Semiconductor device having an isolation oxide film
Abstract
Abstract Two trenches are formed at a predetermined distance on a main surface of a semiconductor substrate. An oxide film and a nitride film are successively formed on the main surface of the semiconductor including the inner surfaces of the trenches. After a resist is formed over the whole surface including the inner surfaces of the trenches, the resist is patterned to expose a portion of the nitride film on a side surface of each trench. The exposed portions of the nitride film are removed by using the patterned resist as a mask and thermal oxidation is applied. Then, an isolation oxide film is formed on a region between the trenches and an end of a bird's beak is located on a side surface of each trench and is connected to the oxide film formed in each trench.
Inventors
- 👤 Hiroji Ozaki
- 👤 Masahiro Yoneda
- 👤 Ikuo Ogoh
- 👤 Yoshinori Okumura
- 👤 Wataru Wakamiya
- 👤 Masao Nagatomo
Bibliographic Details
Claims Analysis
Total Claims: 5References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 1993-09-10 | 1994-03-12 | 1994-09-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-09-10 | 1998-03-12 | 1998-09-11 | $3760.00 | Window Closed / Lapsed |
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