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MIS Device employing elemental pnictide or polyphosphide insulating layers

Assignee: Stauffer Chemical Co
•
Filing: 1983-06-29
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Granted: 1986-01-28
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Expires: 2003-06-29
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Abstract

Abstract Metal-insulator-semiconductor devices are formed on III-V semiconductors utilizing a pnictide rich insulating layer. The layer may be applied by vacuum evaporation, sputtering, chemical vapor deposition, and from a liquid melt. Gallium arsenide, indium phosphide, and gallium phosphide substrates are insulated with an alkali metal high pnictide polypnictide, preferably a polyphosphide, having the formula MP x where x is equal to or greater than 15, including new forms of phosphorus grown in the presence of an alkali metal where x is much greater than 15. A KP 15 layer is preferred. They may also be insulated with a layer of a solid elemental pnictide, namely phosphorus, arsenic, antimony or bismuth applied by one of the above named processes. An elemental phosphorus layer is preferred. A silicon nitride, Si 3 N 4 , layer may be added on top of the pnictide layer to increase the breakdown voltage of the insulating layer.

Inventors

  • 👤 Diego Olego
  • 👤 David G. Brock
  • 👤 John A. Baumann
  • 👤 William E. Spicer

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 03:12
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6329; H10P14/6332; H10P14/6334; H10P14/6342; H10P14/69; H10P14/692; H10P14/6938; H10P14/6939; H10W; H10W74/00; H10W74/10; H10W74/131; H10W74/137; H10W74/40; H10W74/43; H10P14/694; H10P14/6943; H10P14/69433

Claims Analysis

Total Claims: 20
Claim 1
Independent Claim 31 words
A metal insulating semiconductor device comprising: a semiconductor substrate formed from a compound of III-V semiconductor material, and an insulating layer formed from an elemental pniotide material on said semiconductor substrate.
Claim 2
Dependent Claim 31 words
A metal insulating semiconductor device comprising: a semiconductor substrate formed from a compound of III-V semiconductor material, and an insulating layer formed from an elemental pniotide material on said semiconductor substrate.
Claim 3
Dependent Claim 42 words
A metal insulating semiconductor device comprising: a semiconductor substrate formed from a compound of III-V semiconductor material, and an insulated layer formed from a polypniotide or said semiconductor substrate, said polypniotide being a compound formed from an alkali metal and a pniotide.
Claim 4
Dependent Claim 42 words
A metal insulating semiconductor device comprising: a semiconductor substrate formed from a compound of III-V semiconductor material, and an insulated layer formed from a polypniotide or said semiconductor substrate, said polypniotide being a compound formed from an alkali metal and a pniotide.
Claim 5
Dependent Claim 41 words
A metal insulating semiconductor device as claimed in claims 1 or 2 further including: a layer of silicon nitride on said insulating layer for providing both a second insulating layer and for increasing the breakdown voltage of said first insulating layer.
Claim 6
Dependent Claim 26 words
A metal insulating semiconductor device comprising: a substrate formed from a semiconductor material, and an insulating layer formed from an elemental pniotide material on said substrate.
Claim 7
Dependent Claim 26 words
A metal insulating semiconductor device comprising: a substrate formed from a semiconductor material, and an insulating layer formed from an elemental pniotide material on said substrate.
Claim 8
Dependent Claim 38 words
A metal insulating semiconductor device comprising: a substrate formed from a semiconductor material, and an insulating layer formed from a polypniotide on said semiconductor substrate said polypniotide being a compound formed from an alkali metal and a pniotide.
Claim 9
Dependent Claim 38 words
A metal insulating semiconductor device comprising: a substrate formed from a semiconductor material, and an insulating layer formed from a polypniotide on said semiconductor substrate said polypniotide being a compound formed from an alkali metal and a pniotide.
Claim 10
Dependent Claim 13 words
The device as claimed in claim 4 wherein said elemental pniotide is phosphorus.
Claim 11
Dependent Claim 30 words
The device as claimed in claim 5 wherein said polypniotide is MP x , where M is an alkali metal and M is in the range of 15 to infinity.
Claim 12
Dependent Claim 11 words
The device of claim 1 wherein said layer is elemental phosphorus.
Claim 13
Dependent Claim 11 words
The device of claim 2 wherein said polypniotide is a polyphosphide.
Claim 14
Dependent Claim 25 words
That which is claimed in claim 9 wherein said polyphosphide has the formula MP x , where x is equal to or greater than 15.
Claim 15
Dependent Claim 13 words
That which is claimed in claim 10 wherein x is equal to 15.
Claim 16
Dependent Claim 13 words
That which is claimed in claim 10 wherein M is an alkali metal.
Claim 17
Dependent Claim 13 words
That which is claimed in claim 12 wherein x is equal to 15.
Claim 18
Dependent Claim 14 words
That which is claimed in claim 12 wherein x very much greater than 15.
Claim 19
Dependent Claim 13 words
That which is claimed in claim 11 where M is an alkali metal.
Claim 20
Dependent Claim 14 words
That which is claimed in claim 9 wherein said polyphosphide is KP 15 .

References Cited (Backward Citations)

US3383567A Cited
US3571673A Cited
US3700978A Cited
US3877060A Cited
JPS56125875A Cited
US4438351A Cited
JPS5882570A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-01-27 1989-07-29 1990-01-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-01-27 1993-07-29 1994-01-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-01-27 1997-07-29 1998-01-28 $7700.00 Window Closed / Lapsed

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