Method for depositing nitride-based composite coatings by CVD

Claim 2

In a process for depositing a wear resistant refractory layer on a hard refractory substrate comprising the step of: passing over the substrate a first gaseous mixture comprising a first halide vapor selected from the group consisting of halides of Si, B, Al, Y, Ti, Zr, Hf, V Nb, Ta, Mo and W, and one or more volatile nitriding gases, at a temperature between about 800° C. and a temperature detrimental to the service substrate properties, at a pressure between about 0.75 torr and about ambient pressure, and at partial pressure ratios, at a flow rate, and for a time sufficient to deposit a continuous, fully dense, adherent, wear resistant layer comprising at least one refractory, first phase nitride of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, or W about 0.1-20microns thick on the substrate; the improvement which comprises the step of: mixing with the first gaseous mixture at least one additional vapor selected from the halides of Si B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W to form a second gaseous mixture; wherein the additional vapor is different from the first halide vapor, and is mixed at a partial pressure selected to form at least one discontinuous additional phase, dispersed as discrete particles within the continuous nitride layer, and comprising at least one refractory nitride of Si B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, or W to form a fully dense, adherent, wear resistant, composite refractory layer on the substrate.

Claim 3

A process according to claim 1 wherein the first gaseous mixture comprises NO or N0 2 ; and the composite refractory layer comprises a continuous first phase of at least one refractory oxynitride of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, or W having dispersed therein discrete particles comprising at least one refractory oxynitride of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, or W.

Claim 4

A process for depositing a fully dense, adherent, wear resistant, composite refractory layer on a hard refractory substrate comprising the steps of: passing over the substrate a first gaseous mixture comprising a first halide vapor selected from the group consisting of halides of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W, and one or more volatile nitriding gases, at a temperature between about 800° C. and a temperature detrimental to the substrate service properties, at a pressure between about 0.75 torr and about ambient pressure, wherein the volatile nitriding gases, the partial pressure ratios, the flow rates and the deposition time are selected so that a continuous, fully dense, adherent, wear resistant first-phase layer comprising a material selected from the group consisting of refractory, first phase nitride of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W about 0.1-20 microns thick is deposited on the substrate; and intermittently, during the deposition of the continuous nitride layer, pulsing into the first gaseous mixture to form a second gaseous mixture at least one additional vapor selected from the halides of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W; wherein the at least one additional vapor is different from the first halide vapor and is mixed at a partial pressure, at time intervals, and for lengths of time selected to form at least one discontinuous additional phase dispersed as discrete particles within the continuous nitride layer, and comprising at least one material selected from the group consisting of refractory nitrides of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W to form a fully dense, adherent, wear resistant, composite refractory layer on the substrate.

Claim 5

A process for depositing a fully dense, adherent, wear resistant, composite refractory layer on a hard refractory substrate comprising the steps of: passing over the substrate a first gaseous mixture comprising a first halide vapor selected from the group consisting of halides of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W, and one or more volatile nitriding gases, at a temperature between about 800° C. and a temperature detrimental to the substrate service properties, at a pressure between about 0.75 torr and about ambient pressure, wherein the volatile nitriding gases, the partial pressure ratios, the flow rates and the deposition time are selected so that a continuous, fully dense, adherent, wear resistant first-phase layer comprising a material selected from the group consisting of refractory, first phase nitride of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W about 0.1-20 microns thick is deposited on the substrate; and intermittently, during the deposition of the continuous nitride layer, pulsing into the first gaseous mixture to form a second gaseous mixture at least one additional vapor selected from the halides of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W; wherein the at least one additional vapor is different from the first halide vapor and is mixed at a partial pressure, at time intervals, and for lengths of time selected to form at least one discontinuous additional phase dispersed as discrete particles within the continuous nitride layer, and comprising at least one material selected from the group consisting of refractory nitrides of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, and W to form a fully dense, adherent, wear resistant, composite refractory layer on the substrate.

Claim 6

A process according to claim 3 wherein the first gaseous mixture comprises NO or NO 2 ; and the composite refractory layer comprises a continuous first phase of at least one refractory oxynitride of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, or W having dispersed therein discrete particles comprising at least one refractory oxynitride of Si, B, Al, Y, Ti, Zr, Hf, V, Nb, Ta, Mo, or W.

Claim 7

A process according to claim 3 further comprising the step of controlling the size and distribution within the nitride layer of the additional phase particles by controlling the partial pressure, the time intervals, and the lengths of time at which the at least one additional vapor is pulsed into the first gaseous mixture.

Claim 8

A process according to claim 5 wherein the step of deposition of the continuous nitride layer is carried out for a sufficient time before the pulsing step is begun to form a single-phase portion of the first-phase nitride layer separating the substrate and a two or more phase portion of the composite ceramic coating.

Claim 9

A process according to claim 5 wherein the intermittent pulsing step occurs at time intervals and for times selected to form a stratified composite ceramic layer in which two or more phase portions alternate with single-phase portions of the first-phase nitride layer.

Claim 10

A process according to claim 1 wherein the second gaseous mixture comprises N 2 or NH 3 , hydrogen and chlorides of two al Al, Zr, and Y; and the composite refractory layer comprises a continuous first phase comprising AlN having discrete particles comprising ZrN dispersed therein, or a continuous first phase comprising ZrN having discrete particles comprising YN dispersed therein, or a continuous first phase comprising YN having discrete particles comprising ZrN dispersed therein.

Claim 11

A process according to claim 1 wherein the second gaseous mixture comprises N 2 or NH 3 , hydrogen, and chlorides of Si and Ti; and the composite refractory layer comprises a continuous first phase comprising Si 3 N 4 having discrete particles comprising TiN dispersed therein.

Claim 12

A process according to claim 1 wherein the second gaseous mixture comprises N 2 or NH 3 , hydrogen, and chlorides of Al and Ti; and the composite refractory layer comprises a continuous first phase comprising AlN having discrete particles comprising TiN dispersed therein.

Claim 13

A process according to claim 2 wherein the second gaseous mixture comprises NO or NO 2 , hydrogen, and chlorides of silicon titanium and aluminum; and the composite refractory layer comprises a continuous first phase comprising silicon aluminum oxynitride having discrete particles comprising Ti(O,N) dispersed therein.