Process for placing single or multiple patterned layers of conductive material on a substrate

Claim 1

A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) removing a pattern of the conductive layer from said transfer agent to leave a desired remaining pattern of the conductive layer; (c) transferring said desired remaining pattern to a substrate to establish electrical current paths across said substrate; (d) applying an insulating separating layer of material on the pattern on said substrate; (e) repeating steps (a) and (b); and (f) transferring said desired remaining pattern resulting form step (e) to the resultant of step (d) to establish electrical current paths thereacross.

Claim 2

A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) removing a pattern of the conductive layer from said transfer agent to leave a desired remaining pattern of the conductive layer; (c) transferring said desired remaining pattern to a substrate to establish electrical current paths across said substrate; (d) applying an insulating separating layer of material on the pattern on said substrate; (e) repeating steps (a) and (b); and (f) transferring said desired remaining pattern resulting form step (e) to the resultant of step (d) to establish electrical current paths thereacross.

Claim 3

A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) removing a pattern of the conductive layer form the transfer agent to leave a desired remaining pattern on the transfer agent; (c) transferring said desired pattern of said conductive layer from said transfer agent to a substrate to establish electrical current paths across said substrate; (d) applying an insulating separating layer of material on the pattern on said substrate which is the same or different from the pattern of step (b); (e) depositing a releasable layer of electrically conductive material on a transfer agent; (f) removing a pattern of the conductive layer deposited in step (e) from said transfer agent to leave a desired remaining pattern of the conductive layer, said desired remaining pattern of the conductive layer being either the same or different from the pattern of step (b); (g) transferring said desired remaining pattern resulting from step (f) to the resultant of step (d); and (h) repeating steps (d) through (g) as desired, each time building on the resultant of the previous step.

Claim 4

A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) removing a pattern of the conductive layer form the transfer agent to leave a desired remaining pattern on the transfer agent; (c) transferring said desired pattern of said conductive layer from said transfer agent to a substrate to establish electrical current paths across said substrate; (d) applying an insulating separating layer of material on the pattern on said substrate which is the same or different from the pattern of step (b); (e) depositing a releasable layer of electrically conductive material on a transfer agent; (f) removing a pattern of the conductive layer deposited in step (e) from said transfer agent to leave a desired remaining pattern of the conductive layer, said desired remaining pattern of the conductive layer being either the same or different from the pattern of step (b); (g) transferring said desired remaining pattern resulting from step (f) to the resultant of step (d); and (h) repeating steps (d) through (g) as desired, each time building on the resultant of the previous step.

Claim 5

A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a substrate; (b) removing a pattern of the conductive layer from said substrate to leave a desired remaining pattern on said substrate and establish electrical current paths across said substrate; (c) applying an insulating separating layer of material on said substrate which is the same or different from the pattern of step (b); (d) depositing a releasable layer of electrically conductive material on the resultant of step (c); and (e) removing a pattern of the conductive layer deposited in step (d) to leave a desired remaining pattern of the conductive layer.

Claim 6

A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a substrate; (b) removing a pattern of the conductive layer from said substrate to leave a desired remaining pattern on said substrate and establish electrical current paths across said substrate; (c) applying an insulating separating layer of material on said substrate which is the same or different from the pattern of step (b); (d) depositing a releasable layer of electrically conductive material on the resultant of step (c); and (e) removing a pattern of the conductive layer deposited in step (d) to leave a desired remaining pattern of the conductive layer.

Claim 7

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) applying an adhesive on a waste removing agent to a desired pattern; (c) joining said waste removing agent and said transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said transfer agent and binds the portion to said water removing agent; (d) separating said waste removing agent and said transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern; (e) applying an adhesive on a substrate; (f) joining said transfer agent and said substrate so that said adhesive on said substrate contacts the remaining conductive pattern on said transfer agent and binds the remaining conductive pattern to said substrate; and (g) separating said transfer agent and said substrate to leave the remaining conductive pattern on said substrate and establish electrical current paths across said substrate.

Claim 8

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) applying an adhesive on a waste removing agent to a desired pattern; (c) joining said waste removing agent and said transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said transfer agent and binds the portion to said water removing agent; (d) separating said waste removing agent and said transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern; (e) applying an adhesive on a substrate; (f) joining said transfer agent and said substrate so that said adhesive on said substrate contacts the remaining conductive pattern on said transfer agent and binds the remaining conductive pattern to said substrate; and (g) separating said transfer agent and said substrate to leave the remaining conductive pattern on said substrate and establish electrical current paths across said substrate.

Claim 12

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) applying an adhesive on a substrate to a desired pattern; (c) joining said transfer agent and said substrate so that said adhesive on said substrate contacts a portion of the conductive layer on said transfer agent and binds the portion to said substrate; and (d) separating said transfer agent and said substrate to remove a pattern of conductive layer from the transfer agent and transfer said removed pattern to said substrate where said removed pattern provides an electrical current path, said removed conductive pattern having the same peripheral configuration as the adhesive pattern.

Claim 13

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) applying an adhesive on a substrate to a desired pattern; (c) joining said transfer agent and said substrate so that said adhesive on said substrate contacts a portion of the conductive layer on said transfer agent and binds the portion to said substrate; and (d) separating said transfer agent and said substrate to remove a pattern of conductive layer from the transfer agent and transfer said removed pattern to said substrate where said removed pattern provides an electrical current path, said removed conductive pattern having the same peripheral configuration as the adhesive pattern.

Claim 15

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) applying an adhesive on a waste removing agent to a desired pattern; (c) joining the waste removing agent and said transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said transfer agent and binds the portion to said waste removing agent; (d) separating said waste removing agent and said transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern; (e) applying an adhesive on a substrate; (f) joining said transfer agent and said substrate so that said adhesive on said substrate contacts the remaining conductive pattern on said transfer agent and binds the remaining conductive pattern to said substrate; (g) separating said transfer agent and said substrate to leave the remaining conductive pattern on said substrate and establish electrical current paths across said substrate; (h) applying a layer of adhesive over said remaining conductive pattern on said substrate, said adhesive layer having at least one void and providing electrical insulation for said remaining conductive pattern; (i) applying an electrically conductive interconnecting agent in the void of the layer of adhesive applied in step (h); (j) repeating steps (a) through (d); (k) joining the transfer agent of step (j) and said substrate so that the adhesive applied on said substrate in step (h) contacts the conductive pattern on said transfer agent of step (j) and binds said conductive pattern to said substrate so that the conductive pattern makes electrical contact with the electrically conductive interconnecting agent; and (l) repeating steps (h) through (k) to provide the desired number of conductive layers which form electric paths.

Claim 16

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) applying an adhesive on a waste removing agent to a desired pattern; (c) joining the waste removing agent and said transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said transfer agent and binds the portion to said waste removing agent; (d) separating said waste removing agent and said transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern; (e) applying an adhesive on a substrate; (f) joining said transfer agent and said substrate so that said adhesive on said substrate contacts the remaining conductive pattern on said transfer agent and binds the remaining conductive pattern to said substrate; (g) separating said transfer agent and said substrate to leave the remaining conductive pattern on said substrate and establish electrical current paths across said substrate; (h) applying a layer of adhesive over said remaining conductive pattern on said substrate, said adhesive layer having at least one void and providing electrical insulation for said remaining conductive pattern; (i) applying an electrically conductive interconnecting agent in the void of the layer of adhesive applied in step (h); (j) repeating steps (a) through (d); (k) joining the transfer agent of step (j) and said substrate so that the adhesive applied on said substrate in step (h) contacts the conductive pattern on said transfer agent of step (j) and binds said conductive pattern to said substrate so that the conductive pattern makes electrical contact with the electrically conductive interconnecting agent; and (l) repeating steps (h) through (k) to provide the desired number of conductive layers which form electric paths.

Claim 17

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) applying an adhesive on a substrate to a desired pattern; (c) joining said transfer agent and said substrate so that said adhesive on said substrate contacts a portion of the conductive layer on said transfer agent and binds the portion to said substrate; (d) separating said transfer agent and said substrate to remove a pattern of conductive layer from the transfer agent and transfer said removed pattern to said substrate where said removed pattern provides electrical current paths, said removed conductive pattern having the same peripheral configurations as the adhesive pattern; (e) applying a layer of adhesive over the removed conductive pattern on said substrate, said adhesive layer having at least one void and providing electrical insulation for said removed conductive pattern; (f) applying an electrically conductive interconnecting agent in the void of the layer of adhesive applied in step (e); (g) depositing a releasable layer of electrically conductive material on a second transfer agent; (h) applying an adhesive on a waste removing agent to a desired pattern; (i) joining said waste removing agent and said second transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said second transfer agent and binds the portion to said waste removing agent; (j) separating said waste removing agent and said second transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern; (k) joining the second transfer agent and said substrate so that the adhesive applied on said substrate in step (e) contacts the remaining conductive pattern on said second transfer agent and binds said pattern to said substrate so that the remaining conductive pattern makes electrical contact with the electrically conductive interconnecting agent of step (f); and (l) repeating steps (e) through (k) to provide the desired number of conductive layers which form electric paths.

Claim 18

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a transfer agent; (b) applying an adhesive on a substrate to a desired pattern; (c) joining said transfer agent and said substrate so that said adhesive on said substrate contacts a portion of the conductive layer on said transfer agent and binds the portion to said substrate; (d) separating said transfer agent and said substrate to remove a pattern of conductive layer from the transfer agent and transfer said removed pattern to said substrate where said removed pattern provides electrical current paths, said removed conductive pattern having the same peripheral configurations as the adhesive pattern; (e) applying a layer of adhesive over the removed conductive pattern on said substrate, said adhesive layer having at least one void and providing electrical insulation for said removed conductive pattern; (f) applying an electrically conductive interconnecting agent in the void of the layer of adhesive applied in step (e); (g) depositing a releasable layer of electrically conductive material on a second transfer agent; (h) applying an adhesive on a waste removing agent to a desired pattern; (i) joining said waste removing agent and said second transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said second transfer agent and binds the portion to said waste removing agent; (j) separating said waste removing agent and said second transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern; (k) joining the second transfer agent and said substrate so that the adhesive applied on said substrate in step (e) contacts the remaining conductive pattern on said second transfer agent and binds said pattern to said substrate so that the remaining conductive pattern makes electrical contact with the electrically conductive interconnecting agent of step (f); and (l) repeating steps (e) through (k) to provide the desired number of conductive layers which form electric paths.

Claim 19

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a substrate; (b) applying an adhesive on a waste removing agent to a desired pattern; (c) joining said waste removing agent and said substrate so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said substrate and binds the portion to said waste removing agent; and (d) separating said waste removing agent and said substrate to remove a pattern of the conductive layer and to leave a desired remaining pattern of the conductive layer and establish electrical current paths, said removed pattern having the same configuration as the pattern of adhesive, said remaining pattern of the conductive layer being the negative of said pattern of adhesive.

Claim 20

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of: (a) depositing a releasable layer of electrically conductive material on a substrate; (b) applying an adhesive on a waste removing agent to a desired pattern; (c) joining said waste removing agent and said substrate so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said substrate and binds the portion to said waste removing agent; and (d) separating said waste removing agent and said substrate to remove a pattern of the conductive layer and to leave a desired remaining pattern of the conductive layer and establish electrical current paths, said removed pattern having the same configuration as the pattern of adhesive, said remaining pattern of the conductive layer being the negative of said pattern of adhesive.

Claim 22

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate comprising the steps of: (a) a depositing a releasable layer of electrically conductive material on a substrate; (b) applying an adhesive on a waste removing agent to a desired pattern; (c) joining said waste removing agent and said substrate so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said substrate and binds the portion to said waste removing agent; (d) separating said waste removing agent and said substrate to remove a pattern of the conductive layer and to leave a desired remaining pattern of the conductive layer and establish electrical current paths, said removed pattern having the same configuration as the pattern of adhesive, said remaining pattern of the conductive layer being the negative of said pattern of adhesive; (e) applying a layer of insulating material over said desired remaining conductive pattern, said insulating layer having at least one void and providing electrical insulation for the conductive layer which it covers; (f) applying a layer of release agent over said insulating layer, said release layer having at least one void, said void intersecting the void in said insulating layer; (g) depositing a second releasable layer of electrically conductive particles on the release layer and on said insulating layer, said second conductive layer making electrical contact with the first conductive layer through the voids in said insulating and release layers; and (h) repeating steps (b) through (d).

Claim 23

A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate comprising the steps of: (a) a depositing a releasable layer of electrically conductive material on a substrate; (b) applying an adhesive on a waste removing agent to a desired pattern; (c) joining said waste removing agent and said substrate so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said substrate and binds the portion to said waste removing agent; (d) separating said waste removing agent and said substrate to remove a pattern of the conductive layer and to leave a desired remaining pattern of the conductive layer and establish electrical current paths, said removed pattern having the same configuration as the pattern of adhesive, said remaining pattern of the conductive layer being the negative of said pattern of adhesive; (e) applying a layer of insulating material over said desired remaining conductive pattern, said insulating layer having at least one void and providing electrical insulation for the conductive layer which it covers; (f) applying a layer of release agent over said insulating layer, said release layer having at least one void, said void intersecting the void in said insulating layer; (g) depositing a second releasable layer of electrically conductive particles on the release layer and on said insulating layer, said second conductive layer making electrical contact with the first conductive layer through the voids in said insulating and release layers; and (h) repeating steps (b) through (d).