Abstract Laminates for printed circuit boards may comprise a metal-covered, relatively thin high temperature-resistant barrier material bonded to at least one side of a core material, the temperature resistance of the barrier layer being greater than that of the core. An example of the laminate will comprise a core material comprising an epoxy/glass laminate to which is bonded on both sides a barrier layer comprising a polyimide resin, said polyimide resin having a copper foil on the outer surface thereof. The laminates may be prepared by laying up a metal-clad high temperature-resistant barrier which has been fully cured on the core material followed by lamination of the composite at a temperature in the range of from about 150° F. to about 450° F. and a pressure in the range of from about 100 to about 1200 psi.
A laminate for use as a circuit board comprising at least one barrier material having a thickness in the range of from about 0.0005 to about 0.004 inches consisting essentially of a high temperature resistant resin selected from the group consisting of a resin based on a polyimide resin, a triazine resin, a bis-maleimide triazine resin and an epoxy resin containing a layer of a conductive metal on one surface thereof, wherein said metal is selected from the group consisting of copper, aluminum, gold and silver, and wherein said barrier material is bonded to at least one side of a core material possessing a thickness in the range of from about 0.005 to about 0.5 inches and possessing a temperature resistance that is lower than that of said barrier material and which is selected from the group consisting of a phenolic resin, an epoxy resin, an epoxy-woven glass laminate and a phenolic resin-glass laminate.
Claim 2
Dependent Claim
154 words
A laminate for use as a circuit board comprising at least one barrier material having a thickness in the range of from about 0.0005 to about 0.004 inches consisting essentially of a high temperature resistant resin selected from the group consisting of a resin based on a polyimide resin, a triazine resin, a bis-maleimide triazine resin and an epoxy resin containing a layer of a conductive metal on one surface thereof, wherein said metal is selected from the group consisting of copper, aluminum, gold and silver, and wherein said barrier material is bonded to at least one side of a core material possessing a thickness in the range of from about 0.005 to about 0.5 inches and possessing a temperature resistance that is lower than that of said barrier material and which is selected from the group consisting of a phenolic resin, an epoxy resin, an epoxy-woven glass laminate and a phenolic resin-glass laminate.