Patent US4710854A successfully refreshed from Google Patents.
US4710854A
Expired / Lapsed
US
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Hybrid multilayer wiring board
Assignee: Hitachi Ltd
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Filing: 1987-03-10
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Granted: 1987-12-01
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Expires: 2007-03-10
Abstract
Abstract A multilayer wiring board structure includes a plurality of conductor layers and insulation layers interleaved between each ones of the conductor layers. The conductor layers includes power (or ground) line layers and signal line layers, and one type of insulation layer having lower relative permittivity and another type of insulation layer having higher relative permittivity is used between power (ground) line layers interposed by signal line layer(s).
Inventors
- 👤 Minoru Yamada
- 👤 Motoyo Wajima
- 👤 Akira Masaki
- 👤 Akio Takahashi
- 👤 Keiichirou Nakanishi
- 👤 Katuo Sugawara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 22:52
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/024; H05K1/03; H05K1/0313; H05K1/032; H05K1/0346; H05K1/11; H05K1/115; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/0158; H05K2201/0183; H05K2201/0191; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09327; H05K2201/095; H05K2201/09536; H05K3/4623
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
228 words
A multilayer wiring board comprising a plurality of conductor layers formed one over another each serving as either one of a power/ground line layer and a signal line layer, and a plurality of insulation layers each interposed between two adjacent ones of said conductor layers, wherein each of said insulation layers which are respectively interposed between two adjacent ones of said conductor layers serving as two power/ground layers with at least one conductor layer serving as a signal line layer also interposed between the two adjacent power/ground line layers is constituted by first and second insulating layer members formed one on the other, said second insulating layer member having a relative permittivity higher than that of said first insulating layer member, said first insulating layer member is disposed in a portion between the adjacent conductor layers serving as power/ground line layers where the density of electric flux created by a signal propagating in said signal line layer is relatively high and said second insulating layer member is disposed in a portion between the adjacent conductor layers serving as power/ground line layers where the density of electric flux created by a signal propagating in said signal line layer is relatively low, and the ratio of the thickness of said second insulating layer member with respect to that of said second insulating layer member is not smaller than about 1.4.
Claim 2
Dependent Claim
228 words
A multilayer wiring board comprising a plurality of conductor layers formed one over another each serving as either one of a power/ground line layer and a signal line layer, and a plurality of insulation layers each interposed between two adjacent ones of said conductor layers, wherein each of said insulation layers which are respectively interposed between two adjacent ones of said conductor layers serving as two power/ground layers with at least one conductor layer serving as a signal line layer also interposed between the two adjacent power/ground line layers is constituted by first and second insulating layer members formed one on the other, said second insulating layer member having a relative permittivity higher than that of said first insulating layer member, said first insulating layer member is disposed in a portion between the adjacent conductor layers serving as power/ground line layers where the density of electric flux created by a signal propagating in said signal line layer is relatively high and said second insulating layer member is disposed in a portion between the adjacent conductor layers serving as power/ground line layers where the density of electric flux created by a signal propagating in said signal line layer is relatively low, and the ratio of the thickness of said second insulating layer member with respect to that of said second insulating layer member is not smaller than about 1.4.
Claim 3
Dependent Claim
25 words
A multilayer wiring board according to claim 1, wherein said ratio between the thicknesses of said first and second insulating layer members is substantially 2.
Claim 4
Dependent Claim
105 words
A multilayer wiring board according to claim 1, wherein four successively adjacent conductor layers serve as a first power/ground line layer, a first signal line layer, a second signal line layer and a second power/ground line layer, in which one said first insulating layer member is provided between said first power/ground line layer and first signal line layer and another one said first insulating layer member is provided between said second signal layer and second power/ground line layer, and more than one combination essentially consisting of said four successively adjacent conductor layers and said first insulating layer members are included in the multilayer wiring board.
Claim 5
Dependent Claim
52 words
A multilayer wiring board according to claim 3, wherein said second insulating layer members are provided one for each of between two adjacent ones of said power/ground line layers with no signal line layer interposed therebetween and between two adjacent ones of said signal lines with no power/ground line layer interposed therebetween.
Claim 6
Dependent Claim
25 words
A multilayer wiring board according to claim 1, wherein the outermost one of said insulation layers is constituted by one said second insulating layer member.
Claim 7
Dependent Claim
75 words
A multilayer wiring board according to claim 1, wherein a plurality of said conductor layers serving as signal line layer and a plurality of different ones of said conductor layers serving as power/ground line layers are alternately arranged with said first and second insulating layer members being alternately interposed between one of said conductor layers serving as signal lines layers and one of said conductor layers serving as power/ground line layers adjacent to each other.
Claim 8
Dependent Claim
21 words
A multilayer wiring board according to claim 1, wherein said first insulating layer member is made of a fluorocarbon derivatives polymer.
Claim 9
Dependent Claim
21 words
A multilayer wiring board according to claim 1, wherein said second insulating layer member is made of a maleimide derivatives resin.
Claim 10
Dependent Claim
119 words
A multilayer wiring board comprising a plurality of insulative sheets laminated one over another with insulation layers interposed therebetween, wherein each of said insulative sheets has a conductor layer on at least one of its surfaces, said conductor layer serving as one of a power/ground line layer and a signal line layer, the conductor layer serving as a power/ground line layer is opposed to the conductor layer serving as a signal line layer, and each of said insulation layers has a relative permittivity smaller than that of said insulative sheet and has a thickness such that the ratio of the thickness of said insulative sheet with respect to that of said insulation layer is not smaller than about 1.4.
Claim 11
Dependent Claim
119 words
A multilayer wiring board comprising a plurality of insulative sheets laminated one over another with insulation layers interposed therebetween, wherein each of said insulative sheets has a conductor layer on at least one of its surfaces, said conductor layer serving as one of a power/ground line layer and a signal line layer, the conductor layer serving as a power/ground line layer is opposed to the conductor layer serving as a signal line layer, and each of said insulation layers has a relative permittivity smaller than that of said insulative sheet and has a thickness such that the ratio of the thickness of said insulative sheet with respect to that of said insulation layer is not smaller than about 1.4.
Claim 12
Dependent Claim
42 words
A multilayer wiring board according to claim 9, wherein each of at least two of said insulative sheets has on its surface of conductor layer serving as a signal line layer and another conductor layer serving as a power/ground line layer, respectively.
Claim 13
Dependent Claim
80 words
A multilayer wiring board according to claim 9, wherein at least one of said insulative sheets has on its surfaces conductor layers serving as power/ground line layers, at least different one of said insulative sheets has on its surfaces conductor layers serving as signal line layers, and said at least one insulative sheets with said conductor layers serving as power/ground line layers and said at least one insulative sheet with conductor layers serving as signal line layers are alternately laminated.
Claim 14
Dependent Claim
21 words
A multilayer wiring board according to claim 9, wherein each of said insulation layers is made of a fluorocarbon derivatives polymer.
Claim 15
Dependent Claim
20 words
A multilayer wiring board according to claim 9, wherein each of said insulative sheets is made of maleimide derivatives resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-11-30 | 1991-06-01 | 1991-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-30 | 1995-06-01 | 1995-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-30 | 1999-06-01 | 1999-12-01 | $7700.00 | Window Closed / Lapsed |