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US4702990A Expired / Lapsed US ⏱️ 0.0 years remaining

Photosensitive resin composition and process for forming photo-resist pattern using the same

Assignee: NTT Inc
•
Filing: 1985-05-10
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Granted: 1987-10-27
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Expires: 2005-05-10
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Abstract

Abstract The present invention provides a photosensitive resin composition used to form a top resist layer of a multilayer resist system, the composition comprising a photosensitive polyphenylsilsesquioxane represented by the following general formula (I) of: <IMAGE> (I) wherein X is selected from the group consisting of acryloyloxymethyl, methacryloyloxymethyl, and cinnamoyloxymethyl; and l, m and n are zero or positive integers but l and m do not take the value of zero simultaneously; and a bisazide compound added to act as a cross-linking agent. The photosensitive resin composition has high sensitivity to UV light and excellent resistance to reactive ion etching under oxygen gas (O2 RIE).

Inventors

  • 👤 Akinobu Tanaka
  • 👤 Masao Morita
  • 👤 Saburo Imamura
  • 👤 Toshiaki Tamamura
  • 👤 Osamu Kogure

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 21:18
CPC Classifications
C; C08; C08L; C08L33/00; C08L33/04; C08L33/06; C08L33/08; G; G03; G03F; G03F7/00; G03F7/004; G03F7/09; G03F7/094; C08L83/00; C08L83/04

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 131 words
A photosensitive resin composition having a high sensitivity to ultra violet rays, a high resolution power, excellent oxygen reactive ion etching properties adapted for use for forming a pattern in a double layer resist system as a resist layer comprising: (a) a substituted polyphenylsilsesquioxane represented by the following formula ##STR5## wherein X is acryloyloxymethyl, or methacryloyloxymethyl, and 1, m and n are zero or positive integers provided that 1 and m cannot both be zero; and wherein a substitution ratio by the substituent ##STR6## of said substituted polyphenylsilsesquioxane ranges between 10 to 50%, and (b) a bisazide compound selected from the group consisting of 2,6-di(4-azidobenzal)cyclohexanone, and 2,6-di(4-azidobenzal)4-methylcycloohexanone wherein said bisazide compound is present in an amount of from 0.5 to 30 wt % based on the weight of said substituted polyphenylsilsesquioxane.
Claim 2
Dependent Claim 131 words
A photosensitive resin composition having a high sensitivity to ultra violet rays, a high resolution power, excellent oxygen reactive ion etching properties adapted for use for forming a pattern in a double layer resist system as a resist layer comprising: (a) a substituted polyphenylsilsesquioxane represented by the following formula ##STR5## wherein X is acryloyloxymethyl, or methacryloyloxymethyl, and 1, m and n are zero or positive integers provided that 1 and m cannot both be zero; and wherein a substitution ratio by the substituent ##STR6## of said substituted polyphenylsilsesquioxane ranges between 10 to 50%, and (b) a bisazide compound selected from the group consisting of 2,6-di(4-azidobenzal)cyclohexanone, and 2,6-di(4-azidobenzal)4-methylcycloohexanone wherein said bisazide compound is present in an amount of from 0.5 to 30 wt % based on the weight of said substituted polyphenylsilsesquioxane.
Claim 3
Dependent Claim 38 words
The photosensitive resin composition according to claim 1, wherein aid substituted polyphenylsilsesquioxane is methacryloyloxymethyl polyphenylsilsesquioxane wherein said substitution ratio is 45% and said bisazide compound is 2,6-di(4-azidobenzal) 4-methylcyclohexanone and is present in an amount of 5 wt %.
Claim 4
Dependent Claim 36 words
The photosensitive resin composition according to claim 1, wherein said substituted polyphenylsilsesquioxane is methacryloyloxymethyl polyphenylsilsesquioxane having said substitution ratio of 43% and said bisazide compound is 2,6-di(4-azidobenzal)4-methylcyclohexanone and is present in an amount of 5wt %.
Claim 5
Dependent Claim 40 words
The photosensitive resin composition according to claim 1, further comprising a sensitizer selected from the group consisting of aromatic carbonyl compounds, benzoin compounds, pigment redox compounds, azo-compounds, sulfur-containing compounds, organic peroxides, aromatic nitro-compounds, quinone compounds, anthrone compounds and acenaphthene compounds.
Claim 6
Dependent Claim 22 words
The photosensitive resin composition according to claim 1, further comprising a sensitizer selected from the group consisting of Michler's ketone and 1-nitropyrene.

References Cited (Backward Citations)

US3695886A Cited
US4041190A Cited
US3969543A Cited
US4469778A Cited
US4292398A Cited
US4507384A Cited
JPS60525A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-10-26 1991-04-27 1991-10-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-10-26 1995-04-27 1995-10-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-10-26 1999-04-27 1999-10-27 $7700.00 Window Closed / Lapsed

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