Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
177 words
A process for growing a GaAs layer on an Si substrate, said process comprising: forming a first GaAs layer in the amorphous state on the Si substrate at a first temperature, the first GaAs layer being formed with a thickness allowing formation of a single crystalline layer having a thickness of one to three monomolecular layers; heating the first GaAs layer to change the amorphous state of the first GaAs layer to a single crystalline state; forming an Si layer on the first GaAs layer at a second temperature higher than the first temperature, the Si layer being formed with a thickness having one to six monoatomic layers; forming a second GaAs layer in the amorphous state on the Si layer at the first temperature, the second GaAs layer being formed with a thickness substantially the same as the thickness of the first GaAs layer; heating the second GaAs layer to change the amorphous state of the second GaAs layer to a single crystalline state; and epitaxially growing a third GaAs layer on the second GaAs layer.
Claim 2
Dependent Claim
177 words
A process for growing a GaAs layer on an Si substrate, said process comprising: forming a first GaAs layer in the amorphous state on the Si substrate at a first temperature, the first GaAs layer being formed with a thickness allowing formation of a single crystalline layer having a thickness of one to three monomolecular layers; heating the first GaAs layer to change the amorphous state of the first GaAs layer to a single crystalline state; forming an Si layer on the first GaAs layer at a second temperature higher than the first temperature, the Si layer being formed with a thickness having one to six monoatomic layers; forming a second GaAs layer in the amorphous state on the Si layer at the first temperature, the second GaAs layer being formed with a thickness substantially the same as the thickness of the first GaAs layer; heating the second GaAs layer to change the amorphous state of the second GaAs layer to a single crystalline state; and epitaxially growing a third GaAs layer on the second GaAs layer.
Claim 3
Dependent Claim
20 words
A process according to claim 1, wherein the first temperature is in a range of 60° C. to 90° C.
Claim 4
Dependent Claim
20 words
A process according to claim 1, wherein the second temperature is in a range of 200° C. to 400° C.
Claim 5
Dependent Claim
41 words
A process according to claim 1, wherein said first and second GaAs layers in the amorphous state are heated to a temperature in a range of 200° C. to 400° C. to change the amorphous state to the single crystalline state.
Claim 6
Dependent Claim
22 words
A process according to claim 1, wherein said third GaAs layer is grown at a temperature of 200° C. to 400° C.
Claim 7
Dependent Claim
32 words
A process according to claim 1, wherein the first and second GaAs layers have a thickness of monomolecular layer when crystallized and the Si layer has a thickness of two monoatomic layers.
Claim 8
Dependent Claim
23 words
A process according to claim 1, wherein the Si substrate has a (100) plane surface with an offset angle of less than ±3°.
Claim 9
Dependent Claim
30 words
A process according to claim 1, wherein the Si substrate is heat treated at a temperature of 1000° C. to 1300° C. before the first GaAs layer is formed thereon.
Claim 10
Dependent Claim
25 words
A process according to claim 1, further forming fourth GaAs layer on the third GaAs layer at a temperature of 450° C. to 580° C.
Claim 11
Dependent Claim
23 words
A process according to claim 9, wherein the third GaAs layer is formed to have a thickness of not less than 100 Å.
Claim 12
Dependent Claim
23 words
A process according to claim 10, wherein the third GaAs layer is formed to have a thickness of 100 Å to 200 Å.
Claim 13
Dependent Claim
25 words
A process according to claim 1, wherein the first to third GaAs layers and the Si layer are formed by a molecular beam epitaxy system.