US4507845A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making field effect transistors with opposed source _and gate regions
Assignee: Northrop Grumman Space and Mission Systems Corp
•
Filing: 1983-09-12
•
Granted: 1985-04-02
•
Expires: 2003-09-12
Abstract
Abstract A field-effect transistor in which the gate and source are positioned on opposite faces of a substrate, and a method for its fabrication. In the method, a stop-etch buffer layer and an active semiconductor layer are successively formed by molecular beam epitaxy on a first face of a substrate of semi-insulating material, such as gallium arsenide. A source via hole is etched from the opposite face of the substrate, using a first etchant that does not react with the buffer layer, and extended through the buffer layer with a second etchant that does not react with the active layer. After metalization of the source via hole, electron beam lithography techniques are used to determine its location as viewed from the first face of the substrate. Then a mesa area is formed from the active layer, and drain and gate areas are defined in precise relation to the source via hole, and are metalized.
Inventors
- 👤 George W. McIver
- 👤 Kenichi Nakano
- 👤 John J. Berenz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 11:42
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/20; H10D64/23; H10D64/251; H10D64/254; H10D30/00; H10D30/80; H10D30/87; Y; Y10; Y10S; Y10S148/00; Y10S148/082; Y10S438/00; Y10S438/977
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
96 words
A method for fabricating a field-effect transistor (FET) capable of operation at extremely high frequencies, said method comprising the steps of: forming a semiconductor channel region on a first face of a substrate; forming a via hole from the opposite face of the substrate; metalizing the via hole to form an FET source; determining the location of the source from a back-scattered electron image obtained by scanning the first face of the substrate with an electron beam; forming drain areas on the channel region; and forming a gate on the channel region opposite the FET source.
Claim 2
Independent Claim
96 words
A method for fabricating a field-effect transistor (FET) capable of operation at extremely high frequencies, said method comprising the steps of: forming a semiconductor channel region on a first face of a substrate; forming a via hole from the opposite face of the substrate; metalizing the via hole to form an FET source; determining the location of the source from a back-scattered electron image obtained by scanning the first face of the substrate with an electron beam; forming drain areas on the channel region; and forming a gate on the channel region opposite the FET source.
Claim 3
Dependent Claim
82 words
A method as set forth in claim 1, wherein: said method further includes the step of forming a stop-etch buffer layer between the substrate and the channel region; and said step of forming a via hole includes a first etching step in which the etchant employed does not react with the material of the stop-etch buffer layer, and a second etching step in which the etchant employed extends the via hole through the buffer layer without reacting with the channel region material.
Claim 4
Dependent Claim
17 words
The method of claim 1, wherein said drain and gate are symmetrical with respect to said source.
Claim 5
Dependent Claim
56 words
A method as set forth in claim 2, wherein: said step of forming drain areas is preceded by a step of selectively etching the channel region to form a mesa area; and the drain areas are formed at the edges of the mesa area and the gate is formed at the center of the mesa area.
Claim 6
Dependent Claim
37 words
A method as set forth in claim 4, wherein said steps of forming the channel region and forming the stop-etch buffer layer are performed in accordance with a molecular beam epitaxy process in a single continuous sequence.
Claim 7
Independent Claim
188 words
A method for fabricating a field-effect transistor (FET) capable of operation of extremely high frequencies, said method comprising the steps of: forming on a first face of a gallium arsenide substrate a buffer layer of gallium aluminum arsenide; forming on the buffer layer an active layer of n-type gallium arsenide; forming on the opposite face of the substrate a layer of silicon nitride; selectively removing an area of the silicon nitride layer to define the position of a source via hole; etching a via hole into the substrate at the defined location; extending the via hole with an etchant capable of removing material of the buffer layer; metalizing the inner surface of the source via hole and the surrounding surface of the substrate; mounting the device on another supporting substrate; determining from a back-scattered electron image the position of the source via hole as viewed from the first face of the substrate; forming a mesa area from the active layer, enclosing the source via hole; forming drain areas in proximity to the source via hole; and forming a gate on the active layer opposite the source via hole.
Claim 8
Independent Claim
188 words
A method for fabricating a field-effect transistor (FET) capable of operation of extremely high frequencies, said method comprising the steps of: forming on a first face of a gallium arsenide substrate a buffer layer of gallium aluminum arsenide; forming on the buffer layer an active layer of n-type gallium arsenide; forming on the opposite face of the substrate a layer of silicon nitride; selectively removing an area of the silicon nitride layer to define the position of a source via hole; etching a via hole into the substrate at the defined location; extending the via hole with an etchant capable of removing material of the buffer layer; metalizing the inner surface of the source via hole and the surrounding surface of the substrate; mounting the device on another supporting substrate; determining from a back-scattered electron image the position of the source via hole as viewed from the first face of the substrate; forming a mesa area from the active layer, enclosing the source via hole; forming drain areas in proximity to the source via hole; and forming a gate on the active layer opposite the source via hole.
Claim 9
Dependent Claim
34 words
A method as set forth in claim 6, wherein: said steps of forming a mesa area, forming drain areas and forming a gate all employ electron beam lithographic processes to define the respective areas.
Claim 10
Dependent Claim
24 words
A method as set forth in claim 6, wherein: said steps of forming the buffer layer and the active layer employ molecular beam epitaxy.
Claim 11
Dependent Claim
17 words
The method of claim 6, wherein said drain and gate are symmetrical with respect to said source.
References Cited (Backward Citations)
US3663873A
Cited
US4297718A
Cited
US4015278A
Cited
US4129879A
Cited
US4325073A
Cited
US4236166A
Cited
US4249190A
Cited
US4338616A
Cited
US4416053A
Cited
US4343015A
Cited
US4467518A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-04-01 | 1988-10-01 | 1989-04-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-04-01 | 1992-10-01 | 1993-04-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-04-01 | 1996-10-01 | 1997-04-02 | $7700.00 | Window Closed / Lapsed |