Fabrication technique for integrated circuits

Claim 1

A method for forming conductive contacts to first and second regions separated by a third region of a respective one of an n-type and a p-type substrate having a portion of a surface thereof covered to a first thickness with an insulating layer having a slot therethrough which extends substantially to said surface, said surface in said slot being covered with an isolation layer, said slot having a sidewall structure having first and second edges, a conductive island covering said surface portion within said slot to substantially said first thickness and having a bank having first and second areas facing, respectively, said first and second edges of said sidewall structure, said first region and said second region being non-contiguous with one another, being located, respectively, between said first area of said bank and said first edge of said sidewall structure and said second area of said bank and said second edge of said sidewall structure, and being non-contiguous with said bank, said third region being generally beneath said island, said first and second regions being a respective other of n-type and p-type than is said substrate, comprising: providing said substrate with said island covered with a first sacrificial layer which extends beyond said first thickness; covering said insulating layer, said conductive island, and said isolation layer with a generallly conformal coating of a dielectric material; anisotropically orthogonally etching said coating of said dielectric material off of said insulating layer, said isolation layer and said first sacrificial layer while retaining sacrificial portions of said dielectric material between said first area of said bank and said first region and between said second area of said bank and said second region; removing said first sacrificial layer from said island and said isolation layer from said first region and said second region without significantly removing said sacrificial portions of said dielectric material; depositing a conductive layer in covering relation upon said insulating layer, said island, said first region and said second region; laying down a second sacrificial layer upon said conductive layer; and etching away said second sacrificial layer and said sacrificial portions of said dielectric material while not significantly removing said conductive layer.

Claim 2

A method for forming conductive contacts to first and second regions separated by a third region of a respective one of an n-type and a p-type substrate having a portion of a surface thereof covered to a first thickness with an insulating layer having a slot therethrough which extends substantially to said surface, said surface in said slot being covered with an isolation layer, said slot having a sidewall structure having first and second edges, a conductive island covering said surface portion within said slot to substantially said first thickness and having a bank having first and second areas facing, respectively, said first and second edges of said sidewall structure, said first region and said second region being non-contiguous with one another, being located, respectively, between said first area of said bank and said first edge of said sidewall structure and said second area of said bank and said second edge of said sidewall structure, and being non-contiguous with said bank, said third region being generally beneath said island, said first and second regions being a respective other of n-type and p-type than is said substrate, comprising: providing said substrate with said island covered with a first sacrificial layer which extends beyond said first thickness; covering said insulating layer, said conductive island, and said isolation layer with a generallly conformal coating of a dielectric material; anisotropically orthogonally etching said coating of said dielectric material off of said insulating layer, said isolation layer and said first sacrificial layer while retaining sacrificial portions of said dielectric material between said first area of said bank and said first region and between said second area of said bank and said second region; removing said first sacrificial layer from said island and said isolation layer from said first region and said second region without significantly removing said sacrificial portions of said dielectric material; depositing a conductive layer in covering relation upon said insulating layer, said island, said first region and said second region; laying down a second sacrificial layer upon said conductive layer; and etching away said second sacrificial layer and said sacrificial portions of said dielectric material while not significantly removing said conductive layer.