Ceramic composition for dielectrics

Claim 2

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one insulating glass in an amount by weight of 30-99.4%; at least one organic binder in an amount by weight of 0.5-30%; and at least one oxidizing agent consisting essentially of at least one inorganic peroxide selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.1-40%, wherein oxygen from said at least one inorganic peroxide decomposes and removes said at least one organic binder in the ceramic composition during sintering of the composition, and enhances the sinterability of the ceramic composition.

Claim 3

A ceramic composition as claimed in claim 1, wherein said at least one inorganic peroxide is strontium peroxide.

Claim 4

A ceramic composition as claimed in claim 1, wherein said at least one inorganic peroxide is present in the form of powder having an average particle size of 0.5-10 μm.

Claim 5

A ceramic composition as claimed in claim 1, wherein said insulating glass is a silicate glass.

Claim 6

A ceramic composition as claimed in claim 7, wherein said silicate glass consists essentially of SiO 2 and at least one component selected from the group consisting of Al 2 O 3 , B 2 O 3 , MgO, PbO, BaO, ZnO, Li 2 O, TiO 2 , CaO and ZrO 2 .

Claim 7

A ceramic composition as claimed in claim 1, wherein said insulating glass is a crystallizable glass which is crystallized through heat treatment thereof.

Claim 8

A ceramic composition as claimed in claim 6, wherein said crystallizable glass is selected from the group consisting of: a glass composition consisting essentially of SiO 2 , Al 2 O 3 , CaO, ZnO and TiO 2 ; a glass composition consisting essentially of SiO 2 , MgO, BaO, B 2 O 3 and ZnO; a glass composition consisting essentially of SiO 2 , Al 2 O 3 , PbO and CaO; a glass composition consisting essentially of SiO 2 , Al 2 O 3 , CaO, B 2 O 3 and MgO; and a glass composition consisting essentially of SiO 2 , B 2 O 3 , PbO and CaO.

Claim 9

A ceramic composition as claimed in claim 1, wherein said organic binder is selected from the group consisting of ethyl cellulose, polyvinyl butyral resins, polyethylene resins, polystyrene resins, polyvinyl alcohol resins, acrylic resins, methacrylic resins, and acrylate-methacrylate copolymers.

Claim 10

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one insulating glass; at least one material selected from the group consisting of refractory fillers and oxide additives wherein a ratio of weight percent of insulating glass to said material is 90/10-5/95; at least one organic binder in an amount by weight of 0.5-30%; and at least one oxidizing agent consisting essentially of at least one inorganic peroxide selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.1-40%, wherein oxygen from said at least one inorganic peroxide decomposes and removes said at least one organic binder in the ceramic composition during sintering of the composition, and enhances the sinterability of the ceramic composition.

Claim 11

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one insulating glass; at least one material selected from the group consisting of refractory fillers and oxide additives wherein a ratio of weight percent of insulating glass to said material is 90/10-5/95; at least one organic binder in an amount by weight of 0.5-30%; and at least one oxidizing agent consisting essentially of at least one inorganic peroxide selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.1-40%, wherein oxygen from said at least one inorganic peroxide decomposes and removes said at least one organic binder in the ceramic composition during sintering of the composition, and enhances the sinterability of the ceramic composition.

Claim 12

A ceramic composition as claimed in claim 9, wherein said at least one inorganic peroxide is strontium peroxide.

Claim 13

A ceramic composition as claimed in claim 9, wherein said at least one inorganic peroxide is present in the form of powder having an average particle size of 0.5-10 μm.

Claim 14

A ceramic composition as claimed in claim 9, wherein said insulating glass is a silicate glass.

Claim 15

A ceramic composition as claimed in claim 12, wherein said silicate glass consists essentially of SiO 2 and at least one component selected from the group consisting of Al 2 O 3 , B 2 O 3 , MgO, PbO, BaO, ZnO, Li 2 O, TiO 2 , CaO and ZrO 2 .

Claim 16

A ceramic composition as claimed in claim 9, wherein said insulating glass is a crystallizable glass which is crystallized through heat treatment thereof.

Claim 17

A ceramic composition as claimed in claim 14, wherein said crystallizable glass is selected from the group consisting of: a glass composition consisting essentially of SiO 2 , Al 2 O 3 , CaO, ZnO and TiO 2 ; a glass composition consisting essentially of SiO 2 , MgO, BaO, B 2 O 3 and ZnO; a glass composition consisting essentially of SiO 2 , Al 2 O 3 , PbO and CaO; a glass composition consisting essentially of SiO 2 , Al 2 O 3 , CaO, B 2 O 3 , and MgO; and a glass composition consisting essentially of SiO 2 , B 2 O 3 , PbO and CaO.

Claim 18

A ceramic composition as claimed in claim 9, wherein said organic binder is selected from the group consisting of ethyl cellulose, polyvinyl butyral resins, polyethylene resins, polystyrene resins, polyvinyl alcohol resins, acrylic resins, methacrylic resins, and acrylate-methacrylate copolymers.

Claim 19

A ceramic composition for an electronic circuit board, a hybrid circuit, an integrated circuit package, or a multilayer ceramic structure, consisting essentially of: at least one insulating glass selected from the group of glasses consisting of: a silicate glass consisting essentially of SiO 2 and at least one component selected from the group consisting of Al 2 O 3 , B 2 O 3 , MgO, PbO, BaO, ZnO, Li 2 O, TiO 2 , CaO and ZrO 2 ; a crystallizable glass consisting essentially of Si 2 O 3 , Al 2 O 3 , CaO, ZnO and TiO 2 ; a crystallizable glass consisting essentially of SiO 2 , MgO, BaO, B 2 O 3 , and ZnO; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , PbO, and CaO; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , CaO, B 2 O 3 , and MgO; and a crystallizable glass consisting essentially of SiO 2 , B 2 O 3 , PbO and CaO, wherein each of said crystallizable glasses is crystallized through heat treatment thereof; at least one material selected from the group consisting of alumina, zirconia, silica, mullite, cordierite, cobalt oxide, zinc oxide, praseodymium oxide and bismuth oxide, wherein a ratio of weight percent of insulating glass to said material is 90/10-5/95; at least one organic binder selected from the group consisting of ethyl cellulose, polyvinyl butyral resins, polyethylene resins, polystyrene resins, polyvinyl alcohol resins, acrylic resins, methacrylic resins and acrylate-methacrylate copolymers, in an amount by weight of 0.5-30%; and at least one oxidizing agent consisting essentially of at least one inorganic peroxide selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.1-40%, wherein oxygen from said at least one inorganic peroxide decomposes and removes said at least one organic binder in the ceramic composition during sintering of the composition, and enhances the sinterability of the ceramic composition.

Claim 20

A ceramic composition for an electronic circuit board, a hybrid circuit, an integrated circuit package, or a multilayer ceramic structure, consisting essentially of: at least one insulating glass selected from the group of glasses consisting of: a silicate glass consisting essentially of SiO 2 and at least one component selected from the group consisting of Al 2 O 3 , B 2 O 3 , MgO, PbO, BaO, ZnO, Li 2 O, TiO 2 , CaO and ZrO 2 ; a crystallizable glass consisting essentially of Si 2 O 3 , Al 2 O 3 , CaO, ZnO and TiO 2 ; a crystallizable glass consisting essentially of SiO 2 , MgO, BaO, B 2 O 3 , and ZnO; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , PbO, and CaO; a crystallizable glass consisting essentially of SiO 2 , Al 2 O 3 , CaO, B 2 O 3 , and MgO; and a crystallizable glass consisting essentially of SiO 2 , B 2 O 3 , PbO and CaO, wherein each of said crystallizable glasses is crystallized through heat treatment thereof; at least one material selected from the group consisting of alumina, zirconia, silica, mullite, cordierite, cobalt oxide, zinc oxide, praseodymium oxide and bismuth oxide, wherein a ratio of weight percent of insulating glass to said material is 90/10-5/95; at least one organic binder selected from the group consisting of ethyl cellulose, polyvinyl butyral resins, polyethylene resins, polystyrene resins, polyvinyl alcohol resins, acrylic resins, methacrylic resins and acrylate-methacrylate copolymers, in an amount by weight of 0.5-30%; and at least one oxidizing agent consisting essentially of at least one inorganic peroxide selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.1-40%, wherein oxygen from said at least one inorganic peroxide decomposes and removes said at least one organic binder in the ceramic composition during sintering of the composition, and enhances the sinterability of the ceramic composition.

Claim 21

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one insulating glass; at least one material selected from the group consisting of alumina, zirconia, silica, mullite, cordierite, cobalt oxide, zinc oxide, praseodymium oxide and bismuth oxide, wherein a ratio of weight percent of insulating glass to said material is 90/10-5/95; at least one organic binder in an amount by weight of 0.5-30%; and at least one oxidizing agent consisting essentially of at least one inorganic peroxide selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.1-40%, wherein oxygen from said at least one inorganic peroxide decomposes and removes said at least one organic binder in the ceramic composition during sintering of the composition, and enhances the sinterability of the ceramic composition.

Claim 22

A ceramic composition for an electronic circuit board, a hybrid integrated circuit, an integrated circuit package or a multilayer ceramic structure, consisting essentially of: at least one insulating glass; at least one material selected from the group consisting of alumina, zirconia, silica, mullite, cordierite, cobalt oxide, zinc oxide, praseodymium oxide and bismuth oxide, wherein a ratio of weight percent of insulating glass to said material is 90/10-5/95; at least one organic binder in an amount by weight of 0.5-30%; and at least one oxidizing agent consisting essentially of at least one inorganic peroxide selected from the group consisting of calcium peroxide and strontium peroxide in an amount by weight of 0.1-40%, wherein oxygen from said at least one inorganic peroxide decomposes and removes said at least one organic binder in the ceramic composition during sintering of the composition, and enhances the sinterability of the ceramic composition.