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US4826943A Expired / Lapsed US ⏱️ 0.0 years remaining

Negative resist material

Assignee: Oki Electric Industry Co Ltd
•
Filing: 1987-07-27
•
Granted: 1989-05-02
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Expires: 2007-07-27
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Abstract

Abstract A negative resist material consists of poly (silsesquioxane) of weight average molecular weight 2000 or more represented by the general formula (1): (CH.sub.2 ═CHCH.sub.2 SiO.sub.3/2).sub.m (ClCH.sub.2 SiO.sub.3/2).sub.n (1) where m and n denote the molar percentages of each component of the polymer, and m+n=100. A method of producing such a resist material and a method of forming a bi-layer resist pattern using the resist material are also disclosed.

Inventors

  • 👤 Toshio Ito
  • 👤 Miwa Sakata
  • 👤 Yoshio Yamashima

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 11:47
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/09; G03F7/094; C; C08; C08G; C08G77/00; C08G77/04; C08G77/22; C08G77/24; G03F7/075; G03F7/0757

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 49 words
A negative resist material, consisting of poly(silsesquioxane) of weight average molecular weight 2000 or more represented by the general formula (1): (CH.sub.2 ═CHCH.sub.2 SiO.sub.3/2).sub.m (ClCH.sub.2 SiO.sub.3/2).sub.n ( 1) where m and n denote the molar percentages of each component of the polymer, wherein both are positive numbers and m+n=100.
Claim 2
Dependent Claim 49 words
A negative resist material, consisting of poly(silsesquioxane) of weight average molecular weight 2000 or more represented by the general formula (1): (CH.sub.2 ═CHCH.sub.2 SiO.sub.3/2).sub.m (ClCH.sub.2 SiO.sub.3/2).sub.n ( 1) where m and n denote the molar percentages of each component of the polymer, wherein both are positive numbers and m+n=100.
Claim 3
Dependent Claim 18 words
A material as set forth in claim 1 wherein the weight average molecular weight is 2500 or more.
Claim 4
Dependent Claim 18 words
A material as set forth in claim 2 wherein the weight average molecular weight is 3000 to 100,000.
Claim 5
Dependent Claim 15 words
A material as set forth in claim 1 wherein m is not more than 30.
Claim 6
Dependent Claim 152 words
A process for manufacturing a silicone resin used as resist material, wherein an oligomer is first obtained by hydrolyzing the trifunctional silane monomers represented by formulas (2) and (3) below for a time and temperature sufficient to produce said oligomer: CH.sub.2 ═CHCH.sub.2 SiX.sub.3 ( 2) ClCH.sub.2 SiY.sub.3 ( 3) X, Y being chlorine, bromine, methoxy, ethoxy or acetoxy that is susceptible to hydrolysis, said oligomer thus obtained is then further polymerized in the presence of an amine basic catalyst in an amount sufficient to further polymerize the oligomers to higher molecular weight polymers having a weight average molecular weight of 2000 or more, said catalytic polymerization reaction being carried out in ketonic solvent for a time and temperature sufficient to give a compound represented by formula (1) below: (CH.sub.2 ═CHCH.sub.2 SiO.sub.3/2).sub.m ·(ClCH.sub.2 SiO.sub.3/2).sub.n ( 1) m and n being molar percentages in which m and n are positive numbers and wherein m+n=100.
Claim 7
Dependent Claim 152 words
A process for manufacturing a silicone resin used as resist material, wherein an oligomer is first obtained by hydrolyzing the trifunctional silane monomers represented by formulas (2) and (3) below for a time and temperature sufficient to produce said oligomer: CH.sub.2 ═CHCH.sub.2 SiX.sub.3 ( 2) ClCH.sub.2 SiY.sub.3 ( 3) X, Y being chlorine, bromine, methoxy, ethoxy or acetoxy that is susceptible to hydrolysis, said oligomer thus obtained is then further polymerized in the presence of an amine basic catalyst in an amount sufficient to further polymerize the oligomers to higher molecular weight polymers having a weight average molecular weight of 2000 or more, said catalytic polymerization reaction being carried out in ketonic solvent for a time and temperature sufficient to give a compound represented by formula (1) below: (CH.sub.2 ═CHCH.sub.2 SiO.sub.3/2).sub.m ·(ClCH.sub.2 SiO.sub.3/2).sub.n ( 1) m and n being molar percentages in which m and n are positive numbers and wherein m+n=100.
Claim 8
Dependent Claim 25 words
A process as set forth in claim 5, wherein the solvent in the polymerization is acetone, methyl isobutyl ketone, methyl ethyl ketone, dioxane or tetrahydrofuran.
Claim 9
Dependent Claim 23 words
A process as set forth in claim 5, wherein the basic catalyst used in the polymerization is triethylamine, tri-n-butylamine, pyridine, lutidine or --collidine.
Claim 10
Dependent Claim 15 words
A process as set forth in claim 5, wherein m is not more than 30.
Claim 11
Dependent Claim 22 words
A negative resist material according to claim 1 wherein m varies from 20 to 80 and n varies from 80 to 20.
Claim 12
Dependent Claim 20 words
A process according to claim 5 wherein m varies from 20 to 80 and n varies from 80 to 20.
Claim 13
Dependent Claim 18 words
A process according to claim 5 wherein the hydrolysis is carried out in the presence of an acid.
Claim 14
Dependent Claim 17 words
A process according to claim 5 wherein the hydrolysis is carried out in the presence of triethylamine.

References Cited (Backward Citations)

DE1049102B Cited
EP0076656A2 Cited
US4564576A Cited
US4481049A Cited
US4702990A Cited
WO1985005470A1 Cited
EP0163538A2 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1992-05-01 1992-10-31 1993-05-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1996-05-01 1996-10-31 1997-05-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2000-05-01 2000-10-31 2001-05-02 $7700.00 Window Closed / Lapsed

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