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US4933601A
Expired / Lapsed
US
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Light emitting diode array chip and method of fabricating same
Assignee: Hitachi Cable Ltd
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Filing: 1988-12-09
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Granted: 1990-06-12
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Expires: 2008-12-09
Abstract
Abstract An LED array chip comprising; a first semiconductor layer having p-type conduction; a second semiconductor layer having a n-type conduction, possessing forbidden band width smaller than the first layer and provided on the first layer, so as to form a semiconductor chip having a pn junction at the interface with the first layer; the second layer being divided into a first region and a second region by etching the second layer through to the pn junction, the first region thereof being divided to form individual plural LEDs of predetermined configuration, and the n-type layer in the second region being converted to the p-type layer as so to serve as a common region; individual electrodes respectively provided to the surfaces of the LEDs; and a common electrode provided to the common region, parts of the exposed surface of the p-type layer corresponding to the LEDs serving as light emitting surfaces. The LED array chip is mounted on a printed circuit board by directly bonding the individual electrodes and the common electrode to the corresponding electrode pads of the printed circuit.
Inventors
- 👤 Toshio Sagawa
- 👤 Kazuhiro Kurata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 12:41
CPC Classifications
H; H10; H10H; H10H29/00; H10H29/10; H10H29/14; B; B41; B41J; B41J2/00; B41J2/435; B41J2/447; B41J2/45; H10W; H10W90/00; H10H20/00; H10H20/80; H10H20/85; H10H20/855; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
124 words
An LED array chip, comprising: a first semiconductor layer having a first type of conduction; a second semiconductor layer having a second type of conduction opposite to the first type, and possessing a forbidden band width smaller than that of the first layer, the second layer being disposed on the first layer the second layer being divided into first and second separated regions, the first region being divided to define a plurality of individual LEDs of predetermined configuration, and the second region including a common region; individual electrodes respectively provided at the surfaces of the LEDs; and a common electrode provided in the common region, parts of the exposed surface of the first layer respectively registered with the LEDs serving as light emitting surfaces.
Claim 2
Dependent Claim
124 words
An LED array chip, comprising: a first semiconductor layer having a first type of conduction; a second semiconductor layer having a second type of conduction opposite to the first type, and possessing a forbidden band width smaller than that of the first layer, the second layer being disposed on the first layer the second layer being divided into first and second separated regions, the first region being divided to define a plurality of individual LEDs of predetermined configuration, and the second region including a common region; individual electrodes respectively provided at the surfaces of the LEDs; and a common electrode provided in the common region, parts of the exposed surface of the first layer respectively registered with the LEDs serving as light emitting surfaces.
Claim 3
Dependent Claim
35 words
An LED array chip according to claim 1, including a circuit printed on a substrate and wherein said individual electrodes provided at said individual LEDs are bonded directly to the circuit printed on the substrate.
Claim 4
Dependent Claim
21 words
An LED array chip according to claim 1, wherein said first layer has a thickness ranging from 50 to 500 μm.
Claim 5
Dependent Claim
21 words
An LED array chip according to claim 1, wherein said second layer has a thickness of between 1 to 30 μm.
Claim 6
Dependent Claim
24 words
An LED array chip according to claim 1, wherein the center-to-center distance of said individual electrodes is substantially equal to that of said LEDs.
Claim 7
Dependent Claim
21 words
An LED array chip according to claim 1, including convex lenses disposed on the light emitting surfaces of the first layer.
Claim 8
Dependent Claim
21 words
An LED array chip according to claim 2, wherein said first layer has a thickness ranging from 50 to 500 μm.
Claim 9
Dependent Claim
21 words
An LED array chip according to claim 2, wherein said second layer has a thickness of between 1 to 30 μm.
Claim 10
Dependent Claim
21 words
An LED array chip according to claim 3, wherein said second layer has a thickness of between 1 to 30 μm.
Claim 11
Dependent Claim
24 words
An LED array chip according to claim 2, wherein the center-to-center distance of said individual electrodes is substantially equal to that of said LEDs.
Claim 12
Dependent Claim
24 words
An LED array chip according to claim 3, wherein the center-to-center distance of said individual electrodes is substantially equal to that of said LEDs.
Claim 13
Dependent Claim
24 words
An LED array chip according to claim 4, wherein the center-to-center distance of said individual electrodes is substantially equal to that of said LEDs.
Claim 14
Dependent Claim
21 words
An LED array chip according to claim 2, including convex lenses disposed on the light emitting surfaces of the first layer.
Claim 15
Dependent Claim
21 words
An LED array chip according to claim 3, including convex lenses disposed on the light emitting surfaces of the first layer.
Claim 16
Dependent Claim
21 words
An LED array chip according to claim 4, including convex lenses disposed on the light emitting surfaces of the first layer.
Claim 17
Dependent Claim
21 words
An LED array chip according to claim 5, including convex lenses disposed on the light emitting surfaces of the first layer.
Claim 18
Independent Claim
123 words
A method of fabricating an LED array chip, comprising the steps of: (A) fabricating a p-type substrate; (B) forming on the p-type substrate an n-type layer processing a ratio of mixed crystal smaller than that of the substrate, and defining of pn junction at the interface with the substrate; (C) etching the n-type layer through to the pn junction so as to divide the n-type layer into a first region and a second region; (D) dividing the first region of the n-type layer so as to form a plurality of individual LEDs; (E) forming a common region in the second region of the n-type layer; (F) forming a common electrode in the second region; and (G) forming individual electrodes on the LEDs respectively.
Claim 19
Independent Claim
123 words
A method of fabricating an LED array chip, comprising the steps of: (A) fabricating a p-type substrate; (B) forming on the p-type substrate an n-type layer processing a ratio of mixed crystal smaller than that of the substrate, and defining of pn junction at the interface with the substrate; (C) etching the n-type layer through to the pn junction so as to divide the n-type layer into a first region and a second region; (D) dividing the first region of the n-type layer so as to form a plurality of individual LEDs; (E) forming a common region in the second region of the n-type layer; (F) forming a common electrode in the second region; and (G) forming individual electrodes on the LEDs respectively.
Claim 20
Dependent Claim
21 words
A method of fabricating an LED array chip according to claim 17, wherein step (A) includes performing liquid phase epitaxial growth.
Claim 21
Dependent Claim
39 words
A method of fabricating an LED array chip according to claim 17, where step (E) includes diffusing or ion-implanting ZN into the n-type layer of the second region so as to change to n-type layer to a p-type layer.
Claim 22
Dependent Claim
18 words
A method of fabricating an LED array chip according to claim 17, wherein step (G) includes vapor deposition.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-11 | 1993-12-11 | 1994-06-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-11 | 1997-12-11 | 1998-06-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-11 | 2001-12-11 | 2002-06-12 | $7700.00 | Window Closed / Lapsed |