Large scale integrated circuit package

Claim 1

A large scale integrated circuit package, comprising: a ceramic layer section having first and second surfaces and including at least one power supply wiring layer and at least one first grounding wiring layer; a plurality of terminals provided on the first surface of said ceramic layer section; a wiring layer section disposed on the second surface of said ceramic layer section having at least one signal wiring layer provided with a desired wiring pattern sandwiched between two additional wiring layers, said two additional wiring layers respectively being one of a power supply wiring layer and a grounding wiring layer, and insulating layers separating said at least one signal wiring layer from said two additional wiring layers; at least one integrated circuit chip having a plurality of leads and mounted on an upper insulating layer over said at least one signal wiring layer; and a plurality of electrodes disposed on said upper insulating layer electrically connected to said at least one signal layer and leads connecting said electrodes to circuits of said integrated chip, the connection between said electrodes and said leads being a gold-tin eutectic alloy.