US4752555A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing multilayer circuit board
Assignee: Mitsubishi Electric Corp
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Filing: 1986-05-27
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Granted: 1988-06-21
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Expires: 2006-05-27
Abstract
Abstract A first conductor layer made of a thick film conductor is formed with a predetermined pattern on a substrate. A thick film resistor is then formed to be connected to the first conductor layer. An insulating layer made of a polyimide resin is formed over the substrate, the first conductor layer and the thick film resistor with through holes on the first conductor layer. Then, plating is applied to the whole surface of the insulating layer, the wall surfaces of the through holes and the exposed portions of the first conductor layer and etching is applied thereto with a predetermined pattern so that a second conductor layer is formed.
Inventors
- 👤 Mitsuyuki Takada
- 👤 Yoshiyuki Morihiro
- 👤 Havato Takasago
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 19:23
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/611; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2203/00; H05K2203/14; H05K2203/1453; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/10; H05K3/18; H05K3/181; H05K3/46; H05K3/4644; H05K3/4661
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
126 words
A method of manufacturing a multilayer hybrid integrated circuit comprising the steps of: providing a substrate, forming a pluality of portions of a first thick film conductor layer on said substrate with a predetermined pattern, firing said thick film conductor layer, forming a thick film resistor to be connected to the portions of said first conductor layer, firing said thick film resistor, forming an insulating layer of a resin over said first conductor layer and said resistor, providing through holes in said insulating layer so that said first conductor layer may be partially exposed, and forming a second conductor layer on said insulating layer by applying plating onto said insulating layer and into said through holes and by etching said plated layer with a predetermined pattern.
Claim 2
Independent Claim
126 words
A method of manufacturing a multilayer hybrid integrated circuit comprising the steps of: providing a substrate, forming a pluality of portions of a first thick film conductor layer on said substrate with a predetermined pattern, firing said thick film conductor layer, forming a thick film resistor to be connected to the portions of said first conductor layer, firing said thick film resistor, forming an insulating layer of a resin over said first conductor layer and said resistor, providing through holes in said insulating layer so that said first conductor layer may be partially exposed, and forming a second conductor layer on said insulating layer by applying plating onto said insulating layer and into said through holes and by etching said plated layer with a predetermined pattern.
Claim 3
Dependent Claim
15 words
A method in accordance with claim 1, wherein said resin is a photosensitive polyimide resin.
Claim 4
Dependent Claim
69 words
A method in accordance with claim 1, wherein said step of forming said second conductor layer further comprises the steps of: forming a first plating layer on the whole surface of said substrate by applying electroless plating, forming a second plating layer on the whole surface of said first plating layer by applying electroplating, and etching said first plated layer and said second plated layer with a predetermined pattern.
Claim 5
Dependent Claim
27 words
A method in accordance with claim 3, wherein said first plated layer is a nickel plated layer and said second plated layer is a copper plated layer.
Claim 6
Dependent Claim
15 words
A method in accordance with claim 1, wherein said substrate is made of alumina ceramic.
Claim 7
Dependent Claim
23 words
A method in accordance with claim 1, wherein said first conductor layer is made of silver-palladium or platinum-gold or copper thick film paste.
Claim 8
Dependent Claim
15 words
A method in accordance with claim 1, wherein said resistor is made of ruthenium oxide.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-21 | 1991-12-21 | 1992-06-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-21 | 1995-12-21 | 1996-06-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-21 | 1999-12-21 | 2000-06-21 | $7700.00 | Window Closed / Lapsed |