US4749626A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Whisker resistant tin coatings and baths and methods for making such coatings
Assignee: Olin Corp
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Filing: 1986-07-03
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Granted: 1988-06-07
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Expires: 2006-07-03
Abstract
Abstract The present invention relates to an addition to tin coating solutions for inhibiting the growth of tin whiskers. The addition comprises a concentration of a metal salt selected from the group consisting of palladium salt, silver salt, nickel salt, iron salt, cadmium salt, platinum salt, gold salt, indium salt, ruthenium salt and cobalt salt. In a preferred embodiment, the metal salt addition is either a palladium salt such as palladium chloride or a silver salt such as silver sulfate.
Inventors
- 👤 Igor V. Kadija
- 👤 Julius C. Fister
- 👤 Joseph Winter
- 👤 Arvind Parthasarathi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:17
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/48; C25; C25D; C25D21/00; C25D21/10; C25D3/00; C25D3/02; C25D3/56; C25D3/60; C25D1/00; C25D1/04; H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12708; Y10T428/12715; Y10T428/12722
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
103 words
A method for inhibiting tin whisker growth on a substrate material having a tin containing coating, said method comprising: preparing a tin coating solution containing a metal salt selected from the group consisting of palladium salts, silver salts, nickel salts, iron salts, cadmium salts, platinum salts, gold salts, indium salts, ruthenium salts, and cobalt salts; and said preparing step comprising providing an initial tin containing solution and adding said metal salt to said initial solution in a concentration above the saturation point of the initial solution to form a metal salt saturated solution; and applying said tin coating solution to said substrate material.
Claim 2
Independent Claim
103 words
A method for inhibiting tin whisker growth on a substrate material having a tin containing coating, said method comprising: preparing a tin coating solution containing a metal salt selected from the group consisting of palladium salts, silver salts, nickel salts, iron salts, cadmium salts, platinum salts, gold salts, indium salts, ruthenium salts, and cobalt salts; and said preparing step comprising providing an initial tin containing solution and adding said metal salt to said initial solution in a concentration above the saturation point of the initial solution to form a metal salt saturated solution; and applying said tin coating solution to said substrate material.
Claim 3
Dependent Claim
36 words
The method of claim 1 further comprising: diluting said metal salt saturated solution by adding said metal salt saturated solution to an additional quantity of said initial solution, said diluted solution forming said tin coating solution.
Claim 4
Dependent Claim
45 words
The method of claim 2 wherein said salt adding step comprises: adding a sufficient amount of palladium salt to said initial solution so that said tin coating solution contains a concentration of palladium in the range of from about 5 ppm to about 10,000 ppm.
Claim 5
Dependent Claim
45 words
The method of claim 2 wherein said salt adding step comprises: adding a sufficient amount of palladium salt to said initial solution so that said tin coating solution contains a concentration of palladium in the range of from about 20 ppm to about 1000 ppm.
Claim 6
Dependent Claim
47 words
The method of claim 2 wherein said metal salt adding step comprises: adding a sufficient amount of a silver salt to said initial solution so that said tin coating solution contains silver in a concentration in the range of from about 50 ppm to about 50,000 ppm.
Claim 7
Dependent Claim
47 words
The method of claim 2 wherein said metal salt adding step comprises: adding a sufficient amount of a silver salt to said initial solution so that said tin coating solution contains silver in a concentration in the range of from about 500 ppm to about 5000 ppm.
Claim 8
Dependent Claim
19 words
The method of claim 1 wherein said applying step comprises immersing said substrate material in said tin coating solution.
Claim 9
Dependent Claim
25 words
The method of claim 1 wherein said applying step comprises electrolessly depositing the tin containing coating from said tin coating solution onto said substrate material.
Claim 10
Dependent Claim
24 words
The method of claim 1 wherein said applying step comprises electrodepositing the tin containing coating from said tin coating solution onto said substrate material.
Claim 11
Dependent Claim
34 words
The method of claim 1 wherein said applying step comprises applying said coating solution to said substrate material at a mixing rate in the range of from about 2 cm/sec to about 100 cm/sec.
Claim 12
Dependent Claim
34 words
The method of claim 1 wherein said applying step comprises applying said coating solution to said substrate material at a mixing rate in the range of from about 5 cm/sec to about 30 cm/sec.
Claim 13
Dependent Claim
46 words
A tin coating solution for imparting tin whisker formation resistance to a substrate material coated with a tin containing material, said solution comprising a tin containing solution having a concentration of a palladium salt, the palladium being present in an amount greater than about 50 ppm.
Claim 14
Dependent Claim
46 words
A tin coating solution for imparting tin whisker formation resistance to a substrate material coated with a tin containing material, said solution comprising a tin containing solution having a concentration of a palladium salt, the palladium being present in an amount greater than about 50 ppm.
Claim 15
Dependent Claim
24 words
The tin coating solution of claim 12 wherein said palladium concentration is in the range of from about 50 ppm to about 1000 ppm.
Claim 16
Dependent Claim
88 words
A composite structure for use in electrical and electronic applications comprising: a metal or metal alloy substrate; a whisker resistant tin coating on at least one surface of said substrate, said tin coating consisting essentially of from about 0.1 w/o to about 20 w/o palladium for inhibiting tin whisker growth and the balance essentially tin; and said tin coating having an essentially smooth surface and a relatively fine grain structure of less than about 1 micron with said substrate being formed from copper or a copper base alloy.
Claim 17
Dependent Claim
88 words
A composite structure for use in electrical and electronic applications comprising: a metal or metal alloy substrate; a whisker resistant tin coating on at least one surface of said substrate, said tin coating consisting essentially of from about 0.1 w/o to about 20 w/o palladium for inhibiting tin whisker growth and the balance essentially tin; and said tin coating having an essentially smooth surface and a relatively fine grain structure of less than about 1 micron with said substrate being formed from copper or a copper base alloy.
Claim 18
Dependent Claim
55 words
A composite structure for use in electrical and electronic applications comprising: a metal or metal alloy substrate; and a whisker resistant tin coating on at least one surface of said substrate, said tin coating consisting of from about 0.1 w/o to about 20 w/o palladium for inhibiting tin whisker growth and the balance essentially tin.
Claim 19
Dependent Claim
55 words
A composite structure for use in electrical and electronic applications comprising: a metal or metal alloy substrate; and a whisker resistant tin coating on at least one surface of said substrate, said tin coating consisting of from about 0.1 w/o to about 20 w/o palladium for inhibiting tin whisker growth and the balance essentially tin.
Claim 20
Dependent Claim
26 words
The composite structure of claim 15 further comprising: said coating consisting of from about 0.5 w/o to about 10 w/o palladium and the balance essentially tin.
Claim 21
Dependent Claim
26 words
The composite structure of claim 15 further comprising: said coating consisting of from about 1 w/o to about 5 w/o palladium and the balance essentially tin.
Claim 22
Dependent Claim
19 words
The composite structure of claim 15 further comprising: said substrate being formed from copper or a copper base alloy.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-07 | 1991-12-07 | 1992-06-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-07 | 1995-12-07 | 1996-06-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-07 | 1999-12-07 | 2000-06-07 | $7700.00 | Window Closed / Lapsed |