claim 31 words
A semiconductor device in accordance with claim 1, wherein an oxide film (6) connecting the bird's beak of said isolation film (8) is formed on inner surfaces of said trench (5).
Claim 5
Dependent Claim 45 words
A semiconductor device in accordance with claim 3, wherein said semiconductor device comprises a DRAM comprising a plurality of transistors (18, 20, 26) and a plurality of capacitors (28, 30a, 30b, 32) and said oxide film (6) is a capacitor insulating film constituting said DRAM.

References Cited (Backward Citations)

JPS5053883A Cited
JPS5072591A Cited
US4819054A Cited
EP0154871A2 Cited
US4688064A Cited
JPS62123764A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1993-09-10 1994-03-12 1994-09-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1997-09-10 1998-03-12 1998-09-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2001-09-10 2002-03-12 2002-09-11 $7700.00 Window Closed / Lapsed

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