US3579312A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuits from nonmigrating solders
Assignee: EIDP Inc
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Filing: 1969-04-28
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Granted: 1971-05-18
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Expires: 1989-04-28
Abstract
Abstract PRINTED CIRCUITS OF HIGH RELIABLITY FABRICATED WITH A NON-MIGRATING SOLDER COMPRISING AN ALLOY OF GOLD, TIN AND GERMANIUM. THE INVENTION IS PARTICULARILY SUITABLE IN CURCUITS WITH NON-MIGRATING CONDUCTOR COMPOSITIONS.
Inventors
- 👤 Oliver A Short
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 22:05
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/30; B23K35/3013; H; H01; H01B; H01B1/00; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12868; Y10T428/12889; Y10T428/12986
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-05-17 | 1974-11-16 | 1975-05-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-05-17 | 1978-11-16 | 1979-05-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-05-17 | 1982-11-16 | 1983-05-18 | $7700.00 | Window Closed / Lapsed |