Method of making electrically conductive thin epoxy bond

Claim 1

A method of providing a thin, electrically conductive bond between two conductive substrates comprising the step of bonding the substrates together using a non-conductive epoxy to which uniformly sized, electrically conductive microspheres have been added, whereby the bond thus formed will be made by the non-conductive epoxy, the bond thickness will corrrespond to the diameter of said microspheres, and electrical conductivity between said substrates will be provided by the conductive path formed by said microspheres.

Claim 2

A method of providing a thin, electrically conductive bond between two conductive substrates comprising the step of bonding the substrates together using a non-conductive epoxy to which uniformly sized, electrically conductive microspheres have been added, whereby the bond thus formed will be made by the non-conductive epoxy, the bond thickness will corrrespond to the diameter of said microspheres, and electrical conductivity between said substrates will be provided by the conductive path formed by said microspheres.

Claim 3

A method of electrically bonding two bodies together comprising the steps of: (a) sputtering a conductive layer onto each of said substrates; (b) applying uniformly sized electrically conductive microspheres to said sputtered layer on one of said substrates; and (c) bonding said substrates together using a non-conductive epoxy, such that said sputtered layers are in electrical contact with said electrically conductive microspheres and said non-conductive epoxy bonds said substrates together, whereby the bond thus formed will by made by the non-conductive epoxy, the bond thickness will correspond to the diameter of said microspheres, and electrical conductivity between said substrates will be provided by the conductive path formed by said microspheres.

Claim 4

A method of electrically bonding two bodies together comprising the steps of: (a) sputtering a conductive layer onto each of said substrates; (b) applying uniformly sized electrically conductive microspheres to said sputtered layer on one of said substrates; and (c) bonding said substrates together using a non-conductive epoxy, such that said sputtered layers are in electrical contact with said electrically conductive microspheres and said non-conductive epoxy bonds said substrates together, whereby the bond thus formed will by made by the non-conductive epoxy, the bond thickness will correspond to the diameter of said microspheres, and electrical conductivity between said substrates will be provided by the conductive path formed by said microspheres.

Claim 5

A method of electrically bonding two bodies together comprising the steps of: (a) sputtering a conductive layer onto one of said substrates; (b) applying uniformly sized electrically conductive microspheres onto said sputtered layer; (c) sputtering a second conductive layer onto said first sputtered layer overcoating said microspheres and leaving gaps between said overcoated microspheres; (d) filling said gaps with non-conductive epoxy; and (e) bonding said second body to said first body by applying said second body to said non-conductive epoxy, whereby electrical contact will occur through said sputtered layers and said microspheres.

Claim 6

A method of electrically bonding two bodies together comprising the steps of: (a) sputtering a conductive layer onto one of said substrates; (b) applying uniformly sized electrically conductive microspheres onto said sputtered layer; (c) sputtering a second conductive layer onto said first sputtered layer overcoating said microspheres and leaving gaps between said overcoated microspheres; (d) filling said gaps with non-conductive epoxy; and (e) bonding said second body to said first body by applying said second body to said non-conductive epoxy, whereby electrical contact will occur through said sputtered layers and said microspheres.