US4354911A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of selectively depositing a metal on a surface by means of sputtering
Assignee: AT&T Inc
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Filing: 1981-08-07
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Granted: 1982-10-19
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Expires: 2001-08-07
Abstract
Abstract It has been discovered that by cleaning a substrate having a negative ink pattern of a desired circuit in a plasma comprising 60/40 oxygen/argon and then sputtering a thin (10-50 Angstroms) layer of catalytic copper thereover, the treated substrate when exposed to an electroless plating bath will selectively plate only in the areas where there is no ink.
Inventors
- 👤 Thomas C. Dodd
- 👤 John A. Emerson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:04
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1605; H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/046; H05K3/048; H05K3/22; H05K3/24; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2203/00; H05K2203/09; H05K2203/095; H05K3/10; H05K3/14; H05K3/16
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
84 words
A method of selectively depositing a metallic pattern on a substrate including the steps of: coating the substrate with a suitable ink in accordance with the negative of the desired pattern; cleaning the negative patterned substrate in a plasma comprising at least 60% oxygen and an inert gas; sputtering a catalytic metal coating onto the substrate in a plasma comprising at least 60% oxygen and an inert gas; and electrolessly depositing a metallic coating on the substrate in accordance with the desired metallic pattern.
Claim 2
Independent Claim
84 words
A method of selectively depositing a metallic pattern on a substrate including the steps of: coating the substrate with a suitable ink in accordance with the negative of the desired pattern; cleaning the negative patterned substrate in a plasma comprising at least 60% oxygen and an inert gas; sputtering a catalytic metal coating onto the substrate in a plasma comprising at least 60% oxygen and an inert gas; and electrolessly depositing a metallic coating on the substrate in accordance with the desired metallic pattern.
Claim 3
Dependent Claim
18 words
A method recited in claim 1 wherein the ink is a strippable ink or a thermographic printing ink.
Claim 4
Dependent Claim
32 words
The method recited in claim 1 wherein the substrate is treated prior to coating of the ink thereon so as to increase adhesion of the ink and catalytic metal to the substrate.
Claim 5
Dependent Claim
26 words
The method recited in claim 3 wherein the substrate comprises a rubber modified epoxy resin which is swelled and etched prior to coating with the ink.
Claim 6
Dependent Claim
12 words
The method recited in claim 1 wherein the inert gas is argon.
Claim 7
Independent Claim
25 words
The method recited in clai 1 wherein both cleaning and sputtering is done in a plasma consisting essentially of 60% O 2 and 40% Ar.
Claim 8
Independent Claim
25 words
The method recited in clai 1 wherein both cleaning and sputtering is done in a plasma consisting essentially of 60% O 2 and 40% Ar.
Claim 9
Independent Claim
18 words
The method recited in claims 1 and 6 wherein cleaning and sputtering are accomplished without breaking the vacuum.
Claim 10
Dependent Claim
19 words
The method recited in claim 1 wherein cleaning and sputtering are done in a vacuum of about 2.5 microns.
Claim 11
Dependent Claim
14 words
The method recited in multiple claim 7 wherein the sputtered catalytic metal is copper.
Claim 12
Dependent Claim
18 words
The method recited in claim 9 wherein the copper is sputtered to a thickness of from 10-50 Angstroms.
Claim 13
Independent Claim
84 words
A method of making a printed circuit board comprises the steps of: coating a cleaned substrate with a suitable ink to define a negative of the desired circuit pattern; cleaning the negative patterned substrate in a plasma comprising 60% oxygen and an inert gas; sputtering a metal catalytic to electroless plating onto the plasma cleaned substrate in a plasma comprising at least 60% oxygen and an inert gas; and electrolessly depositing a metallic coating on the substrate in accordance with the desired circuit pattern.
Claim 14
Independent Claim
84 words
A method of making a printed circuit board comprises the steps of: coating a cleaned substrate with a suitable ink to define a negative of the desired circuit pattern; cleaning the negative patterned substrate in a plasma comprising 60% oxygen and an inert gas; sputtering a metal catalytic to electroless plating onto the plasma cleaned substrate in a plasma comprising at least 60% oxygen and an inert gas; and electrolessly depositing a metallic coating on the substrate in accordance with the desired circuit pattern.
Claim 15
Dependent Claim
18 words
The method recited in claim 11 wherein the ink is a strippable ink or a thermographic printing ink.
Claim 16
Dependent Claim
32 words
The method recited in claim 11 wherein the substrate is treated prior to coating of the ink thereon so as to increase adhesion of the ink and catalytic metal to the substrate.
Claim 17
Dependent Claim
26 words
The method recited in claim 13 wherein the substrate comprises a rubber modified epoxy resin which is swelled and etched prior to coating with the ink.
Claim 18
Dependent Claim
12 words
The method recited in claim 11 wherein the inert gas is argon.
Claim 19
Dependent Claim
25 words
The method recited in claim 11 wherein both cleaning and sputtering is done in a plasma consisting essentially of 60% O 2 and 40% Ar.
Claim 20
Independent Claim
18 words
The method recited in claims 11 and 16 wherein cleaning and sputtering are accomplished without breaking the vacuum.
Claim 21
Dependent Claim
19 words
The method recited in claim 11 wherein cleaning and sputtering are done in a vacuum of about 2.5 microns.
Claim 22
Dependent Claim
14 words
The method recited in multiple claim 17 wherein the sputtered catalytic metal is copper.
Claim 23
Dependent Claim
22 words
The method recited in claim 11 including the step of stripping any exposed catalytic metal from the substrate subsequent to electroless deposition.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-10-18 | 1986-04-19 | 1986-10-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-10-18 | 1990-04-19 | 1990-10-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-10-18 | 1994-04-19 | 1994-10-19 | $7700.00 | Window Closed / Lapsed |