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US4670086A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for the growth of structures based on group IV semiconductor materials

Assignee: Nokia Bell Labs
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Filing: 1985-06-14
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Granted: 1987-06-02
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Expires: 2005-06-14
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Abstract

Abstract Single crystal layers of Group IV semiconductor materials, such as silicon, are grown on insulating substrates. The fabrication of this structure is achieved by forming on a single crystal substrate a layer of an insulating material, such as a silicon oxide. A small via hole is produced in the insulating layer to leave a portion of the underlying substrate uncovered. A precursor material is deposited on the insulating layer so that it covers at least a portion of the insulating layer and also contacts the substrate at the via hole. The precursor layer is then formed into a single crystal by inducing growth on the substrate at the via hole and propagating this growth through the precursor layer.

Inventors

  • 👤 Harry J. Leamy

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 06:13
CPC Classifications
C; C30; C30B; C30B13/00; C30B13/34; C30B1/00; C30B1/02; C30B1/026; C30B29/00; C30B29/60

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 220 words
A process for forming a single crystal region of a semiconductor material on a region of insulating material of a composite structure, said structure having a surface including a section of said insulating material and a section of single crystal material comprising the steps of forming said single crystal region of a semiconductor material so that it contacts said section of single crystal material of said composite structure wherein said semiconductor material comprises a Group IV element and said single crystal region of semiconductor material is produced by the procedure comprising the steps of forming a precursor region that interfaces with said single crystal material of said composite structure, initiating growth of said single crystal region of semiconductor material at the interface of said precursor region with said single crystal material of said composite structure, and propagating said growth into said precursor region continuously from said interface by producing a chemical potential gradient in said precursor region to complete said single crystal region in the absence of polycrystalline propagation initiated from a polycrystalline region wherein said polycrystalline propagation under the conditions of said chemical potential gradient limits said propagation from said interface, whereby said single crystal region overlies at least a portion of said insulating material and whereby said single crystal region is suitable for use in producing electronic devices.
Claim 2
Dependent Claim 220 words
A process for forming a single crystal region of a semiconductor material on a region of insulating material of a composite structure, said structure having a surface including a section of said insulating material and a section of single crystal material comprising the steps of forming said single crystal region of a semiconductor material so that it contacts said section of single crystal material of said composite structure wherein said semiconductor material comprises a Group IV element and said single crystal region of semiconductor material is produced by the procedure comprising the steps of forming a precursor region that interfaces with said single crystal material of said composite structure, initiating growth of said single crystal region of semiconductor material at the interface of said precursor region with said single crystal material of said composite structure, and propagating said growth into said precursor region continuously from said interface by producing a chemical potential gradient in said precursor region to complete said single crystal region in the absence of polycrystalline propagation initiated from a polycrystalline region wherein said polycrystalline propagation under the conditions of said chemical potential gradient limits said propagation from said interface, whereby said single crystal region overlies at least a portion of said insulating material and whereby said single crystal region is suitable for use in producing electronic devices.
Claim 3
Dependent Claim 14 words
The process of claim 1 wherein said surface of said composite structure is planar.
Claim 4
Dependent Claim 27 words
The process of claim 1 wherein said surface of said composite structure includes said section of single crystal material in a distinct plane from said insulating region.
Claim 5
Dependent Claim 25 words
The process of claim 1 wherein said single crystal material of said composite structure comprises a member of the group consisting of silicon and germanium.
Claim 6
Dependent Claim 28 words
The process of either claim 1 or 4 wherein said insulating material comprises a member chosen from the group consisting of a silicon oxide or a silicon nitride.
Claim 7
Dependent Claim 14 words
The process of either claim 1 or 4 wherein said precursor region comprises silicon.
Claim 8
Dependent Claim 14 words
The process of claim 6 wherein said precursor region comprises an alloy of silicon.
Claim 9
Dependent Claim 22 words
The process of claim 6 wherein said composite structure is formed by oxidizing a portion of said composite structure which comprises silicon.
Claim 10
Dependent Claim 13 words
The process of claim 1 wherein said composite structure comprises a supporting substrate.
Claim 11
Dependent Claim 11 words
The process of claim 1 wherein said precursor region comprises germanium.
Claim 12
Dependent Claim 21 words
The process of claim 1 wherein a plurality of said sections of single crystal material of said composite structure is employed.
Claim 13
Dependent Claim 20 words
The process of claim 1 including the step of electrically isolating said essential single crystal region of said semiconductor material.
Claim 14
Dependent Claim 39 words
The process of claim 1 wherein said composite structure is formed by etching a hole in an insulating layer to uncover portions of an underlying section of single crystal material to provide said insulating material and said crystal material.

References Cited (Backward Citations)

US3389022A Cited
US3413157A Cited
US3549432A Cited
US4046618A Cited
US4066482A Cited
US3928092A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-06-01 1990-12-01 1991-06-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-06-01 1994-12-01 1995-06-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-06-01 1998-12-01 1999-06-02 $7700.00 Window Closed / Lapsed

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