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Patent US4812756A successfully refreshed from Google Patents.
US4812756A
Expired / Lapsed
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Contactless technique for semicondutor wafer testing
Assignee: International Business Machines Corp
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Filing: 1987-08-26
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Granted: 1989-03-14
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Expires: 2007-08-26
Abstract
Abstract A contactless technique for semiconductor wafer testing comprising: depositing charges on the top surface of an insulator layer over the wafer to create an inverted surface with a depletion region and thereby a field-induced junction therebelow in the wafer, with an accumulated guard ring on the semiconductor surface therearound. The technique further includes the step of changing the depth to which the depletion region extends below the inverted semiconductor wafer surface to create a surface potential transient, and the step of measuring a parameter of the resultant surface potential transient. This technique may be utilized to make time retention and epi doping concentration measurements. It is especially advantageous for reducing the effects of surface leakage on these measurements. In a preferred embodiment, corona discharges are used to effect the charge deposition configuration. Either corona discharge or photon injection are used to change the depletion region depth.
Inventors
- 👤 Huntington W. Curtis
- 👤 Min-Su Fung
- 👤 Roger L. Verkuil
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 11:06
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/282; G01R31/2831; G01R15/00; G01R15/14; G01R15/16; G01R15/165
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
100 words
A contactless measurement method for testing a doped wafer with an insulator layer disposed thereover, comprising the steps of: depositing charges on the top surface of said insulator layer to create an inverted surface with a depletion region and thereby a field-induced junction in the wafer therebelow with an accumulated guard ring on the wafer surface; changing the depth to which said depletion region extends below said inverted wafer surface to create a surface potential transition, and measuring a parameter of the resultant surface potential transient between the top surface of said insulator layer and the bulk of said wafer.
Claim 2
Dependent Claim
100 words
A contactless measurement method for testing a doped wafer with an insulator layer disposed thereover, comprising the steps of: depositing charges on the top surface of said insulator layer to create an inverted surface with a depletion region and thereby a field-induced junction in the wafer therebelow with an accumulated guard ring on the wafer surface; changing the depth to which said depletion region extends below said inverted wafer surface to create a surface potential transition, and measuring a parameter of the resultant surface potential transient between the top surface of said insulator layer and the bulk of said wafer.
Claim 3
Dependent Claim
26 words
A method as defined in claim 1, wherein said charge depositing step comprises the step of depositing charges by means of at least one corona discharge.
Claim 4
Dependent Claim
35 words
A method as defined in claim 2, wherein said depletion depth changing step comprises the step of applying a second corona discharge on the top surface of said insulator layer above said inverted surface area.
Claim 5
Dependent Claim
25 words
A method as defined in claim 3, wherein said measuring step comprises the step of measuring the time decay rate of said surface potential transient.
Claim 6
Dependent Claim
35 words
A method as defined in claim 4, wherein said depletion depth changing step comprises the step of applying a second corona discharge on the top surface of said insulator layer above said inverted surface area.
Claim 7
Dependent Claim
26 words
A method as defined in claim 1, wherein said depletion depth changing step comprises the step of imposing a forward bias pulse across said field-induced junction.
Claim 8
Dependent Claim
27 words
A method as defined in claim 6, wherein said pulse imposing step comprises the step of injecting photons into said depletion region to generate electron-hole pairs therein.
Claim 9
Dependent Claim
90 words
A method as defined in claim 1, wherein said depletion depth changing step includes the steps of pulsing said wafer above said depletion region deeper into depletion relative to the steady state depletion resulting from said charge depositing step; measuring the approximate instantaneous surface potential transient between the top surface of the insulator layer and the bulk of the semiconductor wafer; and measuring said surface potential between said top surface of the insulator layer and the bulk of the semiconductor wafer after said instantaneous surface potential transient has substantially decayed.
Claim 10
Dependent Claim
43 words
A method as defined in claim 8, wherein said pulsing step comprises the step of depositing charges on to the top surface of said insulator layer above said field-induced junction to cause the depletion region in the semiconductor wafer to increase in depth.
Claim 11
Dependent Claim
65 words
A method as defined in claim 1, wherein said depletion depth changing step comprises the steps of: pulsing said semiconductor wafer with a series of pairs of pulses, with each pulse in a given pulse pair changing the depth of said depletion region to a different depth; measuring the approximate instantaneous surface potential after each pulse; and calculating a doping profile for said semiconductor wafer.
Claim 12
Dependent Claim
32 words
A method as defined to claim 10, wherein said first and second pulse steps each comprise corona-discharge depositing charges on the top surface of said insulator layer above said inverted surface area.
Claim 13
Dependent Claim
148 words
A contactless measurement method for testing a doped semiconductor wafer with an insulator layer disposed thereover, comprising the steps of: depositing a first corona discharge on the top surface of said insulator layer in a first area to accumulate said first area surface; depositing a second corona discharge on the top surface of said insulator layer in a second area within and surrounded by said first area so that said first area provides an accumulated surface guard ring around said second area, said second corona discharge creating an inverted surface second area on said semiconductor wafer with a depletion region and thereby a field-induced junction in the wafer therebelow; changing the depth to which said depletion region extends below said inverted semiconductor wafer surface; and measuring a parameter of the resultant surface potential between the top surface of said insulator layer and the bulk of said semiconductor wafer.
Claim 14
Dependent Claim
148 words
A contactless measurement method for testing a doped semiconductor wafer with an insulator layer disposed thereover, comprising the steps of: depositing a first corona discharge on the top surface of said insulator layer in a first area to accumulate said first area surface; depositing a second corona discharge on the top surface of said insulator layer in a second area within and surrounded by said first area so that said first area provides an accumulated surface guard ring around said second area, said second corona discharge creating an inverted surface second area on said semiconductor wafer with a depletion region and thereby a field-induced junction in the wafer therebelow; changing the depth to which said depletion region extends below said inverted semiconductor wafer surface; and measuring a parameter of the resultant surface potential between the top surface of said insulator layer and the bulk of said semiconductor wafer.
References Cited (Backward Citations)
US111A
Cited
US29918A
Cited
US3748579A
Cited
US3995216A
Cited
USRE29918E
Cited
US4168432A
Cited
JPS5512408A
Cited
US4258077A
Cited
US4253059A
Cited
US4326165A
Cited
US4325025A
Cited
US4415851A
Cited
US4509012A
Cited
US4542340A
Cited
USH111H
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-03-13 | 1992-09-12 | 1993-03-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-13 | 1996-09-12 | 1997-03-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-13 | 2000-09-12 | 2001-03-14 | $7700.00 | Window Closed / Lapsed |