Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
157 words
A method of fabricating a semiconductive programmable read only memory cell, comprising: (a) locally oxidizing selected surface regions of a body of crystalline semiconductor of first type conductivity to produce a plurality of isolated semiconductor regions in said body; (b) introducing dopant impurities of opposite second type conductivity in a first one of said isolated semiconductor regions to produce a first region of second type conductivity forming a semiconductive junction with said body at a location beneath the surface of said body; (c) depositing a thin amorphous layer of silicon over the surface of said first region and coupled therewith to produce an antifuse element that is electrically and irreversibly switchable from high resistance state to low resistance state; and (d) introducing dopant impurities of first type conductivity in a second one of said isolated semiconductor regions lying adjacent to said first isolated region to form a low resistance contact region at the surface of said body.
Claim 2
Independent Claim
157 words
A method of fabricating a semiconductive programmable read only memory cell, comprising: (a) locally oxidizing selected surface regions of a body of crystalline semiconductor of first type conductivity to produce a plurality of isolated semiconductor regions in said body; (b) introducing dopant impurities of opposite second type conductivity in a first one of said isolated semiconductor regions to produce a first region of second type conductivity forming a semiconductive junction with said body at a location beneath the surface of said body; (c) depositing a thin amorphous layer of silicon over the surface of said first region and coupled therewith to produce an antifuse element that is electrically and irreversibly switchable from high resistance state to low resistance state; and (d) introducing dopant impurities of first type conductivity in a second one of said isolated semiconductor regions lying adjacent to said first isolated region to form a low resistance contact region at the surface of said body.
Claim 3
Dependent Claim
36 words
A method according to claim 1 and further including forming a low resistance semiconductor region of first type conductivity within said body spaced from and lying beneath said semiconductive junction and said low resistance contact region.
Claim 4
Dependent Claim
21 words
A method according to claim 1 wherein said thin amorphous layer of silicon is formed by plasma enhanced chemical vapor deposition.
Claim 5
Dependent Claim
17 words
A method according to claim 1, wherein said thin amorphous layer of silicon is formed by sputtering.
Claim 6
Dependent Claim
19 words
A method according to claim 1, wherein said thin amorphous layer of silicon is formed by evaporation in vacuum.
Claim 7
Dependent Claim
21 words
A method according to claim 1, wherein said thin amorphous layer of silicon is formed by low pressure chemical vapor deposition.
Claim 8
Dependent Claim
16 words
A method according to claim 1, wherein said body of semiconductor is formed of monocrystalline silicon.
Claim 9
Dependent Claim
59 words
A method according to claim 1, wherein the step in (c) is preceded by the step of forming a conductive layer along the surface of said first region followed by the step of depositing said thin amorphous layer of silicon on said conductive layer, said conductive layer forming contact to both said first region and said amorphous silicon layer.
Claim 10
Dependent Claim
18 words
The invention according to claim 8, wherein said conductive layer is formed as a metallic silicide alloy layer.
Claim 11
Dependent Claim
30 words
The invention according to claim 9, wherein said conductive layer is formed from a metallic silicide alloy selected from the group consisting of platinum silicide, platinel silicide, and palladium silicide.
Claim 12
Independent Claim
135 words
A method of fabricating a programmable read-only memory cell according to the steps of: creating means to laterally electrically isolate islands of an upper zone of first type conductivity in a monocrystalline semiconductive body; introducing an impurity of opposite second type conductivity into a first of the islands to produce therein a region of second type conductivity extending along the upper surface of the island and forming a PN junction fully laterally bounded by the side boundaries of the island; depositing above the region a highly resistive amorphous semiconductive layer which is electrically coupled to the region and which is electrically and irreversibly switchable to a low resistance state; and creating a path of first type conductivity in the body extending from the PN junction through a second of the islands to its upper surface.
Claim 13
Independent Claim
135 words
A method of fabricating a programmable read-only memory cell according to the steps of: creating means to laterally electrically isolate islands of an upper zone of first type conductivity in a monocrystalline semiconductive body; introducing an impurity of opposite second type conductivity into a first of the islands to produce therein a region of second type conductivity extending along the upper surface of the island and forming a PN junction fully laterally bounded by the side boundaries of the island; depositing above the region a highly resistive amorphous semiconductive layer which is electrically coupled to the region and which is electrically and irreversibly switchable to a low resistance state; and creating a path of first type conductivity in the body extending from the PN junction through a second of the islands to its upper surface.
Claim 14
Dependent Claim
17 words
A method according to claim 11 wherein the step of depositing comprises depositing substantially undoped semiconductive material.
Claim 15
Dependent Claim
20 words
A method according to claim 11 wherein the step of depositing comprises depositing semiconductive material doped with a semiconductor impurity.
Claim 16
Dependent Claim
24 words
A method according to claim 11 wherein the step of depositing comprises depositing semiconductive material doped with an impurity of the first type conductivity.
Claim 17
Dependent Claim
15 words
A method according to claim 14 wherein the step of depositing is performed by sputtering.
Claim 18
Dependent Claim
40 words
A method according to claim 11 further including, before the step of depositing, the step of forming an electrically conductive layer in ohmic contact with the region along its upper surface, the amorphous layer being deposited on the conductive layer.
Claim 19
Dependent Claim
19 words
A method according to claim 16 wherein: the body comprises silicon; and the conductive layer comprises a metal silicide.
Claim 20
Dependent Claim
49 words
A method according to claim 11 further including, before the step of depositing, the step of forming first and second metal silicide layers in ohmic contact with the region and the second island, respectively, along their upper surfaces, the amorphous layer being deposited on the first metal silicide layer.
Claim 21
Dependent Claim
60 words
A method according to claim 18 further including the step of forming first and second electrically conductive layers on the first metal silicide layer and the amorphous layer, respectively, the amorphous layer being switched to its low resistance state upon application of a voltage of sufficient magnitude between the conductive layers in the forward conductive direction of the PN junction.