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US4684435A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing thin film transistor

Assignee: Sharp Corp
•
Filing: 1986-02-13
•
Granted: 1987-08-04
•
Expires: 2006-02-13
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Abstract

Abstract An improved process for manufacturing a thin film transistor uses two masks for etching and therefore one mask alignment. The technical effect of said process is to provide the thin film transistor with low cost and enhanced yield.

Inventors

  • 👤 Kohhei Kishi
  • 👤 Mitsuhiro Koden
  • 👤 Fumiaki Funada

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 09:02
CPC Classifications
H; H10; H10D; H10D86/00; H10D86/01; H10D86/021; H10D86/0231; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/136; G02F1/1362; G02F1/1368; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0316; H10D30/0321; H10D30/60; H10D30/67; H10D30/6729; H10D30/673; H10D30/6732; H10D30/674; H10D30/6741; H10D30/6743; H10D30/6746; H10D86/40; H10D86/60; H10P; H10P50/00; H10P50/69; H10P50/691; Y; Y10; Y10S; Y10S148/00; Y10S148/10; Y10S438/00; Y10S438/942; Y10S438/948; Y10S438/951

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 161 words
A process for manufacturing a thin film transistor comprising: forming four layers by successively laminating on an insulation substrate a metal layer as a gate electrode, a first insulation layer as a gate insulation layer, a semiconductor layer and an electrode layer which makes an ohmic contact with said semiconductor layer, etching said four layers by coating on a photoresist and developing it to form a pattern then applying etchant to etch said four layers in said pattern, laminating on a second insulation layer without removing the photoresist which remains after the etching step, removing the remaining photoresist by a lift-off process, laminating on a transparent conductive layer as a source electrode and a drain electrode or display electrode, etching said transparent conductive layer and said electrode layer which makes an ohmic contact with said semiconductor layer to separate them into layer portions and to thereby provide said transparent conductive layer as said source electrode and said drain or display electrode.
Claim 2
Dependent Claim 161 words
A process for manufacturing a thin film transistor comprising: forming four layers by successively laminating on an insulation substrate a metal layer as a gate electrode, a first insulation layer as a gate insulation layer, a semiconductor layer and an electrode layer which makes an ohmic contact with said semiconductor layer, etching said four layers by coating on a photoresist and developing it to form a pattern then applying etchant to etch said four layers in said pattern, laminating on a second insulation layer without removing the photoresist which remains after the etching step, removing the remaining photoresist by a lift-off process, laminating on a transparent conductive layer as a source electrode and a drain electrode or display electrode, etching said transparent conductive layer and said electrode layer which makes an ohmic contact with said semiconductor layer to separate them into layer portions and to thereby provide said transparent conductive layer as said source electrode and said drain or display electrode.

References Cited (Backward Citations)

US3904461A Cited
US4358748A Cited
US4502917A Cited
US4404731A Cited
US4428796A Cited
JPS60182134A Cited
US4624737A Cited
JPS60186022A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-08-03 1991-02-02 1991-08-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-08-03 1995-02-02 1995-08-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-08-03 1999-02-02 1999-08-04 $7700.00 Window Closed / Lapsed

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