US4366342A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Conductively coated embossed articles
Assignee: Coorstek Inc
•
Filing: 1980-09-26
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Granted: 1982-12-28
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Expires: 2000-09-26
Abstract
Abstract Substrates of ceramic or plastic are formed with embossed patterns in bas-relief which are coated by transfer processes to provide conductors. The articles are especially useful for high speed automatic processing and further have improved electrical properties particularly for high frequency applications.
Inventors
- 👤 James G. Breedlove
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/403; H05K3/10; H05K3/12; H05K3/1258; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/62; H10W70/65; H10W70/657; H05K1/00; H05K1/02; H05K1/0284; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09045; H05K2201/09118; H05K2201/09145; H05K2201/09172; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0143; H05K3/4038; H05K3/4053; H05K3/4069; H10W70/67; H10W70/68
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
108 words
As an article of manufacture a monolithic body with two major surfaces having on at least one of said major surfaces and integral therewith and on at least one other surface or edge and integral therewith embossments in bas-relief with sides and with planar outer surfaces, said embossments having a height in the range of 10 to 35% of the thickness of the body, only the planar outer surfaces of all said embossments being covered with electrically conductive coatings, all other surfaces of said monolithic body being uncovered with electrically conductive coating, said coated planar outer surfaces of said embossments together constituting a predetermined pattern for electrical interconnections.
Claim 2
Dependent Claim
108 words
As an article of manufacture a monolithic body with two major surfaces having on at least one of said major surfaces and integral therewith and on at least one other surface or edge and integral therewith embossments in bas-relief with sides and with planar outer surfaces, said embossments having a height in the range of 10 to 35% of the thickness of the body, only the planar outer surfaces of all said embossments being covered with electrically conductive coatings, all other surfaces of said monolithic body being uncovered with electrically conductive coating, said coated planar outer surfaces of said embossments together constituting a predetermined pattern for electrical interconnections.
Claim 3
Dependent Claim
13 words
An article according to claim 1 wherein the body is composed of ceramic.
Claim 4
Dependent Claim
23 words
A ceramic article according to claim 2 wherein the embossments on said one major surface are in two levels connected by an incline.
Claim 5
Dependent Claim
19 words
A ceramic article according to claim 2 additionally having at least one position for reception of a semiconductor die.
Claim 6
Dependent Claim
18 words
A ceramic article according to claim 1 having embossments on both major surfaces and at least one edge.
Claim 7
Dependent Claim
26 words
A ceramic article according to claim 5 having embossments around four edges and further having at least one position for reception of an integrated circuit die.
Claim 8
Dependent Claim
47 words
A monolithic body according to claim 1 having thereon and integral therewith embossments on two major surfaces and comprising at least one position on one major surface of said monolithic body adapted for reception of a die and for connection thereof to embossments on the same surface.
Claim 9
Dependent Claim
31 words
The combination of monolithic body according to claim 7 and semiconductor die with leads bonded thereto mounted on said body and with said leads outwardly bonded to embossments of said body.
Claim 10
Dependent Claim
51 words
The combination of monolithic body and leadbonded semiconductor die according to claim 8 and a preformed cover for said semiconductor die and outer leads thereof adhered to said monolithic body wherein embossments and recesses between embossments peripherally of said outer leads mate with recesses and embossments, respectively, of said preformed cover.
Claim 11
Dependent Claim
19 words
The combination of claim 9 wherein said cover is hermetically sealed to said monolithic body enclosing said lead-bonded semiconductor.
Claim 12
Dependent Claim
16 words
The combination of claim 10 wherein said monolithic body and cover are comprised of refractory ceramic.
Claim 13
Dependent Claim
29 words
A monolithic body according to claim 7 having at least one die attach pad on one major surface parallel to the planar outer surface of embossments on that surface.
Claim 14
Dependent Claim
38 words
A monolithic body according to claim 7 having a central aperture adapted to receive a thin sheet metallic die attach pad and further having means for securing said die attach pad to said body and connecting electrically thereto.
Claim 15
Dependent Claim
70 words
A monolithic body according to claim 7 having on one major surface at least one position for reception of a die, first embossments for attachment to a die mounted in said position and peripheral thereto, second embossments peripheral of said body and beam electrical connectors in at least one plane connecting said first embossments and said second embossment the outer planar surfaces of said first and second embossments being coplanar.
Claim 16
Dependent Claim
15 words
An article according to claim 1 wherein the body is composed of rigid polymeric material.
Claim 17
Dependent Claim
19 words
An article according to claim 15 wherein the outer surfaces of the embossments are in more than one plane.
Claim 18
Dependent Claim
17 words
An article according to claim 15 having at least one position for reception of a semiconductor die.
Claim 19
Dependent Claim
17 words
An article according to claim 15 having embossments on both major surfaces and at least one edge.
Claim 20
Dependent Claim
30 words
An article according to claim 18 having embossments on both major surfaces and around four edges and further having a position for reception of at least one integrated circuit die.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-12-27 | 1986-06-28 | 1986-12-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-12-27 | 1990-06-28 | 1990-12-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-12-27 | 1994-06-28 | 1994-12-28 | $7700.00 | Window Closed / Lapsed |