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US4567501A Expired / Lapsed US ⏱️ 0.0 years remaining

Resistor structure in integrated injection logic

Assignee: Fujitsu Ltd
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Filing: 1983-12-22
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Granted: 1986-01-28
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Expires: 2003-12-22
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Abstract

Abstract An I 2 L semiconductor device in which a p-type buried layer is formed on an n + type silicon substrate by diffusion of boron, an epitaxial n-type layer is grown on the p-type buried layer, a p + type region is formed in a ring shape to surround the epitaxial n-type layer with the bottom of the p + region reaching to the p-type buried layer, an n-type resistor layer is formed in the epitaxial n-type layer by diffusion of phosphorus, and connections for electrodes are formed by diffusion of n + type impurities in such a manner that the connections make contact with the resistor layer.

Inventors

  • 👤 Takeshi Fukuda

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 03:27
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/60; H10D84/65; H10D84/658; H10D1/00; H10D1/40; H10D1/43; H10D84/01; H10D84/0112; H10D84/0116; H10D84/02; H10D84/03; H10D84/038; H10D84/101; H10D84/121; H10D84/125; H10D84/611

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 181 words
A semiconductor device including an integrated injection logic device and a resistor element comprising: a semiconductor substrate of a first conductivity type; a semiconductor layer of said first conductivity type formed on said semiconductor substrate; a buried layer of a second conductivity type opposite to said first conductivity type formed between said semiconductor substrate and said semiconductor layer; a ring shaped diffused region of said second conductivity type reaching to said buried layer and surrounding an area of said semiconductor layer on said buried layer; a resistor semiconductor region of said first conductivity type formed in said area; a pair of diffused regions of the first conductivity type formed in said area and contacting said resistor region; and means for electrically connecting said pair of diffused regions to wirings of said semiconductor device; said integrated injection logic device including a pair of spaced apart regions of said second conductivity type and being located in said semiconductor layer and spaced from said substrate, and an additional region of said first conductivity type positioned within one of said pair of spaced apart regions.
Claim 2
Dependent Claim 181 words
A semiconductor device including an integrated injection logic device and a resistor element comprising: a semiconductor substrate of a first conductivity type; a semiconductor layer of said first conductivity type formed on said semiconductor substrate; a buried layer of a second conductivity type opposite to said first conductivity type formed between said semiconductor substrate and said semiconductor layer; a ring shaped diffused region of said second conductivity type reaching to said buried layer and surrounding an area of said semiconductor layer on said buried layer; a resistor semiconductor region of said first conductivity type formed in said area; a pair of diffused regions of the first conductivity type formed in said area and contacting said resistor region; and means for electrically connecting said pair of diffused regions to wirings of said semiconductor device; said integrated injection logic device including a pair of spaced apart regions of said second conductivity type and being located in said semiconductor layer and spaced from said substrate, and an additional region of said first conductivity type positioned within one of said pair of spaced apart regions.
Claim 3
Dependent Claim 44 words
A semiconductor device of claim 1, wherein said substrate is an n + type substrate, said buried layer is a p-type layer, said semiconductor layer is an epitaxial n-type layer grown on said buried layer, and said diffused region is a p-type diffused layer.

References Cited (Backward Citations)

US3575741A Cited
US3865648A Cited
US3916218A Cited
US4106049A Cited
US4087900A Cited
US4101349A Cited
US4228450A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1989-01-27 1989-07-29 1990-01-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1993-01-27 1993-07-29 1994-01-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1997-01-27 1997-07-29 1998-01-28 $7700.00 Window Closed / Lapsed

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