Method of producing a combination cover

Claim 1

A process for producing a corrosion proof cover for closing and sealing a semi-conductor package that includes the steps of providing a sheet of ceramic material, scoring one surface of said sheet with perpendicular grid lines to divide the sheet into rectangular sections each of which outlines a lid, whereby the lids can be separated individually from the sheet along the scored lines, registering a first template over said one surface to align a frame shaped screening window inside each lid section with the sides of said window being positioned a predetermined distance inside each adjacent grid line, thin filming a metal containing material onto the surface of each lid section through the template window to produce a metal base frame capable of being wetted by a solder to form a bond therebetween, firing the sheet of a desired temperature to fuse each base frame to the underlying ceramic lid section, registering a second template having the same frame shaped window pattern as the first template over said one surface of the ceramic sheet, applying a solder paste to the base frame through said second template to produce a solder frame in registration over each base metal frame, heating the sheet to the reflowed temperature of the solder to join the solder frames to the base metal frames, and separating the individual lids along the scored grid lines.