Heat resistant hot melt precoat and adhesive compositions

Claim 1

A composition having a Brookfield viscosity of from about 10,000 to about 200,000 centipoise at from about 140° C. to about 180° C., comprising by weight: (1) from 10 parts to about 40 parts of an ethylene polymer selected from the group consisting of (i) an ethylene copolymer having a melt index from 2 to about 50, and, by weight of the copolymer, an ethylene content of from about 67% to about 82% and a mono-unsaturated ester content of from about 33% to about 18%, and (ii) an ethylene terpolymer having a melt index of from about 6 to about 20, and, by weight of the terpolymer, from about 74% to about 76% ethylene, from about 23% to about 26% vinyl ester, and from about 1% to about 3% of a termonomer selected from the group consisting of acrylic acid, methacrylic acid, itaconic acid, acrylamide, beta dimethylaminoethyl methacrylate, beta hydroxyethyl acrylate, diallyl maleate, diallyl phthalate, diallyl ether and ethylene glycol dimethacrylate; (2) from 10 parts to about 30 parts of a heat-resistant polymer having a crystalline melting point greater than 109° C. selected from the group consisting of polybutylene and propylene-butylene copolymer (3) from about 30 parts to about 50 parts of a tackifier resin having a Ring and Ball softening point of from about 85° C. up to about 110° C.; and (4) from about 1 part to about 5 parts of a hydrocarbon wax.