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US4404730A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of producing luminescent or laser diodes having an internally limited luminescent surface

Assignee: Siemens AG
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Filing: 1982-02-16
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Granted: 1983-09-20
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Expires: 2002-02-16
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Abstract

Abstract A luminescent or laser diode having a pn-junction surrounding an internally limited luminescent surface area and limiting current flow in the diode is produced by etching a select semiconductor substrate so as to produce a mesa dimensioned accordingly to the required luminescent surface area and without interruption epitaxially depositing and structuring required individual semiconductor material layers on the surfaces of the substrate and mesa to achieve the diode.

Inventors

  • 👤 Jochen Heimen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 18:32
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/81; H10H20/819; H10H20/821; H10H20/01; H10H20/011; H10H20/013; Y; Y10; Y10S; Y10S438/00; Y10S438/955

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 211 words
In a method for producing a pn-luminescent or laser diode having an emission area in the semiconductor body of said diode defined by lateral limitations of a pn-junction wherein a plurality of semiconductor layers are epitaxially deposited onto a substrate body or on one another and electrodes are applied, the improvement comprising: (1) generating a mesa having side surfaces and a top plane surface dimensioned according to a desired luminescent surface area on a select semiconductor substrate of a first conductivity type; (2) epitaxially depositing a first layer of a semiconductor material of a second, opposing conductivity type relative to that of the substrate, onto the surfaces of the substrates and the mesa in such a manner that said first layer is generated with a lesser thickness in the area of the mesa surfaces relative to the thickness thereof on the substrate surfaces located around said mesa; (3) removing a sufficient portion of said first layer so that at least the entire mesa plane surface is uncovered; (4) epitaxially depositing a second layer of a semiconductor material of the first conductivity type on said first layer and on the uncovered plane surface of said mesa; and (5) thereafter applying a layer sequence required for luminescent or laser diodes and providing electrodes.
Claim 2
Dependent Claim 211 words
In a method for producing a pn-luminescent or laser diode having an emission area in the semiconductor body of said diode defined by lateral limitations of a pn-junction wherein a plurality of semiconductor layers are epitaxially deposited onto a substrate body or on one another and electrodes are applied, the improvement comprising: (1) generating a mesa having side surfaces and a top plane surface dimensioned according to a desired luminescent surface area on a select semiconductor substrate of a first conductivity type; (2) epitaxially depositing a first layer of a semiconductor material of a second, opposing conductivity type relative to that of the substrate, onto the surfaces of the substrates and the mesa in such a manner that said first layer is generated with a lesser thickness in the area of the mesa surfaces relative to the thickness thereof on the substrate surfaces located around said mesa; (3) removing a sufficient portion of said first layer so that at least the entire mesa plane surface is uncovered; (4) epitaxially depositing a second layer of a semiconductor material of the first conductivity type on said first layer and on the uncovered plane surface of said mesa; and (5) thereafter applying a layer sequence required for luminescent or laser diodes and providing electrodes.
Claim 3
Dependent Claim 20 words
In a method as defined in claim 1 wherein generation of said mesa occurs by etching of said substrate body.
Claim 4
Dependent Claim 31 words
In a method as defined in claim 1 wherein said removal of a sufficient portion of said first layer occurs by erosion of said first layer with an additional etching melt.
Claim 5
Dependent Claim 43 words
In a method as defined in claim 1 wherein said removal of a sufficient portion of said first layer occurs by re-melting the material of said first layer by temporarily increasing the temperature of a melt solution used to deposit said first layer.
Claim 6
Dependent Claim 43 words
In a method as defined in claim 1 wherein said removal of a sufficient portion of said first layer occurs by re-melting of material of said first layer by temporarily increasing the temperature of a melt solution used to deposit said second layer.
Claim 7
Dependent Claim 205 words
In a method for producing a pn-luminescent or laser diode having an emission area in the semiconductor body of said diode defined by lateral limitations of a pn-junction wherein a plurality of semiconductor layers are epitaxially deposited onto a substrate body or on one another and electrodes are applied, the improvement comprising: (1) generating a mesa having side surfaces and a top plane surface dimensioned according to a desired luminescent surface area on a select semiconductor substrate of a first conductivity type; (2) epitaxially depositing a first layer composed of a further semiconductor material on an opposing, second conductivity type relative to that of the substrate, onto the surfaces of the substrate and the mesa; (3) epitaxially depositing a second layer of a semiconductor material of the first conductivity type onto said first layer in such a manner that the second layer is generated with a lesser thickness in the area of the mesa surfaces relative to the thickness thereof on the substrate surface; (4) removing a sufficient portion of said second and first layers so that at least the entire area of said mesa plane surface is uncovered; and (5) thereafter applying a layer sequence required for luminescent or laser diodes and providing electrodes.
Claim 8
Dependent Claim 205 words
In a method for producing a pn-luminescent or laser diode having an emission area in the semiconductor body of said diode defined by lateral limitations of a pn-junction wherein a plurality of semiconductor layers are epitaxially deposited onto a substrate body or on one another and electrodes are applied, the improvement comprising: (1) generating a mesa having side surfaces and a top plane surface dimensioned according to a desired luminescent surface area on a select semiconductor substrate of a first conductivity type; (2) epitaxially depositing a first layer composed of a further semiconductor material on an opposing, second conductivity type relative to that of the substrate, onto the surfaces of the substrate and the mesa; (3) epitaxially depositing a second layer of a semiconductor material of the first conductivity type onto said first layer in such a manner that the second layer is generated with a lesser thickness in the area of the mesa surfaces relative to the thickness thereof on the substrate surface; (4) removing a sufficient portion of said second and first layers so that at least the entire area of said mesa plane surface is uncovered; and (5) thereafter applying a layer sequence required for luminescent or laser diodes and providing electrodes.
Claim 9
Dependent Claim 19 words
In a method as defined in clain 6 wherein generation of said mesa occurs by etching said substrate body.
Claim 10
Dependent Claim 19 words
In a method as defined in clain 6 wherein generation of said mesa occurs by etching said substrate body.
Claim 11
Dependent Claim 32 words
In a method as defined in claim 6 wherein said removal of a sufficient portion of said first and second layers occurs by erosion of said layers with an additional etching melt.
Claim 12
Dependent Claim 44 words
In a method as defined in claim 6 wherein said removal of a sufficient portion of said first and second layers occurs by re-melting the material of said layers by temporarily increasing the temperature of a melt solution used to deposit said second layer.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-09-19 1987-03-21 1987-09-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-09-19 1991-03-21 1991-09-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-09-19 1995-03-21 1995-09-20 $7700.00 Window Closed / Lapsed

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