Electronic apparatus having semiconductor device
Abstract
Abstract Disclosed is an electronic apparatus wherein a large power consumption type semiconductor device is mounted on a ceramic substrate of sintered aluminum nitride with high thermal conductivity for improving a heat dissipation effect. The electronic apparatus is, for example, an ignitor. The aluminum nitride-made ceramic substrate having the semiconductor device is provided in a metallic vessel made of aluminum or the like. Employed is a thermal stress strain-resistant adhesive agent with high thermal conductivity such as a silicone type adhesive agent for bonding. The thermal stress strain-resistant adhesive agent layer serves as a cushioning layer for a heating and cooling cycle and therefore improves a heat cycle resistance.
Inventors
- 👤 Hideki Sato
- 👤 Nobuyuki Mizunoya
Bibliographic Details
Claims Analysis
Total Claims: 8References Cited (Backward Citations)
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