Selective epitaxial growth technique for fabricating waveguides for integrated optics

Claim 1

A method of making an optical waveguide of semiconductor material comprising the steps of: forming a first mask on a surface of a monocrystalline semiconductor substrate of one conductivity type, wherein said surface is parallel to a relatively fast growing crystallographic plane of semiconductor material to be epitaxially deposited on said monocrystalline semiconductor substrate, patterning said first mask to remove a portion thereof providing an opening through the mask exposing an elongated area of said surface, wherein the opposite side walls of the opening formed in the first mask by the removal of the masked portion and bounding the exposed surface area of said substrate are arranged parallel to relatively slow growing crystallographic planes of semiconductor material to be epitaxially deposited on said semiconductor substrate as compared to relatively fast growing crystallographic planes of said semiconductor substrate, epitaxially depositing a first semiconductor material of said one conductivity type on the exposed surface area of said semiconductor substrate in said relatively fast growing crystallographic plane to provide a first continuous raised elongated epitaxially semiconductor layer having smooth planar faceted growth side surfaces confined by the opposite sidewalls of the opening in the mask which are in relatively slow growing crystallographic planes and a smooth planar faceted growth top surface which is in a relatively fast growing crystallographic plane, said first semiconductive material having a free carrier concentration, resistivity, and refractive index substantially the same as said semiconductor substrate, forming a second mask on said substrate surface in the same position as said first mask and to a thickness wherein said second mask covers the top surface of said first epitaxial semiconductor layer, patterning said second mask to remove a portion thereof providing an opening through the mask exposing the top surface of said first continuous epitaxial semiconductor layer, wherein the opposite sidewalls of the opening formed in said second mask and bounding the exposed top surface of said first continuous epitaxial semiconductor layer are arranged parallel to said relatively slow growing crystallographic planes of semiconductor material to be epitaxially deposited on the top surface of said first continuous epitaxial semiconductor layer, and epitaxially depositing a second semiconductor material of said one conductivity type on the exposed top surface of said first continuous epitaxial semiconductor layer in a said relatively fast growing crystallographic plane to provide a second continuous elongated epitaxial semiconductor layer which has each of its surface including top, bottom, and side surfaces formed as a smooth planar faceted growth surface, said second semiconductor material having a relatively low free carrier concentration and correspondingly high resistivity as compared to a relatively high free carrier concentration and correspondingly low resitivity of said first semiconductor material.

Claim 2

A method of making an optical waveguide of semiconductor material comprising the steps of: forming a first mask on a surface of a monocrystalline semiconductor substrate of one conductivity type, wherein said surface is parallel to a relatively fast growing crystallographic plane of semiconductor material to be epitaxially deposited on said monocrystalline semiconductor substrate, patterning said first mask to remove a portion thereof providing an opening through the mask exposing an elongated area of said surface, wherein the opposite side walls of the opening formed in the first mask by the removal of the masked portion and bounding the exposed surface area of said substrate are arranged parallel to relatively slow growing crystallographic planes of semiconductor material to be epitaxially deposited on said semiconductor substrate as compared to relatively fast growing crystallographic planes of said semiconductor substrate, epitaxially depositing a first semiconductor material of said one conductivity type on the exposed surface area of said semiconductor substrate in said relatively fast growing crystallographic plane to provide a first continuous raised elongated epitaxially semiconductor layer having smooth planar faceted growth side surfaces confined by the opposite sidewalls of the opening in the mask which are in relatively slow growing crystallographic planes and a smooth planar faceted growth top surface which is in a relatively fast growing crystallographic plane, said first semiconductive material having a free carrier concentration, resistivity, and refractive index substantially the same as said semiconductor substrate, forming a second mask on said substrate surface in the same position as said first mask and to a thickness wherein said second mask covers the top surface of said first epitaxial semiconductor layer, patterning said second mask to remove a portion thereof providing an opening through the mask exposing the top surface of said first continuous epitaxial semiconductor layer, wherein the opposite sidewalls of the opening formed in said second mask and bounding the exposed top surface of said first continuous epitaxial semiconductor layer are arranged parallel to said relatively slow growing crystallographic planes of semiconductor material to be epitaxially deposited on the top surface of said first continuous epitaxial semiconductor layer, and epitaxially depositing a second semiconductor material of said one conductivity type on the exposed top surface of said first continuous epitaxial semiconductor layer in a said relatively fast growing crystallographic plane to provide a second continuous elongated epitaxial semiconductor layer which has each of its surface including top, bottom, and side surfaces formed as a smooth planar faceted growth surface, said second semiconductor material having a relatively low free carrier concentration and correspondingly high resistivity as compared to a relatively high free carrier concentration and correspondingly low resitivity of said first semiconductor material.

Claim 3

A method of making an optical waveguide of semiconductor material comprising the steps of: forming a first mask on a surface of a monocrystalline semiconductor substrate of one conductivity type, wherein said surface is parallel to a relatively fast growing crystallographic plane of semiconductor material to be epitaxially deposited on said monocrystalline semiconductor substrate, patterning said first mask to remove a portion thereof providing an opening through the mask exposing an elongated area of said surface, wherein the opposite sidewalls of the opening formed in the first mask by the removal of the masked portion and bounding the exposed surface area of said substrate are arranged parallel to relatively slow growing crystallographic planes of semiconductor material to be epitaxially deposited on said semiconductor substrate as compared to relatively fast growing crystallographic planes of said semiconductor substrate, epitaxially depositing a semiconductor material of said one conductivity type on the exposed surface area of said semiconductor substrate in said relatively fast growing crystallographic plane to provide a continuous raised elongated epitaxial semiconductor layer having smooth planar faceted growth side surfaces confined by the opposite sidewalls of the opening in the mask which are in relatively slow growing crystallographic planes and a smooth planar faceted growth top surface which is in a relatively fast growing crystallographic plane, said semiconductor material being epitaxially deposited under gas phased conditions such that said raised elongated epitaxial semiconductor layer is formed with a relatively low free carrier concentration and correspondingly high resistivity as compared to a relatively high free carrier concentration in relatively low resistivity of said semiconductor substrate.

Claim 4

A method of making an optical waveguide of semiconductor material comprising the steps of: forming a first mask on a surface of a monocrystalline semiconductor substrate of one conductivity type, wherein said surface is parallel to a relatively fast growing crystallographic plane of semiconductor material to be epitaxially deposited on said monocrystalline semiconductor substrate, patterning said first mask to remove a portion thereof providing an opening through the mask exposing an elongated area of said surface, wherein the opposite sidewalls of the opening formed in the first mask by the removal of the masked portion and bounding the exposed surface area of said substrate are arranged parallel to relatively slow growing crystallographic planes of semiconductor material to be epitaxially deposited on said semiconductor substrate as compared to relatively fast growing crystallographic planes of said semiconductor substrate, epitaxially depositing a semiconductor material of said one conductivity type on the exposed surface area of said semiconductor substrate in said relatively fast growing crystallographic plane to provide a continuous raised elongated epitaxial semiconductor layer having smooth planar faceted growth side surfaces confined by the opposite sidewalls of the opening in the mask which are in relatively slow growing crystallographic planes and a smooth planar faceted growth top surface which is in a relatively fast growing crystallographic plane, said semiconductor material being epitaxially deposited under gas phased conditions such that said raised elongated epitaxial semiconductor layer is formed with a relatively low free carrier concentration and correspondingly high resistivity as compared to a relatively high free carrier concentration in relatively low resistivity of said semiconductor substrate.