US3855693A
Expired / Lapsed
US
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Method for assembling microelectronic apparatus
Assignee: Bull HN Information Systems Italia SpA
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Filing: 1973-04-18
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Granted: 1974-12-24
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Expires: 1993-04-18
Abstract
Abstract A microelectronic device mounted face up on a substrate has leads of ferromagnetic material extending outwardly in cantilevered fashion from the device over circuits on the substrate. The leads, forced toward the surface of the substrate by a magnetic field, are bonded to the substrate circuits.
Inventors
- 👤 C Umbaugh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 00:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2203/00; H05K2203/10; H05K2203/104; H10; H10W; H10W72/00; H10W72/01; H10W72/0198; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
113 words
A method for assembling microelectronic apparatus of the type including a planiform insulator with a conductive run formed on a surface thereof, and a circuit device having one end of an elongated lead of ferromagnetic material affixed to an active face of the device, the other end of the lead extending in cantilevered fashion from the device, the device attached face up to the surface of the planiform insulator, the cantilevered end of the lead aligned over the conductive run, the method comprising the steps of: magnetically deflecTing the cantilevered portion of the lead toward the conductive run to establish mechanical contact therewith, and bonding the deflected lead portion to the conductive run.
Claim 2
Independent Claim
113 words
A method for assembling microelectronic apparatus of the type including a planiform insulator with a conductive run formed on a surface thereof, and a circuit device having one end of an elongated lead of ferromagnetic material affixed to an active face of the device, the other end of the lead extending in cantilevered fashion from the device, the device attached face up to the surface of the planiform insulator, the cantilevered end of the lead aligned over the conductive run, the method comprising the steps of: magnetically deflecTing the cantilevered portion of the lead toward the conductive run to establish mechanical contact therewith, and bonding the deflected lead portion to the conductive run.
Claim 3
Independent Claim
96 words
A method for assembling microelectronic apparatus, comprising the steps of: magnetizing a flexible elongated lead of ferromagnetic material; affixing one end of the magnetized lead to an active face of a circuit chip, another end of the lead extending in cantilevered fashion from the chip; affixing the chip, face up, to a surface of a substrate, the cantilevered end of the lead aligned with an electrical circuit on the surface; magnetically deflecting the cantilevered end of the lead toward the electrical circuit to establish mechanical contact therewith; and bonding the deflected lead end to the circuit.
Claim 4
Independent Claim
96 words
A method for assembling microelectronic apparatus, comprising the steps of: magnetizing a flexible elongated lead of ferromagnetic material; affixing one end of the magnetized lead to an active face of a circuit chip, another end of the lead extending in cantilevered fashion from the chip; affixing the chip, face up, to a surface of a substrate, the cantilevered end of the lead aligned with an electrical circuit on the surface; magnetically deflecting the cantilevered end of the lead toward the electrical circuit to establish mechanical contact therewith; and bonding the deflected lead end to the circuit.
Claim 5
Independent Claim
104 words
A method for assembling microelectronic apparatus, comprising the steps of: affixing an end of an elongated flexible lead of ferromagnetic material to an active face of a circuit device, another end of the lead extending in cantilevered fashion from the device; affixing the face opposite the active face of the circuit device to a surface of a substrate, the cantilevered end of the lead aligned over an electrical circuit formed on the surface of the substrate; magnetizing the lead; magnetically deflecting the cantilevered end of the lead toward the electrical circuit to establish mechanical contact therewith; and bonding the deflected lead to the circuit.
Claim 6
Independent Claim
104 words
A method for assembling microelectronic apparatus, comprising the steps of: affixing an end of an elongated flexible lead of ferromagnetic material to an active face of a circuit device, another end of the lead extending in cantilevered fashion from the device; affixing the face opposite the active face of the circuit device to a surface of a substrate, the cantilevered end of the lead aligned over an electrical circuit formed on the surface of the substrate; magnetizing the lead; magnetically deflecting the cantilevered end of the lead toward the electrical circuit to establish mechanical contact therewith; and bonding the deflected lead to the circuit.
Claim 7
Independent Claim
100 words
A method for assembling microelectronic appatatus, comprising the steps of: affixing an end of an elongated flexible lead of ferromagnetic material to an active face of a circuit device, another end of the lead extending in cantilevered fashion from the device; bonding the face opposite the active face of the circuit device to a surface of a substrate, the cantilevered end of the lead aligned over an electrical circuit formed on the surface of the substrate; magnetically deflecting the cantilevered lead end toward the electrical circuit to establish mechanical contact therewith; and bonding the deflected lead end to the circuit.
Claim 8
Independent Claim
100 words
A method for assembling microelectronic appatatus, comprising the steps of: affixing an end of an elongated flexible lead of ferromagnetic material to an active face of a circuit device, another end of the lead extending in cantilevered fashion from the device; bonding the face opposite the active face of the circuit device to a surface of a substrate, the cantilevered end of the lead aligned over an electrical circuit formed on the surface of the substrate; magnetically deflecting the cantilevered lead end toward the electrical circuit to establish mechanical contact therewith; and bonding the deflected lead end to the circuit.
Claim 9
Dependent Claim
63 words
The method according to claim 4 further including the step of coating the electrical circuit with a solder; and wherein the bonding step includes the steps of heating the assembly comprising the substrate and the circuit chip affixed thereto until reflow of the solder occurs, cooling the assembly to solidify the solder, and removing the magnetic field utilized to deflect the lead end.
Claim 10
Dependent Claim
69 words
The method according to claim 4 further including prior to the deflecting step, the steps of coating the electrical circuit with a solder, and heating the solder until molten; wherein the deflecting step further includes the step of removing the deflecting magnetic field when the deflected lead end is captured by the molten solder; and wherein the bonding step includes the step of cooling the molten solder until solid.
Claim 11
Dependent Claim
26 words
The method according to claim 4 further including prior to the deflecting step, the step of postforming the lead to establish a preferential direction of deflection.
Claim 12
Dependent Claim
25 words
The method according to claim 4 wherein the deflecting step includes the step of magnetizing the lead sufficiently to establish a preferential direction of deflection.
Claim 13
Independent Claim
121 words
A method for assembling microelectronic apparatus, comprising the steps of: affixing an end of an elongated flexible lead of soft ferromagnetic material to an active face of a circuit device, another end of the lead extending in cantilevered fashion from the device; affixing the face opposite the active face of the circuit device to a surface of a substrate, the cantilevered end of the lead aligned over an electrical circuit formed on the surface of the substrate; postforming the lead by mechanically flexing the lead toward the electrical circuit sufficiently to establish a preferential direction for magnetic deflection; magnetically deflecting the postformed lead fuRther toward the electrical circuit to establish mechanical contact therewith; and bonding the deflected lead to the circuit.
Claim 14
Independent Claim
121 words
A method for assembling microelectronic apparatus, comprising the steps of: affixing an end of an elongated flexible lead of soft ferromagnetic material to an active face of a circuit device, another end of the lead extending in cantilevered fashion from the device; affixing the face opposite the active face of the circuit device to a surface of a substrate, the cantilevered end of the lead aligned over an electrical circuit formed on the surface of the substrate; postforming the lead by mechanically flexing the lead toward the electrical circuit sufficiently to establish a preferential direction for magnetic deflection; magnetically deflecting the postformed lead fuRther toward the electrical circuit to establish mechanical contact therewith; and bonding the deflected lead to the circuit.
Claim 15
Independent Claim
129 words
A method for assembling microelectronic apparatus, comprising the steps of: affixing one end of each of a plurality of elongated leads of ferromagnetic material to an active face of a circuit chip, the other ends of the leads extending from the active face in cantilevered fashion; affixing a plurality of the leaded chips face up to a surface of a substrate, the substrate having electrical circuit runs formed on the surface, each of the cantilevered ends of the plurality of leads aligned over a corresponding one of the circuit runs; simultaneously magnetically deflecting the cantilevered lead ends toward the surface of the substrate to establish mechanical contact between the cantilevered lead ends and the corresponding circuit runs; and simultaneously bonding the cantilevered lead ends to the corresponding circuit runs.
Claim 16
Independent Claim
129 words
A method for assembling microelectronic apparatus, comprising the steps of: affixing one end of each of a plurality of elongated leads of ferromagnetic material to an active face of a circuit chip, the other ends of the leads extending from the active face in cantilevered fashion; affixing a plurality of the leaded chips face up to a surface of a substrate, the substrate having electrical circuit runs formed on the surface, each of the cantilevered ends of the plurality of leads aligned over a corresponding one of the circuit runs; simultaneously magnetically deflecting the cantilevered lead ends toward the surface of the substrate to establish mechanical contact between the cantilevered lead ends and the corresponding circuit runs; and simultaneously bonding the cantilevered lead ends to the corresponding circuit runs.
Claim 17
Dependent Claim
41 words
The method according to claim 10 wherein the bonding step includes the steps of: heating the assembly comprising the substrate and the leaded chips until a solder coating on the circuit runs reflows; and cooling the assembly to solidify the solder.
Claim 18
Dependent Claim
28 words
The method according to claim 10 wherein the deflecting step includes the step of magnetizing the plurality of leads to establish a preferential direction for deflecting the leads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-12-23 | 1978-06-24 | 1978-12-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-12-23 | 1982-06-24 | 1982-12-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-12-23 | 1986-06-24 | 1986-12-24 | $7700.00 | Window Closed / Lapsed |